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1. 发明授权

US06594889B1 Method for processing leadframe 失效
标题翻译：处理引线框的方法
公开(公告)号：US06594889B1
公开(公告)日：2003-07-22
申请号：US09436315
申请日：1999-11-08
申请人： Kazuhiko Bandoh , Michio Osada , Tsuyoshi Amakawa , Yoshihiko Kojima , Fumio Takashima , Kouichi Kawamura
发明人： Kazuhiko Bandoh , Michio Osada , Tsuyoshi Amakawa , Yoshihiko Kojima , Fumio Takashima , Kouichi Kawamura
IPC分类号： H01R4300
CPC分类号： H01L21/67144 , H01L2924/0002 , Y10T29/49121 , Y10T29/5137 , Y10T29/53187 , H01L2924/00
摘要： A method of processing a leadframe involves steps of transporting a leadframe to load it into a lead processing unit including plural sets of processing presses; adjusting a press pitch of the processing presses according to a work pitch of workpieces on the leadframe by rotating a nut member that is coupled to at least one of the processing presses and engaged on a non-rotating screw shaft extending in the transport direction of the leadframe, so that the nut member moves along the screw shaft and the respective processing press coupled thereto moves with the nut member; and performing a predetermined lead processing on the leadframe using the processing presses after the step of adjusting the press pitch.
摘要翻译：一种处理引线框架的方法涉及输送引线框架以将其加载到包括多组加工印刷机的引线处理单元中的步骤; 通过旋转与至少一个处理压力机连接的螺母构件，并且在沿着输送方向的延伸方向延伸的非旋转螺杆轴上啮合，根据工件在引线框架上的工作间距来调整加工压力机的压头间距引线框架，使得螺母构件沿着螺杆轴移动，并且与其连接的相应的处理压力机与螺母构件一起移动; 以及在调整压头间距的步骤之后使用处理机按压在引线框上执行预定的引线处理。

2. 发明授权

US07738830B2 Image forming apparatus, image forming system and computer program of the same for forming cover sheet 有权
标题翻译：图像形成装置，图像形成系统和用于形成封面的计算机程序
公开(公告)号：US07738830B2
公开(公告)日：2010-06-15
申请号：US11516125
申请日：2006-09-06
申请人： Junichi Isamikawa , Michio Osada
发明人： Junichi Isamikawa , Michio Osada
IPC分类号： G03G15/00 , B42D3/00
CPC分类号： B42C11/02
摘要： There is described an image forming apparatus, which makes it possible to form a lining cover sheet image at an appropriate position of the lining cover sheet, irrespective of change of the lining cover sheet width. The apparatus includes a lining cover-sheet width acquiring section to acquire a lining cover-sheet width; a cover-sheet image data acquiring section to acquire various cover-sheet image data sets; a cover-sheet image data arranging section to arrange the front cover-sheet image data and the rear cover-sheet image data in such a manner that they are arranged at an interval of the lining cover-sheet width, and to arrange the lining cover-sheet image data in such a manner that a lining image center line coincides with a cover sheet center line, in its width direction; and an image forming section to form the total cover sheet image, based on the arranged image data.
摘要翻译：描述了一种图像形成装置，其可以在衬里覆盖片的适当位置形成衬里覆盖片图像，而与衬里覆盖片宽度的改变无关。该装置包括：衬垫覆盖层宽度获取部，用于获取衬里覆盖层宽度; 盖片图像数据获取部分，用于获取各种封面图像数据集; 覆盖片图像数据排列部，其以使得它们以衬片覆盖层宽度的间隔布置的方式布置前盖片图像数据和后盖片图像数据，并且布置衬里盖使得衬里图像中心线在其宽度方向上与覆盖片中心线重合的表格图像数据; 以及基于所排列的图像数据形成总封面图像的图像形成部。

3. 发明授权

US06919223B2 Method of manufacturing semiconductor resin molding and resin member employed therefor 有权
标题翻译：半导体树脂成型体的制造方法及其用途的树脂部件
公开(公告)号：US06919223B2
公开(公告)日：2005-07-19
申请号：US10456435
申请日：2003-06-06
申请人： Michio Osada
发明人： Michio Osada
IPC分类号： H01L21/56 , H01L23/31 , H01I21/44
CPC分类号： H01L24/97 , H01L21/561 , H01L21/563 , H01L21/566 , H01L21/568 , H01L23/3121 , H01L2224/16 , H01L2224/73203 , H01L2224/75315 , H01L2224/7598 , H01L2224/81005 , H01L2224/83104 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/181 , H01L2224/81 , H01L2924/00
摘要： A space portion is present between the upper surface of a semiconductor chip of a semiconductor chip mounted substrate fitted into a cavity (concave portion for setting) of a lower mold section and the top surface of a cavity of an upper mold section. The upper and lower mold sections are closed while a resin member having a thickness larger than the height of the space portion is inserted in the space portion. At this time, clamping force between the upper and lower mold sections is applied to the semiconductor chip through the resin member. The resin member is deformed in response to the shape of the space portion. Underfill is molded between the semiconductor chip and the substrate while the resin member adheres to both of the upper surface of the semiconductor chip and the top surface of the cavity of the upper mold section. Consequently, the underfill resin is prevented from flowing into a clearance between the upper surface of the semiconductor chip and the top surface of the cavity of the upper mold section. Thus, the upper surface of the semiconductor chip is prevented from formation of a resin molding flash.
摘要翻译：空间部分存在于嵌入到下模具部分的空腔（用于固定的凹部）中的半导体芯片安装基板的半导体芯片的上表面与上模具部分的空腔的顶表面之间。封闭上下模具部分，并且具有比空间部分的高度大的厚度的树脂部件插入到空间部分中。此时，通过树脂部件将上模和下模部之间的夹紧力施加到半导体芯片。树脂构件响应于空间部分的形状而变形。在半导体芯片和基板之间模制底填料，同时树脂构件粘附到半导体芯片的上表面和上模具部分的空腔的顶表面。因此，防止底部填充树脂流入半导体芯片的上表面和上模具部分的空腔的上表面之间的间隙。因此，防止了半导体芯片的上表面形成树脂成形闪光。

4. 发明授权

US5159666A Apparatus and a method for enlarging dot matrix data 失效
标题翻译：装置和一种用于扩展基数据的方法
公开(公告)号：US5159666A
公开(公告)日：1992-10-27
申请号：US558623
申请日：1990-07-27
申请人： Kunio Fukuda , Michio Osada , Masaki Kobayashi
发明人： Kunio Fukuda , Michio Osada , Masaki Kobayashi
IPC分类号： B41J2/485 , G06K15/00 , G09G5/391 , H04N1/393
CPC分类号： G09G5/391 , G06K15/00 , G06K2215/0057 , G06K2215/0071
摘要： In enlarging dot matrix data stored in an original memory on a work memory, it is discriminated whether or not a data write position overlaps the position of already-produced data. If no overlapping occurs, the data is written as it is in the work memory. If overlapping occurs, it is then discriminated whether or not the color of a dot in the original memory to be processed is the same as that of a dot adjacent to the target dot. If the colors are the same, data is written at positions except the overlapped portion. In other words, data already written at the overlapped position is given a priority. On the other hand, if the dots are of different colors, data at the overlapped portion is temporarily cleared and data is written at positions including the overlapped portion.
摘要翻译：在放大存储在工作存储器中的原始存储器中的点阵数据时，判断数据写入位置是否与已经产生的数据的位置重叠。如果没有发生重叠，数据将按原样写入工作存储器。如果发生重叠，则判断要处理的原始存储器中的点的颜色是否与与目标点相邻的点的颜色相同。如果颜色相同，则数据被写入除了重叠部分之外的位置。换句话说，已经写入重叠位置的数据被赋予优先级。另一方面，如果点是不同的颜色，则重叠部分的数据被暂时清除，并且数据被写入包括重叠部分的位置。

5. 发明授权

US06736703B2 Cutting apparatus and cutting method 失效
标题翻译：切割装置和切割方法
公开(公告)号：US06736703B2
公开(公告)日：2004-05-18
申请号：US10104198
申请日：2002-03-20
申请人： Michio Osada , Masataka Takehara , Makoto Matsuo
发明人： Michio Osada , Masataka Takehara , Makoto Matsuo
IPC分类号： B24B100
CPC分类号： H01L21/67092 , B23D47/045 , B23D47/08 , B28D5/023 , B28D5/024 , Y10T83/7788
摘要： A cutting blade is fixed on a shaft that rotates about its shaft center, and that is linearly advanced by an advancing movement. The shaft's center further revolves with a small radius of revolution at a rapid predetermined rate of revolution greater than the rate of advancing movement. Thus the blade is pressed against and cuts a substrate and produces chips, and the blade is intermittently disengaged from the substrate whereby the chips move in the direction in which the blade rotates to be removed from between the cutting edge of the blade and the substrate. This reduces working resistance, enhances working efficiency, and prevents the blade surface from having significant frictional heat. Furthermore, the generated frictional heat can readily dissipate and the blade can thus have a long life.
摘要翻译：切割刀片固定在绕其轴心旋转的轴上，并且通过前进运动线性前进。轴的中心进一步以比前进运动速度更快的预定转速旋转小的旋转半径。因此，叶片被压靠并切割基板并产生切屑，并且叶片间歇地从基板脱离，由此切屑沿着叶片旋转的方向移动以从叶片的切割边缘和基底之间移除。这降低了工作阻力，提高了工作效率，并且防止叶片表面产生显着的摩擦热。此外，所产生的摩擦热可以容易地消散，并且叶片因此可以具有长的使用寿命。

6. 发明授权

US06438826B2 Electronic component, method of sealing electronic component with resin, and apparatus therefor 失效
标题翻译：电子部件，用树脂密封电子部件的方法及其装置
公开(公告)号：US06438826B2
公开(公告)日：2002-08-27
申请号：US09777787
申请日：2001-02-05
申请人： Shinji Takase , Hirotaka Okamoto , Michio Osada , Kouichi Araki
发明人： Shinji Takase , Hirotaka Okamoto , Michio Osada , Kouichi Araki
IPC分类号： H05K1300
CPC分类号： H01L21/565 , H01L21/563 , H01L24/743 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01005 , H01L2924/01029 , H01L2924/181 , H01L2924/18161 , Y10T29/49124 , Y10T29/49128 , Y10T29/49171 , H01L2924/00
摘要： A resin seal apparatus includes a movable bottom die vertically moved by an elevator mechanism, a transport mechanism horizontally moving the movable bottom die having placed thereon a printed circuit board with a semiconductor chip mounted thereon, an intermediate die abutting against a periphery of the printed circuit board when the movable bottom die is moved upward, a film of resin stretched by a film stretch mechanism over the intermediate die and the printed circuit board, a die for a chip, pressing a back surface of the semiconductor chip via the film of resin, and a top die pressing a top surface of the intermediate die via the film of resin. This apparatus allows a PCB with a semiconductor chip mounted thereon in the form of a flip chip to be sealed with resin in a reduced period of time to fabricate an electronic component.
摘要翻译：树脂密封装置包括通过电梯机构垂直移动的可移动底部模具，水平移动其上安装有半导体芯片的印刷电路板上的可移动底模的运送机构，邻接印刷电路的周边的中间模具当可移动底模向上移动时，通过膜拉伸机构在中间模和印刷电路板上延伸的树脂膜，用于芯片的模具，通过树脂膜挤压半导体芯片的背表面，以及通过树脂膜压制中间模具的顶表面的顶模。该装置允许其中安装有半导体芯片的PCB以倒装芯片的形式在减少的时间周期内用树脂密封以制造电子部件。

7. 发明授权

US5603879A Method of molding resin to seal electronic parts using two evacuation steps 失效
标题翻译：使用两个抽空步骤模制树脂密封电子部件的方法
公开(公告)号：US5603879A
公开(公告)日：1997-02-18
申请号：US229232
申请日：1994-04-18
申请人： Michio Osada , Yoshihisa Kawamoto , Makoto Matsuo , Koichi Araki
发明人： Michio Osada , Yoshihisa Kawamoto , Makoto Matsuo , Koichi Araki
IPC分类号： B29C45/02 , B29C45/14 , B29C45/34 , B29L31/34 , H01L21/00 , H01L21/56 , B29C45/63
CPC分类号： H01L21/67126 , B29C45/14655 , B29C45/34 , H01L2224/48091 , H01L2224/48247 , Y10S425/228 , Y10S425/812
摘要： In a method of molding resin to seal electronic parts, an internal die space defined at least by pots, cull portions, resin passages and cavities when an upper mold section and a lower mold section are closed, is cut off or sealed from the exterior atmosphere. Thereupon the die space is evacuated using a first evacuation by a vacuum source and a second or instantaneous evacuation by an instantaneous evacuation mechanism. The vacuum source for the first evacuation may be an active vacuum pump, while the instantaneous evacuation mechanism may be a vacuum tank that has been previously pumped down, for example. According to this method, it is possible to quickly improve the degree of vacuum in the internal die space by efficiently and reliably discharging air, moisture and gas from the internal die space to the exterior due to a synergistic action of the evacuation and the instantaneous evacuation. Consequently, the formation of voids in resin molded members is prevented.
摘要翻译：在模制树脂以密封电子部件的方法中，当上模具部分和下模具部分封闭时，至少由盆，剔除部分，树脂通道和空腔限定的内部模具空间被切断或与外部大气密封。于是，使用真空源进行的第一次抽空和通过瞬时抽空机构进行的第二次或即时排空将模具空间抽真空。用于第一抽空的真空源可以是主动式真空泵，而瞬时抽空机构可以是例如先前已被泵送的真空罐。根据该方法，由于排气和瞬时排气的协同作用，能够将内部空腔内的空气，湿气和气体有效且可靠地排出到外部，从而能够快速提高内部空间的真空度。因此，防止在树脂模制件中形成空隙。

8. 发明授权

US5435953A Method of molding resin for sealing an electronic device 失效
标题翻译：树脂密封电子器件的成型方法
公开(公告)号：US5435953A
公开(公告)日：1995-07-25
申请号：US173150
申请日：1993-12-21
申请人： Michio Osada , Yoshihisa Kawamoto
发明人： Michio Osada , Yoshihisa Kawamoto
IPC分类号： B29C33/30 , B29C45/02 , B29C45/26 , B29C45/34 , B29C45/46 , H01L21/00 , B29C45/63 , B29C45/72
CPC分类号： H01L21/67126 , B29C45/02 , B29C45/34 , B29C45/462 , B29C33/306 , B29C45/2675 , H01L2224/48091 , H01L2224/48227 , H01L2924/3025
摘要： In a method for molding resin to seal an electronic part, a sealed space portion is formed between molding surfaces of an upper mold section and a lower mold section by covering an outer side periphery of a pot, a resin path and a cavity. A resin tablet is heated at its bottom portion and peripheral portion in the pot of the lower mold section to expand upwardly from its top portion. Air and moisture included inside the resin tablet is expelled into the sealed space portion which is evacuated including any air and moisture inside the sealed space portion, whereby the formation of voids in the molded resin body is avoided.
摘要翻译：在用于模制密封电子部件的树脂的方法中，通过覆盖罐，树脂路径和空腔的外侧周边，在上模具部分和下模具部分的成型表面之间形成密封空间部分。树脂片在其底部部分和下模具部分的罐的周边部分被加热，以从其顶部部分向上膨胀。包含在树脂片内的空气和水分被排出到密封空间部分中，该密封空间部分被包括在密封空间部分内的任何空气和水分都被抽空，从而避免了模制树脂体中的空隙的形成。

9. 发明申请

US20090046316A1 IMAGE FORMING SYSTEM AND IMAGE FORMING METHOD 有权
标题翻译：图像形成系统和图像形成方法
公开(公告)号：US20090046316A1
公开(公告)日：2009-02-19
申请号：US12105080
申请日：2008-04-17
申请人： Takeo Morohashi , Michio Osada , Masatsugu Kouguchi
发明人： Takeo Morohashi , Michio Osada , Masatsugu Kouguchi
IPC分类号： G06K15/00
CPC分类号： H04N1/32486 , G06F3/1212 , G06F3/1244 , G06F3/1267 , G06F3/1279 , H04N2201/0094 , H04N2201/3288
摘要： There is described an image forming system, which makes it possible to speedily implement the reprinting operation, and to alleviate the burden of the printer controller. The system includes a printer controller to parse a print job described in a Page Description Language so as to generate image data; and an image forming apparatus, configured separately from the printer controller, to implement a printing operation based on the image data. The printer controller applies a first processing to the print job so as to generate multi-value image data and transmits the multi-value image data to the image forming apparatus. The image forming apparatus applies a second processing to the multi-value image data, received from the printer controller, so as to generate processed image data, serving as printable image data based on which a reproduced image can be directly printed, and implements the printing operation based on the processed image data.
摘要翻译：描述了一种图像形成系统，其可以快速实现重印操作，并且减轻打印机控制器的负担。该系统包括打印机控制器，用于解析页面描述语言中描述的打印作业，以便生成图像数据; 以及与打印机控制器分开配置的图像形成装置，以基于图像数据实现打印操作。打印机控制器对打印作业进行第一处理，以产生多值图像数据，并将多值图像数据发送到图像形成装置。图像形成装置对从打印机控制器接收的多值图像数据应用第二处理，以便生成经处理的图像数据，作为可直接打印再现图像的可打印图像数据，并且执行打印基于处理的图像数据进行操作。

10. 发明授权

US5874324A Method of sealing electronic component with molded resin 失效
标题翻译：用模制树脂密封电子部件的方法
公开(公告)号：US5874324A
公开(公告)日：1999-02-23
申请号：US813700
申请日：1997-03-06
申请人： Michio Osada
发明人： Michio Osada
IPC分类号： B29C43/12 , B29C43/18 , B29C43/32 , B29C45/14 , B29C45/17 , B29C45/56 , H01L21/00 , H01L21/56 , H01L21/44
CPC分类号： B29C45/14655 , B29C43/12 , B29C43/18 , B29C43/32 , B29C45/174 , B29C45/561 , H01L21/565 , B29K2105/0058 , H01L2224/48091
摘要： A method of sealing an electronic component with molded resin comprises an electronic component setting step of engaging an electronic component mounted on a lead frame in mold cavities which are provided on mold surfaces of a fixed mold section and a movable mold section respectively to be opposed to each other, and a resin sealing step of charging a heated/melted resin material in the mold cavities engaged with the electronic component and sealing the electronic component received in the mold cavities and the lead frame around the same in a resin mold package corresponding to the shapes of the mold cavities. The resin sealing step is carried out by applying a prescribed resin pressure to the resin charged in the mold cavities and thereafter pressing the resin received in the mold cavities against the lead frame from the exterior.According to this method, adhesion between the resin mold package molded in the mold cavities and the lead frame is improved, whereby these members are prevented from defining a clearance therebetween and water is prevented from infiltrating from therebetween, and the quality and the reliability of the product can be improved.
摘要翻译：密封具有模制树脂的电子部件的方法包括电子部件设置步骤，将安装在引线框架上的电子部件接合在模腔中，模具腔分别设置在固定模具部分和可移动模具部分的模具表面上，以与以及树脂密封步骤，其将加热/熔融的树脂材料装入与电子部件接合的模具腔中，并将容纳在模腔中的电子部件和围绕其的引线框架封装在对应于模腔的形状。树脂密封步骤是通过对装在模腔中的树脂施加规定的树脂压力，然后将从模具腔容纳的树脂从外部按压引线框架来进行的。根据该方法，模塑在模腔中的树脂模制包装与引线框架之间的粘附性得到改善，从而防止这些构件之间形成间隙，防止水从其间渗透，并且其质量和可靠性产品可以改进。

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