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    • 4. 发明申请
    • Mask-Shift-Aware RC Extraction for Double Patterning Design
    • 双面图案设计的Mask-Shift-Aware RC提取
    • US20120054696A1
    • 2012-03-01
    • US13167905
    • 2011-06-24
    • Ke-Ying SuChung-Hsing WangJui-Feng KuanHsiao-Shu ChaoYi-Kan Cheng
    • Ke-Ying SuChung-Hsing WangJui-Feng KuanHsiao-Shu ChaoYi-Kan Cheng
    • G06F17/50
    • G06F17/5081G03F1/70G03F7/70433G03F7/70466G06F17/5036
    • A method includes providing a layout of an integrated circuit design, and generating a plurality of double patterning decompositions from the layout, with each of the plurality of double patterning decompositions including patterns separated to a first mask and a second mask of a double patterning mask set. A maximum shift between the first and the second masks is determined, wherein the maximum shift is a maximum expected mask shift in a manufacturing process for implementing the layout on a wafer. For each of the plurality of double patterning decompositions, a worst-case performance value is simulated using mask shifts within a range defined by the maximum shift. The step of simulating the worst-case performance includes calculating capacitance values corresponding to mask shifts, and the capacitance values are calculated using a high-order equation or a piecewise equation.
    • 一种方法包括提供集成电路设计的布局,以及从布局生成多个双重图案化分解,多个双重图案化分解中的每一个包括分离到第一掩模的图案和双图案掩模组的第二掩模 。 确定第一和第二掩模之间的最大偏移,其中最大偏移是用于在晶片上实现布局的制造过程中的最大预期掩模移位。 对于多个双重图案化分解中的每一个,使用由最大偏移限定的范围内的掩模移位来模拟最坏情况的性能值。 模拟最坏情况性能的步骤包括计算与掩模移位相对应的电容值,并且使用高阶方程或分段方程计算电容值。
    • 5. 发明授权
    • Mask-shift-aware RC extraction for double patterning design
    • 面罩移位感知RC提取双图案设计
    • US08252489B2
    • 2012-08-28
    • US13167905
    • 2011-06-24
    • Ke-Ying SuChung-Hsing WangJui-Feng KuanHsiao-Shu ChaoYi-Kan Cheng
    • Ke-Ying SuChung-Hsing WangJui-Feng KuanHsiao-Shu ChaoYi-Kan Cheng
    • G03F9/00G06F17/50
    • G06F17/5081G03F1/70G03F7/70433G03F7/70466G06F17/5036
    • A method includes providing a layout of an integrated circuit design, and generating a plurality of double patterning decompositions from the layout, with each of the plurality of double patterning decompositions including patterns separated to a first mask and a second mask of a double patterning mask set. A maximum shift between the first and the second masks is determined, wherein the maximum shift is a maximum expected mask shift in a manufacturing process for implementing the layout on a wafer. For each of the plurality of double patterning decompositions, a worst-case performance value is simulated using mask shifts within a range defined by the maximum shift. The step of simulating the worst-case performance includes calculating capacitance values corresponding to mask shifts, and the capacitance values are calculated using a high-order equation or a piecewise equation.
    • 一种方法包括提供集成电路设计的布局,以及从布局生成多个双重图案化分解,多个双重图案化分解中的每一个包括分离到第一掩模的图案和双图案掩模组的第二掩模 。 确定第一和第二掩模之间的最大偏移,其中最大偏移是用于在晶片上实现布局的制造过程中的最大预期掩模移位。 对于多个双重图案化分解中的每一个,使用由最大偏移限定的范围内的掩模移位来模拟最坏情况的性能值。 模拟最坏情况性能的步骤包括计算与掩模移位相对应的电容值,并且使用高阶方程或分段方程计算电容值。
    • 7. 发明申请
    • Method of Generating RC Technology File
    • 生成RC技术文件的方法
    • US20120226479A1
    • 2012-09-06
    • US13039730
    • 2011-03-03
    • Ke-Ying SuHsiao-Shu ChaoYi-Kan ChengYung-Chin Hou
    • Ke-Ying SuHsiao-Shu ChaoYi-Kan ChengYung-Chin Hou
    • G06F17/50
    • G06F17/5077G06F17/5081
    • A method of generating resistance-capacitance (RC) technology files is disclosed. The method comprises receiving a plurality of metal schemes from an IC foundry and dividing the plurality of metal schemes into one or more modular RC groups. The method further comprises identifying a modular RC structure; calculating capacitance values of the modular RC structure by means of a field solver; calculating an equivalent dielectric constant and an equivalent height of the RC structure based upon a variety of interconnect layers not having interconnects; calculating an equivalent dielectric constant and an equivalent height for each of the plurality of metal schemes; and deriving capacitance values of each of the plurality of metal schemes from the capacitance values of the modular RC structure.
    • 公开了一种产生电阻 - 电容(RC)技术文件的方法。 该方法包括从IC铸造接收多个金属方案并将多个金属方案分成一个或多个模块化RC组。 该方法还包括识别模块化RC结构; 通过场解算器计算模块RC结构的电容值; 基于不具有互连的各种互连层计算RC结构的等效介电常数和等效高度; 计算所述多个金属方案中的每一种的等效介电常数和等效高度; 以及从所述模块化RC结构的电容值导出所述多个金属方案中的每一个的电容值。
    • 8. 发明申请
    • RC Corner Solutions for Double Patterning Technology
    • 用于双重图案化技术的RC角解决方案
    • US20130275927A1
    • 2013-10-17
    • US13479076
    • 2012-05-23
    • Ke-Ying SuHsiao-Shu ChaoYi-Kan Cheng
    • Ke-Ying SuHsiao-Shu ChaoYi-Kan Cheng
    • G06F17/50
    • G06F17/5068
    • A method includes determining model parameters for forming an integrated circuit, and generating a techfile using the model parameters. The techfile includes at least two of a C_worst table, a C_best table, and a C_nominal table. The C_worst table stores greatest parasitic capacitances between layout patterns of the integrated circuit when lithography masks comprising the layout patterns shift relative to each other. The C_best table stores smallest parasitic capacitances between the layout patterns when the lithography masks shift relative to each other. The C_nominal table stores nominal parasitic capacitances between the layout patterns when the lithography masks do not shift relative to each other. The techfile is embodied on a tangible non-transitory storage medium.
    • 一种方法包括确定用于形成集成电路的模型参数,以及使用模型参数生成技术文件。 该技术文件包括C_worst表,C_best表和C_nominal表中的至少两个。 当包括布局图案的光刻掩模相对于彼此移动时,C_worst表存储集成电路的布局图案之间的最大寄生电容。 当光刻掩模相对于彼此移动时,C_best表存储布局图案之间的最小寄生电容。 当光刻掩模不相对于彼此移动时,C_nominal表存储布局图案之间的标称寄生电容。 该技术文件体现在有形的非暂时性存储介质上。
    • 9. 发明授权
    • Method of generating RC technology file
    • 生成RC技术文件的方法
    • US08418112B2
    • 2013-04-09
    • US13039730
    • 2011-03-03
    • Ke-Ying SuHsiao-Shu ChaoYi-Kan ChengYung-Chin Hou
    • Ke-Ying SuHsiao-Shu ChaoYi-Kan ChengYung-Chin Hou
    • G06F17/50
    • G06F17/5077G06F17/5081
    • A method of generating resistance-capacitance (RC) technology files is disclosed. The method comprises receiving a plurality of metal schemes from an IC foundry and dividing the plurality of metal schemes into one or more modular RC groups. The method further comprises identifying a modular RC structure; calculating capacitance values of the modular RC structure by means of a field solver; calculating an equivalent dielectric constant and an equivalent height of the RC structure based upon a variety of interconnect layers not having interconnects; calculating an equivalent dielectric constant and an equivalent height for each of the plurality of metal schemes; and deriving capacitance values of each of the plurality of metal schemes from the capacitance values of the modular RC structure.
    • 公开了一种产生电阻 - 电容(RC)技术文件的方法。 该方法包括从IC铸造接收多个金属方案并将多个金属方案分成一个或多个模块化RC组。 该方法还包括识别模块化RC结构; 通过场解算器计算模块RC结构的电容值; 基于不具有互连的各种互连层计算RC结构的等效介电常数和等效高度; 计算所述多个金属方案中的每一种的等效介电常数和等效高度; 以及从所述模块化RC结构的电容值导出所述多个金属方案中的每一个的电容值。