会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明申请
    • Mask-Shift-Aware RC Extraction for Double Patterning Design
    • 双面图案设计的Mask-Shift-Aware RC提取
    • US20120054696A1
    • 2012-03-01
    • US13167905
    • 2011-06-24
    • Ke-Ying SuChung-Hsing WangJui-Feng KuanHsiao-Shu ChaoYi-Kan Cheng
    • Ke-Ying SuChung-Hsing WangJui-Feng KuanHsiao-Shu ChaoYi-Kan Cheng
    • G06F17/50
    • G06F17/5081G03F1/70G03F7/70433G03F7/70466G06F17/5036
    • A method includes providing a layout of an integrated circuit design, and generating a plurality of double patterning decompositions from the layout, with each of the plurality of double patterning decompositions including patterns separated to a first mask and a second mask of a double patterning mask set. A maximum shift between the first and the second masks is determined, wherein the maximum shift is a maximum expected mask shift in a manufacturing process for implementing the layout on a wafer. For each of the plurality of double patterning decompositions, a worst-case performance value is simulated using mask shifts within a range defined by the maximum shift. The step of simulating the worst-case performance includes calculating capacitance values corresponding to mask shifts, and the capacitance values are calculated using a high-order equation or a piecewise equation.
    • 一种方法包括提供集成电路设计的布局,以及从布局生成多个双重图案化分解,多个双重图案化分解中的每一个包括分离到第一掩模的图案和双图案掩模组的第二掩模 。 确定第一和第二掩模之间的最大偏移,其中最大偏移是用于在晶片上实现布局的制造过程中的最大预期掩模移位。 对于多个双重图案化分解中的每一个,使用由最大偏移限定的范围内的掩模移位来模拟最坏情况的性能值。 模拟最坏情况性能的步骤包括计算与掩模移位相对应的电容值,并且使用高阶方程或分段方程计算电容值。
    • 7. 发明授权
    • Mask-shift-aware RC extraction for double patterning design
    • 面罩移位感知RC提取双图案设计
    • US08252489B2
    • 2012-08-28
    • US13167905
    • 2011-06-24
    • Ke-Ying SuChung-Hsing WangJui-Feng KuanHsiao-Shu ChaoYi-Kan Cheng
    • Ke-Ying SuChung-Hsing WangJui-Feng KuanHsiao-Shu ChaoYi-Kan Cheng
    • G03F9/00G06F17/50
    • G06F17/5081G03F1/70G03F7/70433G03F7/70466G06F17/5036
    • A method includes providing a layout of an integrated circuit design, and generating a plurality of double patterning decompositions from the layout, with each of the plurality of double patterning decompositions including patterns separated to a first mask and a second mask of a double patterning mask set. A maximum shift between the first and the second masks is determined, wherein the maximum shift is a maximum expected mask shift in a manufacturing process for implementing the layout on a wafer. For each of the plurality of double patterning decompositions, a worst-case performance value is simulated using mask shifts within a range defined by the maximum shift. The step of simulating the worst-case performance includes calculating capacitance values corresponding to mask shifts, and the capacitance values are calculated using a high-order equation or a piecewise equation.
    • 一种方法包括提供集成电路设计的布局,以及从布局生成多个双重图案化分解,多个双重图案化分解中的每一个包括分离到第一掩模的图案和双图案掩模组的第二掩模 。 确定第一和第二掩模之间的最大偏移,其中最大偏移是用于在晶片上实现布局的制造过程中的最大预期掩模移位。 对于多个双重图案化分解中的每一个,使用由最大偏移限定的范围内的掩模移位来模拟最坏情况的性能值。 模拟最坏情况性能的步骤包括计算与掩模移位相对应的电容值,并且使用高阶方程或分段方程计算电容值。
    • 8. 发明授权
    • Semiconductor device design method, system and computer-readable medium
    • 半导体器件设计方法,系统和计算机可读介质
    • US08707245B2
    • 2014-04-22
    • US13406108
    • 2012-02-27
    • Ching-Shun YangZe-Ming WuHsiao-Shu ChaoYi-Kan Cheng
    • Ching-Shun YangZe-Ming WuHsiao-Shu ChaoYi-Kan Cheng
    • G06F17/50G06F11/22
    • G06F17/5081G03F7/00G06F17/5036G06F2217/82
    • In a semiconductor device design method performed by at least one processor, first and second electrical components are extracted from a layout of a semiconductor device. The semiconductor device has a semiconductor substrate and the first and second electrical components in the semiconductor substrate. Parasitic parameters of a coupling in the semiconductor substrate between the first and second electrical components are extracted using a first tool. Intrinsic parameters of the first and second electrical components are extracted using a second tool different from the first tool. The extracted parasitic parameters and intrinsic parameters are combined into a model of the semiconductor device. The parasitic parameters of the coupling are extracted based on a model of the coupling included in the second tool.
    • 在由至少一个处理器执行的半导体器件设计方法中,从半导体器件的布局中提取第一和第二电子部件。 半导体器件具有半导体衬底和半导体衬底中的第一和第二电子部件。 使用第一工具提取第一和第二电气部件之间的半导体衬底中的耦合的寄生参数。 使用与第一工具不同的第二工具提取第一和第二电气部件的固有参数。 提取的寄生参数和固有参数被组合成半导体器件的模型。 基于包括在第二工具中的耦合模型,提取耦合的寄生参数。
    • 9. 发明授权
    • Discrete device modeling
    • 离散设备建模
    • US08694938B2
    • 2014-04-08
    • US13534526
    • 2012-06-27
    • Ching-Shun YangChih Ming YangWei-Yi HuYi-Kan Cheng
    • Ching-Shun YangChih Ming YangWei-Yi HuYi-Kan Cheng
    • G06F17/50
    • G06F17/5036
    • Among other things, one or more techniques and/or systems are provided for modeling a discrete device as a macro device. That is, the discrete device can comprise one or more parasitic elements, such as parasitic resistances and/or capacitances. Because values of the parasitic elements are unknown during pre-simulation of the discrete device, the discrete device can be modeled as a macro device, which can be used during pre-simulation to take into account the parasitic elements. For example, specified parameters, such as channel length, can be used to obtain a set of RC values that specify predicted values for the one or more parasitic elements of the discrete device. The discrete device can be modeled as the macro device using the set of RC values. In this way, the macro device can be used during pre-simulation to take into account the parasitic effects of parasitic elements of the discrete device.
    • 除其他之外,提供一个或多个技术和/或系统用于将分立设备建模为宏设备。 也就是说,分立器件可以包括一个或多个寄生元件,例如寄生电阻和/或电容。 由于寄生元件的值在分立器件的预仿真期间是未知的,所以可将分立器件建模为宏器件,可在预仿真期间使用以考虑寄生元件。 例如,可以使用诸如通道长度的指定参数来获得指定离散器件的一个或多个寄生元件的预测值的一组RC值。 可以使用一组RC值将离散器件建模为宏器件。 以这种方式,可以在预仿真期间使用宏器件来考虑分立器件的寄生元件的寄生效应。
    • 10. 发明申请
    • DISCRETE DEVICE MODELING
    • 离散装置建模
    • US20140007028A1
    • 2014-01-02
    • US13534526
    • 2012-06-27
    • Ching-Shun YangChih Ming YangWei-Yi HuYi-Kan Cheng
    • Ching-Shun YangChih Ming YangWei-Yi HuYi-Kan Cheng
    • G06F17/50
    • G06F17/5036
    • Among other things, one or more techniques and/or systems are provided for modeling a discrete device as a macro device. That is, the discrete device can comprise one or more parasitic elements, such as parasitic resistances and/or capacitances. Because values of the parasitic elements are unknown during pre-simulation of the discrete device, the discrete device can be modeled as a macro device, which can be used during pre-simulation to take into account the parasitic elements. For example, specified parameters, such as channel length, can be used to obtain a set of RC values that specify predicted values for the one or more parasitic elements of the discrete device. The discrete device can be modeled as the macro device using the set of RC values. In this way, the macro device can be used during pre-simulation to take into account the parasitic effects of parasitic elements of the discrete device.
    • 除其他之外,提供一个或多个技术和/或系统用于将分立设备建模为宏设备。 也就是说,分立器件可以包括一个或多个寄生元件,例如寄生电阻和/或电容。 由于寄生元件的值在分立器件的预仿真期间是未知的,所以可将分立器件建模为宏器件,可在预仿真期间使用以考虑寄生元件。 例如,可以使用诸如通道长度的指定参数来获得指定离散器件的一个或多个寄生元件的预测值的一组RC值。 可以使用一组RC值将离散器件建模为宏器件。 以这种方式,可以在预仿真期间使用宏器件来考虑分立器件的寄生元件的寄生效应。