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    • 1. 发明授权
    • Protective film and method for producing same
    • 保护膜及其制造方法
    • US09506143B2
    • 2016-11-29
    • US13394537
    • 2010-09-10
    • Naoto OhtakeMakoto MatsuoYoshinao Iwamoto
    • Naoto OhtakeMakoto MatsuoYoshinao Iwamoto
    • B05D3/06C23C16/04C23C16/26C23C14/04
    • The problems in accordance with the present invention are: to provide a DLC film, wherein a protective film having a segmented shape is easily formed, quality control of the protective film is improved, segmented shapes with a high degree of freedom (that are complicated) are possible, and the application of the DLC film is possible not only to two-dimensional shapes but also to three-dimensional shapes; and to provide a method for forming the DLC film. As solutions to the problems, there are provided a protective film and a method for producing the protective film, characterized by, when forming on a substrate the protective film having a segmented shape formed by depositing a film so that the film is formed divided into segments, masking the substrate using a drawing material so that segments having predetermined shapes are obtained, thereafter depositing the protective film, and then removing the masked part to form a spacing between segments.
    • 根据本发明的问题是:提供一种DLC膜,其中容易形成具有分段形状的保护膜,提高了保护膜的质量控制,高自由度(复杂)的分段形状, 是可能的,并且DLC膜的应用不仅可以是二维形状,而且也可以是三维形状; 并提供形成DLC膜的方法。 作为这些问题的解决方案,提供了保护膜和保护膜的制造方法,其特征在于,在基板上形成具有通过沉积膜形成的分段形状的保护膜,使得膜形成为分段 使用拉伸材料掩蔽基板,从而获得具有预定形状的段,然后沉积保护膜,然后除去掩模部分以在段之间形成间隔。
    • 6. 发明申请
    • Method of and apparatus for working structure
    • 工作结构的方法和装置
    • US20080121078A1
    • 2008-05-29
    • US11984768
    • 2007-11-21
    • Shinya KunimatsuHisayoshi OnishiMakoto Matsuo
    • Shinya KunimatsuHisayoshi OnishiMakoto Matsuo
    • B26D7/00
    • B24B13/046B23B1/00B23B29/125B23B2226/31B23B2265/16B23C3/00B24B1/04Y10T82/10Y10T82/25Y10T83/04Y10T83/889
    • In a method of working a structure, a mold material is mounted on a mold material mount portion of a cutting/working apparatus and rotated about the C-axis serving as the rotation center while a cutting tool is driven and moved in directions X and Y. Then, a desired position of the mold material is cut with the cutting tool at a relatively formed desired cutting speed and elliptically vibrated/cut with the cutting tool, for forming a Fresnel lens molding cavity having an opening of a desired shape and a working surface (concave surface, for example) of a desired shape. According to this method, the productivity of an optical component mold employed as the structure can be efficiently improved when the mold for molding an optical component such as a Fresnel lens is worked by cutting the mold material employed as a workpiece with the cutting tool in a four-spindle lathe-type cutting/working apparatus including X-, Y-, Z- and C-axes of rotation.
    • 在一种加工结构的方法中,将模具材料安装在切割加工设备的模具材料安装部分上,并围绕作为旋转中心的C轴旋转,同时切割工具被驱动并在X和Y方向上移动 然后,用切割工具以相对形成的所需切割速度切割模具材料的期望位置并用切割工具进行椭圆振动/切割,以形成具有期望形状的开口的菲涅尔透镜模制腔和工作 表面(例如凹面)。 根据这种方法,通过用切削工具将用作工件的模具材料切割成一边加工用于模制诸如菲涅尔透镜的光学部件的模具,可以有效地提高用作结构的光学部件模具的生产率。 包括X,Y,Z和C轴旋转的四轴车床型切割/加工设备。
    • 7. 发明授权
    • Cutting apparatus and cutting method
    • 切割装置和切割方法
    • US06736703B2
    • 2004-05-18
    • US10104198
    • 2002-03-20
    • Michio OsadaMasataka TakeharaMakoto Matsuo
    • Michio OsadaMasataka TakeharaMakoto Matsuo
    • B24B100
    • H01L21/67092B23D47/045B23D47/08B28D5/023B28D5/024Y10T83/7788
    • A cutting blade is fixed on a shaft that rotates about its shaft center, and that is linearly advanced by an advancing movement. The shaft's center further revolves with a small radius of revolution at a rapid predetermined rate of revolution greater than the rate of advancing movement. Thus the blade is pressed against and cuts a substrate and produces chips, and the blade is intermittently disengaged from the substrate whereby the chips move in the direction in which the blade rotates to be removed from between the cutting edge of the blade and the substrate. This reduces working resistance, enhances working efficiency, and prevents the blade surface from having significant frictional heat. Furthermore, the generated frictional heat can readily dissipate and the blade can thus have a long life.
    • 切割刀片固定在绕其轴心旋转的轴上,并且通过前进运动线性前进。 轴的中心进一步以比前进运动速度更快的预定转速旋转小的旋转半径。 因此,叶片被压靠并切割基板并产生切屑,并且叶片间歇地从基板脱离,由此切屑沿着叶片旋转的方向移动以从叶片的切割边缘和基底之间移除。 这降低了工作阻力,提高了工作效率,并且防止叶片表面产生显着的摩擦热。 此外,所产生的摩擦热可以容易地消散,并且叶片因此可以具有长的使用寿命。
    • 8. 发明授权
    • Latching method for preventing off-axis error
    • 用于防止离轴误差的车床方法
    • US6088903A
    • 2000-07-18
    • US281926
    • 1999-03-31
    • Makoto Matsuo
    • Makoto Matsuo
    • B23B3/16B23B13/12B23P25/00B23Q1/76B23Q11/12B23P13/02B23B1/00
    • B23Q11/121B23B13/126B23B3/167B23P25/00B23Q1/76Y10T29/49996Y10T29/5114Y10T82/10Y10T82/2597
    • To provide a lathing method and apparatus capable of realizing lathing of a bar member made of a hard cutting material and lathing a stock made of a hard cutting material by a lathe including an NC automatic lathe, although lathing of the hard cutting material is impossible in a conventional case, a round bar is rotatably held to be fed along the longitudinal direction of the round bar by a guide bush fixed on the main body side of the lathing apparatus, and the round bar is sequentially fed from the guide bush to a machining tool arranged on the main body side, thereby lathing the round bar in a cantilevered state. Alternatively, a stock is gripped by the chuck of a lathe which performs turning or a lathing device which performs any other machining in addition to the turning, and the stock is lathed while the outer surface thereof is held to prevent an off-axis error. For this purpose, at least a solid lubricant layer is formed in advance to have a predetermined thickness at a predetermined position where the stock is held to reduce friction.
    • 为了提供能够实现由硬切削材料制成的棒材的车床的车床加工方法和装置,并且通过包括NC自动车床的车床车削由硬切削材料制成的坯料,尽管硬切削材料的车床不可能 在常规的情况下,通过固定在车床装置的主体侧的导向套,可旋转地保持圆棒沿着圆棒的长度方向供给,并且将圆棒从导套依次供给到加工 工具布置在主体侧,从而使圆棒在悬臂状态下铺板。 或者,通过进行车削的车床的卡盘或除车削之外进行其他加工的车床装置夹持坯料,并且在保持其外表面以防止离轴误差的同时车库。 为此目的,在保持原料的预定位置预先形成至少具有预定厚度的固体润滑剂层以减少摩擦。
    • 10. 发明授权
    • Erasing method in nonvolatile semiconductor memory device
    • 非易失性半导体存储器件中的擦除方法
    • US5933367A
    • 1999-08-03
    • US40746
    • 1998-03-18
    • Makoto MatsuoAyumi Yokozawa
    • Makoto MatsuoAyumi Yokozawa
    • G11C16/02G11C16/14G11C16/04
    • G11C16/14
    • A control gate is loaded with a negative voltage pulse and a source region is loaded with a positive constant voltage pulse while a drain region is at a floating state. More specifically, the absolute value of the voltage applied to the control gate is increased with time for a period from the start of a memory erasing action (the application of the pulse voltage) to 2 msec and then remains constant from 2 msec to the end of the memory erasing action. As the result, a potential difference between the source region and the control gate at the start of the memory erasing action is smaller than that at the end of the memory erasing action. This prevents the tunnel oxide layer from receiving a high electric field stress at the start of the memory erasing action, thus improving the write/erase endurance.
    • 控制栅极负载负电压脉冲,并且源极区域负载有正的恒定电压脉冲,而漏极区域处于浮置状态。 更具体地说,施加到控制栅极的电压的绝对值随着时间的推移从存储器擦除动作(施加脉冲电压)开始到2毫秒的时间段增加,然后从2毫秒到最后保持恒定 的内存擦除动作。 结果,在存储器擦除动作开始时,源区域和控制栅极之间的电位差小于存储器擦除动作结束时的电位差。 这可以防止隧道氧化层在存储器擦除动作开始时接收高电场应力,从而提高写入/擦除耐久性。