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    • 2. 发明授权
    • Multi-patterning method
    • 多图案化方法
    • US08468470B2
    • 2013-06-18
    • US13238127
    • 2011-09-21
    • Chin-Chang HsuWen-Ju YangHsiao-Shu ChaoYi-Kan Cheng
    • Chin-Chang HsuWen-Ju YangHsiao-Shu ChaoYi-Kan Cheng
    • G06F17/50
    • G03F1/70
    • A method comprises (a) receiving data representing a layout of a DPT-layer of an integrated circuit generated by a place and route tool, the layout including a plurality of polygons to be formed in the DPT-layer by a multi-patterning process; (b) receiving at least one identification of a subset of the plurality of polygons that are to be formed in the DPT-layer using the same photomask as each other; (c) constructing a graph of the subset of the plurality of polygons and any intervening polygons of the plurality of polygons, where the subset of the plurality of polygons are represented in the graph by a single node, the graph including connections connecting adjacent ones of the polygons in the graph that are positioned within a threshold distance of each other; and (d) identifying a multi-patterning conflict if any subset of the connections form an odd loop.
    • 一种方法包括(a)接收表示由位置和路线工具生成的集成电路的DPT层的布局的数据,该布局包括通过多图案化工艺在DPT层中形成的多个多边形; (b)使用彼此相同的光掩模来接收要在DPT层中形成的多个多边形的子集的至少一个标识; (c)构造所述多个多边形的子集的图形和所述多个多边形中的任何中间多边形,其中所述多个多边形的所述子集由所述图形中的单个节点表示,所述图包括连接相邻的多边形的连接 图中的多边形位于彼此的阈值距离内; 和(d)如果连接的任何子集形成奇数循环,则识别多图案化冲突。
    • 6. 发明申请
    • Method of Generating RC Technology File
    • 生成RC技术文件的方法
    • US20120226479A1
    • 2012-09-06
    • US13039730
    • 2011-03-03
    • Ke-Ying SuHsiao-Shu ChaoYi-Kan ChengYung-Chin Hou
    • Ke-Ying SuHsiao-Shu ChaoYi-Kan ChengYung-Chin Hou
    • G06F17/50
    • G06F17/5077G06F17/5081
    • A method of generating resistance-capacitance (RC) technology files is disclosed. The method comprises receiving a plurality of metal schemes from an IC foundry and dividing the plurality of metal schemes into one or more modular RC groups. The method further comprises identifying a modular RC structure; calculating capacitance values of the modular RC structure by means of a field solver; calculating an equivalent dielectric constant and an equivalent height of the RC structure based upon a variety of interconnect layers not having interconnects; calculating an equivalent dielectric constant and an equivalent height for each of the plurality of metal schemes; and deriving capacitance values of each of the plurality of metal schemes from the capacitance values of the modular RC structure.
    • 公开了一种产生电阻 - 电容(RC)技术文件的方法。 该方法包括从IC铸造接收多个金属方案并将多个金属方案分成一个或多个模块化RC组。 该方法还包括识别模块化RC结构; 通过场解算器计算模块RC结构的电容值; 基于不具有互连的各种互连层计算RC结构的等效介电常数和等效高度; 计算所述多个金属方案中的每一种的等效介电常数和等效高度; 以及从所述模块化RC结构的电容值导出所述多个金属方案中的每一个的电容值。
    • 7. 发明授权
    • Mask-shift-aware RC extraction for double patterning design
    • 面罩移位感知RC提取双图案设计
    • US08252489B2
    • 2012-08-28
    • US13167905
    • 2011-06-24
    • Ke-Ying SuChung-Hsing WangJui-Feng KuanHsiao-Shu ChaoYi-Kan Cheng
    • Ke-Ying SuChung-Hsing WangJui-Feng KuanHsiao-Shu ChaoYi-Kan Cheng
    • G03F9/00G06F17/50
    • G06F17/5081G03F1/70G03F7/70433G03F7/70466G06F17/5036
    • A method includes providing a layout of an integrated circuit design, and generating a plurality of double patterning decompositions from the layout, with each of the plurality of double patterning decompositions including patterns separated to a first mask and a second mask of a double patterning mask set. A maximum shift between the first and the second masks is determined, wherein the maximum shift is a maximum expected mask shift in a manufacturing process for implementing the layout on a wafer. For each of the plurality of double patterning decompositions, a worst-case performance value is simulated using mask shifts within a range defined by the maximum shift. The step of simulating the worst-case performance includes calculating capacitance values corresponding to mask shifts, and the capacitance values are calculated using a high-order equation or a piecewise equation.
    • 一种方法包括提供集成电路设计的布局,以及从布局生成多个双重图案化分解,多个双重图案化分解中的每一个包括分离到第一掩模的图案和双图案掩模组的第二掩模 。 确定第一和第二掩模之间的最大偏移,其中最大偏移是用于在晶片上实现布局的制造过程中的最大预期掩模移位。 对于多个双重图案化分解中的每一个,使用由最大偏移限定的范围内的掩模移位来模拟最坏情况的性能值。 模拟最坏情况性能的步骤包括计算与掩模移位相对应的电容值,并且使用高阶方程或分段方程计算电容值。
    • 8. 发明申请
    • DECOMPOSITION AND MARKING OF SEMICONDUCTOR DEVICE DESIGN LAYOUT IN DOUBLE PATTERNING LITHOGRAPHY
    • 半导体器件的分解和标记设计设计布局在双向图案中
    • US20120210279A1
    • 2012-08-16
    • US13027520
    • 2011-02-15
    • Chin-Chang HSUWen-Ju YANGHsiao-Shu CHAOYi-Kan CHENGLee-Chung LU
    • Chin-Chang HSUWen-Ju YANGHsiao-Shu CHAOYi-Kan CHENGLee-Chung LU
    • G06F17/50
    • G03F1/70G03F7/70433G03F7/70466
    • Provided is a system and method for assessing a design layout for a semiconductor device level and for determining and designating different features of the design layout to be formed by different photomasks by decomposing the design layout. The features are designated by markings that associate the various device features with the multiple photomasks upon which they will be formed and then produced on a semiconductor device level using double patterning lithography, DPL, techniques. The markings are done at the device level and are included on the electronic file provided by the design house to the photomask foundry. In addition to overlay and critical dimension considerations for the design layout being decomposed, various other device criteria, design criteria processing criteria and their interrelation are taken into account, as well as device environment and the other device layers, when determining and marking the various device features.
    • 提供了一种用于评估半导体器件级的设计布局并通过分解设计布局来确定和指定由不同光掩模形成的设计布局的不同特征的系统和方法。 这些特征由标记指定,该标记将各种器件特征与将在其上形成的多个光掩模相关联,然后使用双重图案化光刻DPL技术在半导体器件层面上产生。 标记是在设备级完成的,并被包括在由设计公司提供给光掩模铸造厂的电子文件中。 除了正在分解的设计布局的重叠和关键维度考虑之外,在确定和标记各种设备时,还考虑了各种其他设备标准,设计标准处理标准及其相关性以及设备环境和其他设备层 特征。