专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20040168787A1 Devices and methods for melting materials 失效
标题翻译：熔化材料的装置和方法
公开(公告)号：US20040168787A1
公开(公告)日：2004-09-02
申请号：US10793878
申请日：2004-03-08
申请人： Aisan Kogyo Kabushiki Kaisha
发明人： Fujio Yamada
IPC分类号： B22D017/08 , B22D025/00
CPC分类号： B29C45/72 , B22D17/007 , B22D17/28 , B22D17/30 , B29C45/462 , B29C45/53 , B29C45/63 , Y10S164/90
摘要： A molten material supply unit includes a heating cylinder. The heating cylinder may receive and heat the material in a substantially vacuum condition. A molding apparatus may include a pressurizing and charging unit in addition to the molten material supply unit. The pressurizing and charging unit is adapted to receive the melted material from the molten material supply unit and to charge the melted material into a die under pressure.
摘要翻译：熔融材料供给单元包括加热缸。加热缸可以在基本上真空条件下接收和加热材料。除了熔融材料供给单元之外，成型装置还可以包括加压和充电单元。加压和充电单元适于从熔融材料供应单元接收熔化的材料，并将熔融的材料在压力下加载到模具中。

2. 发明授权

US5904955A Encapsulation means and method 失效
标题翻译：封装手段和方法
公开(公告)号：US5904955A
公开(公告)日：1999-05-18
申请号：US924862
申请日：1997-09-05
申请人： Robert Goldstein , Nikolai Osipenko , George Hawkins
发明人： Robert Goldstein , Nikolai Osipenko , George Hawkins
IPC分类号： B29C45/14 , B29C45/46 , H01L21/56 , B01J13/02 , B05D1/36 , B05D3/02 , B05D7/00
CPC分类号： B29C45/1671 , B29C45/14655 , B29C45/462 , H01L21/565 , B29C45/02 , B29C45/1642 , H01L2224/48091 , H01L2224/48247
摘要： An electronic device in a cavity in a mold is encapsulated by a composite plastic having two materials placed, respectively, in sequential locations in a reservoir in the mold. The first material has desirable properties when in contact with the surface of the device, e.g., better adhesion. The second and different material has other desirable properties, e.g., mechanical strength, low moisture permeability, etc. The first location is first in line in a direction through the mold chambers to the cavity. The two-part encapsulant is injected into the cavity without significant turbulence so as to avoid much mixing of the two materials. This creates a boundary layer of the first material which preferentially applies a coating to the device while the second material substantially fills the bulk of the space in the mold cavity. A composite encapsulation is formed having overall superior properties.
摘要翻译：模具中空腔中的电子器件被复合塑料封装，所述复合塑料具有分别放置在模具中的储存器中的顺序位置的两种材料。当与装置的表面接触时，第一种材料具有期望的性质，例如更好的粘附性。第二种和不同的材料具有其它所需的性能，例如机械强度，低透湿性等。第一位置沿着通过模具室到空腔的方向首先在一起。将两部分密封剂注入空腔而没有明显的湍流，以避免两种材料的混合。这产生了第一材料的边界层，其优先地将涂层施加到装置上，而第二材料基本上填充模腔中的空间的大部分。形成具有总体优异性能的复合材料封装。

3. 发明授权

US5645787A Process for producing semiconductor devices using resin tablets 失效
标题翻译：使用树脂片制造半导体器件的方法
公开(公告)号：US5645787A
公开(公告)日：1997-07-08
申请号：US464386
申请日：1995-06-05
申请人： Tomohiro Taruno , Shinichi Kanai , Hiroyuki Asao , Syoichi Kimura , Yoshio Toyoda
发明人： Tomohiro Taruno , Shinichi Kanai , Hiroyuki Asao , Syoichi Kimura , Yoshio Toyoda
IPC分类号： B29B9/10 , B29B11/14 , B29B13/02 , B29C35/16 , B29C43/00 , B29C43/08 , B29C43/34 , B29C45/46 , B29C47/00 , H01L21/00 , H01L21/56 , H01L23/29 , B29C45/02 , B29C45/14
CPC分类号： B29B9/10 , B29B11/14 , B29B13/022 , B29C43/003 , B29C43/08 , B29C43/34 , B29C45/462 , H01L21/56 , H01L23/295 , B29C2043/3689 , B29C35/16 , B29C43/00 , B29C47/00 , B29C47/0011 , B29C47/0019 , B29C47/0021 , B29C47/0038 , B29C47/004 , B29K2063/00 , B29K2105/0067 , B29K2105/065 , B29K2105/251 , B29K2105/255 , H01L2924/0002
摘要： A resin tablet for sealing by transfer molding a semiconductor, which is obtained by cooling and solidifying a molten resin composition, is disclosed. The tablet has a compressibility of not less than 98% and a metallic impurity content of less than 50 ppm, preferably with the amount of fine powders of 250 mesh or smaller adhered thereto being controlled below 0.05% by weight based on the tablet and a water content being controlled below 0.1% by weight.
摘要翻译：公开了一种用于通过冷却和固化熔融树脂组合物获得的半导体传递模塑来密封的树脂片。片剂的压缩率不小于98％，金属杂质含量小于50ppm，优选粘附在其上的250目或更小的细粉末的量被控制在基于片剂和水的0.05重量％以下含量控制在0.1重量％以下。

4. 发明授权

US4443175A Apparatus and method for runnerless transfer molding of thermoset compounds 失效
标题翻译：热固性化合物的无转移成型的装置和方法
公开(公告)号：US4443175A
公开(公告)日：1984-04-17
申请号：US439420
申请日：1982-11-05
申请人： Robert H. Rose , Allen J. Rose
发明人： Robert H. Rose , Allen J. Rose
IPC分类号： B29C45/18 , B29C45/38 , B29C45/46 , B29C45/53 , B29C45/58 , B29F1/04 , B29F1/08
CPC分类号： B29C45/38 , B29C45/1808 , B29C45/462 , B29C45/53 , B29C45/586 , B29C2045/588
摘要： There is described, apparatus and method for runnerless transfer molding of thermoset compounds, comprising feeding plasticized compound directly into dies through gates and nozzles by means provided to transfer plasticized compound extrudate into a cylinder to be forced by a ram directly into the dies through nozzles and gates, and wherein cured compound in the cylinder may be readily withdrawn from said cylinder by withdrawal of the ram from said cylinder, and cured sprue of compound removed from said ram.
摘要翻译：已经描述了用于热固性化合物的无轮传递模塑的装置和方法，包括通过将塑化的化合物挤出物转移到圆筒中以将塑化的化合物直接进入模具，通过浇口和喷嘴将塑化的化合物挤出物直接通过喷嘴直接压入模具中，并且其中气缸中的固化化合物可以通过从所述气缸中取出冲头而容易地从所述气缸中取出，以及从所述压头移除的固化的浇口。

5. 发明授权

US3870444A Plant for producing wax patterns for use in investment casting 失效
标题翻译：用于生产用于投资铸造的WAX模式的工厂
公开(公告)号：US3870444A
公开(公告)日：1975-03-11
申请号：US32167673
申请日：1973-01-08
申请人： BRITISH LEYLAND UK LTD
发明人： HERRON MALACHY
IPC分类号： B29C45/46 , B29C67/24 , B29C24/00 , B22C7/02
CPC分类号： B29C45/462 , B29C67/241
摘要： Wax patterns for use in an automatic flow-production investment casting plant are produced, in an extrusion-press die, by filling the die from a substantially cylindrical wax billet obtained by severance from a continuous extrusion of plastic wax issuing from a tube which is subjected to controlled heating, whereby the boundary layer of wax in the tube is melted to leave a solid core of wax affording a billet which has a smooth surface and is of the same diameter as the die opening.
摘要翻译：在挤出压模中生产用于自动流动生产熔模铸造装置的蜡图案，通过从经受管的管的塑料蜡的连续挤出中取出的基本上圆柱形的蜡坯填充模具以控制加热，由此管中的蜡的边界层熔化以留下提供具有光滑表面并且具有与模具开口相同直径的坯料的蜡的固体芯。

6. 发明授权

US3477101A Apparatus for shaping raw rubber bodies 失效
标题翻译：用于形成原始橡胶体的装置
公开(公告)号：US3477101A
公开(公告)日：1969-11-11
申请号：US3477101D
申请日：1966-02-21
申请人： WERNER & PFLEIDERER
发明人： FRITSCH RUDOLF PAUL
IPC分类号： B29B11/06 , B29C45/37 , B29C45/46 , B29C45/56 , B29C47/36 , B29H3/00
CPC分类号： B29C45/462 , B29B11/06 , B29C45/376 , B29C45/56 , B29C47/0009 , B29C47/36 , B29K2105/255

7. 发明授权

US09505155B2 Injection molding apparatus 有权
标题翻译：注塑设备
公开(公告)号：US09505155B2
公开(公告)日：2016-11-29
申请号：US14344725
申请日：2011-10-04
申请人： Toshiomi Sato
发明人： Toshiomi Sato
IPC分类号： B29C45/02 , B29C45/18 , B29C45/46 , B29C45/53 , B29C45/03 , B29C45/74
CPC分类号： B29C45/1808 , B29C45/03 , B29C45/462 , B29C45/531 , B29C45/74
摘要： A small sized injection molding machine by which a molded product can be produced with a desired level of precision with simple control. An injection molding machine with: a longitudinal injection cylinder to which stick-shaped molding materials are sequentially supplied in line from the upper side, the lower end of which is formed into a nozzle shape, and the lower side of which is constituted by a material having a good heat retaining property; a heater which heats the lower portion of the injection cylinder; and a pressing shaft which presses the stick-shaped molding materials downward. When the stick shaped-molding material located at the uppermost side is pressed by the pressing shaft, the molding material located at the lowermost side which has already been completely melted, is injected into a cavity, and the heat from the heater is transmitted to the die side through a nozzle touch portion.
摘要翻译：一种小尺寸的注塑机，通过该小型注塑机可以通过简单的控制以所需的精度制造模制产品。一种注射成型机，具有：纵向注射筒，从上侧依次供给棒状成型材料，其下端形成为喷嘴形状，其下侧由材料构成具有良好的保温性能; 加热器，其加热注射缸的下部; 以及将棒状成型材料向下方挤压的按压轴。当位于最上侧的棒形成型材料被按压轴按压时，位于已经完全熔化的最下侧的成型材料被注入空腔中，并且来自加热器的热量被传递到通过喷嘴接触部分模头。

8. 发明授权

US08425826B2 Method and device for controllable encapsulation of electronic components 有权
标题翻译：电子元件可控封装的方法和装置
公开(公告)号：US08425826B2
公开(公告)日：2013-04-23
申请号：US11629345
申请日：2005-06-09
申请人： Johannes Lambertus Gerarus Maria Venrooij
发明人： Johannes Lambertus Gerarus Maria Venrooij
IPC分类号： B29C45/14
CPC分类号： B29C45/02 , B29C45/14655 , B29C45/462 , B29C45/73 , B29C2033/023 , B29C2045/7343
摘要： The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) heating encapsulating material, B) displacing the encapsulating material to a mold cavity, C) filling the mold cavity, and D) curing the encapsulating material in the mold cavity. The temperature regulation of the encapsulating material takes place during separate sections of the path covered by the encapsulating material by creating different temperature zones at least partially separated from each other thermally by means of at least one temperature carrier. The invention also relates to a device for encapsulating electronic components mounted on a carrier.
摘要翻译：本发明涉及一种用于封装安装在载体上的电子部件的方法，包括以下处理步骤：A）加热封装材料，B）将封装材料移位到模腔，C）填充模腔，以及D）固化封装材料在模腔中。封装材料的温度调节是通过由至少一个温度载体通过产生至少部分地彼此热分离的不同温度区而在由封装材料覆盖的路径的分开部分期间进行的。本发明还涉及一种用于封装安装在载体上的电子部件的装置。

9. 发明授权

US07284592B2 Devices and methods for melting materials 失效
标题翻译：熔化材料的装置和方法
公开(公告)号：US07284592B2
公开(公告)日：2007-10-23
申请号：US10793878
申请日：2004-03-08
申请人： Fujio Yamada
发明人： Fujio Yamada
IPC分类号： B22D17/08
CPC分类号： B29C45/72 , B22D17/007 , B22D17/28 , B22D17/30 , B29C45/462 , B29C45/53 , B29C45/63 , Y10S164/90
摘要： A molten material supply unit includes a heating cylinder. The heating cylinder may receive and heat the material in a substantially vacuum condition. A molding apparatus may include a pressurizing and charging unit in addition to the molten material supply unit. The pressurizing and charging unit is adapted to receive the melted material from the molten material supply unit and to charge the melted material into a die under pressure.
摘要翻译：熔融材料供给单元包括加热缸。加热缸可以在基本上真空条件下接收和加热材料。除了熔融材料供给单元之外，成型装置还可以包括加压和充电单元。加压和充电单元适于从熔融材料供应单元接收熔化的材料，并将熔融的材料在压力下加载到模具中。

10. 发明申请

US20030213215A1 Tablet detecting system for molding tablet supplying apparatus 有权
标题翻译：用于成型片剂供应装置的片剂检测系统
公开(公告)号：US20030213215A1
公开(公告)日：2003-11-20
申请号：US10407842
申请日：2003-04-04
申请人： Samsung Electronics Co.
发明人： Kyoung-Rae Cho , Kyung-Soo Park , Ju-Hwan Choi
IPC分类号： B65B057/10
CPC分类号： B29C45/768 , B29C45/02 , B29C45/462 , B29C2945/761 , B29C2945/76167 , B29C2945/76331 , B29C2945/76832 , Y10S53/90
摘要： A tablet detecting system ascertains whether a tablet exists in a receiving hole of a loader unit used for a molding tablet supplying apparatus or, if exists, whether the tablet has a standard size, by using a mechanical contact manner. The tablet detecting system has a push rod, a contact head, an insulation plate, a conductive assembly and a control unit. The push rod is inserted into the receiving hole and moves upward just as high as the tablet. The contact head is formed on a top of the push rod and the insulation plate is located over the contact head. The conductive assembly is formed in the insulation plate and the control unit is electrically connected to the conductive assembly. When the tablet in the receiving hole has a standard size, the contact head mechanically touches the conductive assembly and gives electrical connection to the conductive assembly, and the control unit senses the electrical connection. The conductive assembly may be a pair of conductive pads formed separately on a bottom surface of the insulation plate, or a pair of plungers inserted into a pair of cylindrical bodies each formed in the insulation plate and spaced apart from each other.
摘要翻译：片剂检测系统确定片剂是否存在于用于成型片剂供应装置的装载器单元的接收孔中，或者如果存在，则通过机械接触方式确定片剂是否具有标准尺寸。片剂检测系统具有推杆，接触头，绝缘板，导电组件和控制单元。将推杆插入接收孔并向上移动，与片剂一样高。接触头形成在推杆的顶部上，绝缘板位于接触头的上方。导电组件形成在绝缘板中，并且控制单元电连接到导电组件。当接收孔中的片剂具有标准尺寸时，接触头机械地接触导电组件并且与导电组件电连接，并且控制单元感测电连接。导电组件可以是分别形成在绝缘板的底表面上的一对导电焊盘，或者插入一对圆柱体中的一对柱塞，每个柱体形成在绝缘板中并彼此间隔开。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式