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1. 发明授权

US5948338A Method for encapsulating field windings of rotary electric machines 失效
标题翻译：封装旋转电机励磁绕组的方法
公开(公告)号：US5948338A
公开(公告)日：1999-09-07
申请号：US991195
申请日：1997-12-16
申请人： Francis L. George, Jr.
发明人： Francis L. George, Jr.
IPC分类号： B29C39/10 , B29C70/68 , H02K15/12 , B29C45/14 , B29C70/70
CPC分类号： B29C39/10 , B29C70/68 , H02K15/12 , B29L2031/3061 , B29L2031/749 , Y10S425/228
摘要： It is generally known that the most common reason for replacing rotary electric machines is failure of field windings. Vibrations and primary overheating of field windings is the main reason for motor and generator repair. Consequently field windings have been fan cooled, externally ventilated, and totally enclosed. To solve this failure problem stators have been completely encapsulated, drip coated, and entirely coated. But all of these procedures are subject to certain disadvantages. The method and means herein overcome such disadvantages. Means are provided for embedding in a solid material field windings of stators of rotary electric machines in order to insulate and cool electric machines in which the stators are employed.
摘要翻译：众所周知，更换旋转电机的最常见原因是励磁绕组失效。励磁绕组的振动和初级过热是电机和发电机修理的主要原因。因此，励磁绕组已经被风扇冷却，外部通风并且完全封闭。为了解决这个故障问题，定子已被完全封装，滴涂，并完全涂覆。但所有这些程序都有一定的缺点。本文的方法和手段克服了这些缺点。提供了用于嵌入旋转电机的定子的固体材料场绕组中的装置，以便绝缘和冷却使用定子的电机。

2. 发明授权

US5798070A Encapsulation method 失效
标题翻译：封装方法
公开(公告)号：US5798070A
公开(公告)日：1998-08-25
申请号：US609786
申请日：1996-03-04
申请人： Kunito Sakai , Kazuharu Oshio , Hirozoh Kanegae
发明人： Kunito Sakai , Kazuharu Oshio , Hirozoh Kanegae
IPC分类号： B29C45/14 , B29C45/26 , H01L21/00 , H01L21/56 , B29C33/24 , B29C70/70
CPC分类号： B29C45/14336 , B29C45/14418 , B29C45/14655 , B29C45/2608 , H01L21/565 , H01L2224/48247 , Y10S264/50 , Y10S425/019 , Y10S425/047 , Y10S425/228
摘要： A molding machine comprises a mold composed of lower and upper mold sections. A recess is defined in the lower mold section to receive a lead frame or other objects. The lead frame is sandwiched between the upper and lower mold sections. A mold cavity is defined in the lower mold section below the recess so as to receive a thermosetting resin or encapsulant. A gasket groove is defined adjacent to the mold cavity to receive a gasket. The gasket is subject to plastic deformation upon application of force. An oil chamber is communicated with the gasket groove and contains hydraulic oil. The hydraulic oil is pressurized to urge the gasket against the lead frame. As a result, the gasket is so deformed as to closely contact the surface of the lead frame and seal the mold cavity. The hydraulic oil is preferably mixed with thermoplastic resin in powder form.
摘要翻译：成型机包括由下模和上模组成的模具。在下模具部分中限定凹部以接收引线框架或其它物体。引线框架夹在上下模具部分之间。在凹部下方的下模具部分中限定模腔，以便容纳热固性树脂或密封剂。垫圈槽限定在模腔附近以接收垫圈。施加力时，垫片会发生塑性变形。油室与垫圈槽连通并含有液压油。液压油被加压以将垫片推向引线框架。结果，垫圈被如此变形以紧密地接触引线框架的表面并密封模腔。液压油优选与粉末状的热塑性树脂混合。

3. 发明授权

US5700001A Method of resin sealing an object with apparatus including a gas spring 失效
标题翻译：用包括气弹簧的装置对物体进行树脂密封的方法
公开(公告)号：US5700001A
公开(公告)日：1997-12-23
申请号：US407440
申请日：1995-03-20
申请人： Shunji Yamauchi
发明人： Shunji Yamauchi
IPC分类号： B29C45/02 , B29C45/14 , B29C45/26 , B29C45/77 , B29C45/78 , B29K105/20 , B29L31/34 , F16F9/00 , H01L21/56 , F16F7/00
CPC分类号： B29C45/78 , B29C45/021 , B29C45/77 , Y10S425/228
摘要： A gas spring (602) is used as a buffer device in a resin sealing apparatus for applying a compressive force to a plunger (15). In the gas spring (602), the compressive force at which a compression displacement starts is easily established as required, and the increasing degree of the compressive force with increasing compression displacement is established slowly without difficulty. Any errors in applying resin injection pressures to a plurality of plungers, due to variations in the amount of resin of tablets and in length of plungers, are absorbed in a wide range of the compression displacements thereof so that the resin injection pressures in practice are substantially equalized.
摘要翻译：在用于向柱塞（15）施加压缩力的树脂密封装置中使用气弹簧（602）作为缓冲装置。在气弹簧（602）中，根据需要容易地建立压缩位移开始的压缩力，而且随着压缩位移的增加，压缩力的增加程度缓慢地建立起来。由于片剂的树脂量和柱塞长度的变化，将树脂注射压力施加到多个柱塞上的任何错误都被吸收在其宽的压缩位移范围内，使得实际上树脂注射压力基本上是平衡

4. 发明授权

US5645776A Method of encapsulating semiconductor devices by a direct drive electro-mechanical press 失效
标题翻译：通过直接驱动机电压力机封装半导体器件的方法
公开(公告)号：US5645776A
公开(公告)日：1997-07-08
申请号：US683159
申请日：1996-07-18
申请人： Tiang Siong Lian
发明人： Tiang Siong Lian
IPC分类号： B29C45/02 , B29C45/66 , B29C45/76 , B29C45/80
CPC分类号： B29C45/66 , B29C45/02 , B29C45/7653 , B29C2037/903 , Y10S425/228
摘要： A method for encapsulating semiconductor devices includes the steps of: providing a molding system and a close-loop control system which is coupled to the molding system, the close-loop control system including a computer, a programmable logic control, a servo motor controller, and at least two drivers, wherein the servo motor controller is coupled to the computer and the programmable logic control, respectively, the servo motor controller is further coupled to the drivers, and the drivers are coupled to the molding system; clamping together at least one set of top and bottom molds of the molding system, the molding system including a clamping assembly having a clamping axis, the close-loop control system being coupled to the clamping assembly; feeding a molding compound into a cavity formed by a space between at least one set of top and bottom molds, the molding system further including a transfer assembly having a transfer axis; alternating a gear switching assembly of the molding system between a high speed mode and a high torque mode along the clamping axis, the gear switching assembly being coupled to the clamping assembly; and providing feedback from the close-loop control system to the clamping assembly and transfer assembly of the molding system to minimize disproportionate drive along the clamping and transfer axes, respectively.
摘要翻译：封装半导体器件的方法包括以下步骤：提供耦合到成型系统的成型系统和闭环控制系统，所述闭环控制系统包括计算机，可编程逻辑控制器，伺服电机控制器，以及至少两个驱动器，其中所述伺服电动机控制器分别耦合到所述计算机和所述可编程逻辑控制器，所述伺服电动机控制器进一步耦合到所述驱动器，并且所述驱动器耦合到所述模制系统; 将模制系统的至少一组顶部和底部模具夹紧在一起，所述模制系统包括具有夹持轴线的夹紧组件，所述闭环控制系统联接到所述夹紧组件; 将模制化合物进料到由至少一组顶部和底部模具之间的空间形成的空腔中，所述模制系统还包括具有转移轴线的转移组件; 沿着夹紧轴线在高速模式和高扭矩模式之间交替模制系统的齿轮切换组件，齿轮切换组件联接到夹紧组件; 并且将闭环控制系统的反馈提供给模制系统的夹紧组件和传送组件，以最小化沿着夹紧和传送轴的不相称的驱动。

5. 发明授权

US5609889A Apparatus for encapsulating electronic packages 失效
标题翻译：用于封装电子封装的装置
公开(公告)号：US5609889A
公开(公告)日：1997-03-11
申请号：US452130
申请日：1995-05-26
申请人： Patrick O. Weber
发明人： Patrick O. Weber
IPC分类号： B29C45/14 , H01L21/56 , B29C45/02
CPC分类号： H01L21/565 , B29C45/14655 , H01L2224/45144 , H01L2224/48091 , H01L2224/49109 , H01L2924/01079 , Y10S425/228
摘要： A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink attached in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process, fluid molding compound passes latitudinally under the heat sink into a cavity below the heat sink. The mold is provided with a biased plug that exerts pressure on the heat sink or printed wiring board to prevent molding compound from covering the heat sink. The biased plug also accommodates variations in the thickness of the printed wiring board.
摘要翻译：具有以通常的方式附接的散热片制备具有电触点的引脚格栅阵列，球栅阵列，平台栅格阵列等的印刷线路板。在印刷线路板或散热器中提供通道，使得在传递模塑过程中，流体模塑料在散热器的下方经过纬向放置在散热器下面的空腔中。该模具设置有偏置的塞子，其对散热器或印刷线路板施加压力，以防止模制化合物覆盖散热器。偏置的插头也适应印刷电路板厚度的变化。

6. 发明授权

US5603879A Method of molding resin to seal electronic parts using two evacuation steps 失效
标题翻译：使用两个抽空步骤模制树脂密封电子部件的方法
公开(公告)号：US5603879A
公开(公告)日：1997-02-18
申请号：US229232
申请日：1994-04-18
申请人： Michio Osada , Yoshihisa Kawamoto , Makoto Matsuo , Koichi Araki
发明人： Michio Osada , Yoshihisa Kawamoto , Makoto Matsuo , Koichi Araki
IPC分类号： B29C45/02 , B29C45/14 , B29C45/34 , B29L31/34 , H01L21/00 , H01L21/56 , B29C45/63
CPC分类号： H01L21/67126 , B29C45/14655 , B29C45/34 , H01L2224/48091 , H01L2224/48247 , Y10S425/228 , Y10S425/812
摘要： In a method of molding resin to seal electronic parts, an internal die space defined at least by pots, cull portions, resin passages and cavities when an upper mold section and a lower mold section are closed, is cut off or sealed from the exterior atmosphere. Thereupon the die space is evacuated using a first evacuation by a vacuum source and a second or instantaneous evacuation by an instantaneous evacuation mechanism. The vacuum source for the first evacuation may be an active vacuum pump, while the instantaneous evacuation mechanism may be a vacuum tank that has been previously pumped down, for example. According to this method, it is possible to quickly improve the degree of vacuum in the internal die space by efficiently and reliably discharging air, moisture and gas from the internal die space to the exterior due to a synergistic action of the evacuation and the instantaneous evacuation. Consequently, the formation of voids in resin molded members is prevented.
摘要翻译：在模制树脂以密封电子部件的方法中，当上模具部分和下模具部分封闭时，至少由盆，剔除部分，树脂通道和空腔限定的内部模具空间被切断或与外部大气密封。于是，使用真空源进行的第一次抽空和通过瞬时抽空机构进行的第二次或即时排空将模具空间抽真空。用于第一抽空的真空源可以是主动式真空泵，而瞬时抽空机构可以是例如先前已被泵送的真空罐。根据该方法，由于排气和瞬时排气的协同作用，能够将内部空腔内的空气，湿气和气体有效且可靠地排出到外部，从而能够快速提高内部空间的真空度。因此，防止在树脂模制件中形成空隙。

7. 发明授权

US5522713A Direct drive electro-mechanical press for encapsulating semiconductor devices 失效
标题翻译：用于封装半导体器件的直接驱动电机
公开(公告)号：US5522713A
公开(公告)日：1996-06-04
申请号：US473513
申请日：1995-06-07
申请人： Tiang S. Lian
发明人： Tiang S. Lian
IPC分类号： B29C45/02 , B29C45/66 , B29C45/76 , B29C45/80
CPC分类号： B29C45/66 , B29C45/02 , B29C45/7653 , B29C2037/903 , Y10S425/228
摘要： A direct drive electro-mechanical press for encapsulating semiconductor devices has at least a clamping axis and a transfer axis. The clamping axis has a planetary roller screw coupled to a tie bar platen assembly on which at least one top mold is mounted. A two-speed gearbox is further coupled to the clamping axis for switching between a high speed mode and a high torque mode along the clamping axis. The two-speed gearbox has a high speed clutch coupled to a speed reducer and a high torque clutch respectively. The transfer axis is slidably located above the clamping axis; the transfer axis has another planetary roller screw coupled to a bottom platen on which at least one bottom mold is mounted. The transfer axis transfers the molding resin from the pot into the cavities formed when the top and bottom molds are clamped together. The use of two-speed gearbox and planetary roller screw along the clamping axis and the use of planetary roller screw along the transfer axis not only reduce the number of joints or links required under prior art systems, but also permit the press to deliver superior velocities and clamping tonnage. A closed-loop control is provided to the clamping and transfer axes respectively for minimizing the disproportionate drive from the electro-mechanical press. In addition to the controllers and drives, the closed-loop control provides direct feedback on the clamping tonnage on the tie bars and transfer pressure in the mold blocks.
摘要翻译：用于封装半导体器件的直接驱动机电压机至少具有夹紧轴线和转移轴线。夹紧轴线具有联接到其上安装有至少一个顶模的连杆压板组件的行星滚子丝杠。双速变速箱进一步联接到夹紧轴线，用于沿着夹紧轴在高速模式和高扭矩模式之间切换。双速变速箱具有分别与减速器和高扭力离合器相连的高速离合器。传送轴可滑动地位于夹紧轴线上方; 传送轴具有联接到其上安装有至少一个底部模具的底部压板的另一行星滚柱螺杆。传送轴将模制树脂从罐转移到当顶部和底部模具夹在一起时形成的空腔中。沿着夹紧轴线使用双速齿轮箱和行星滚子螺杆，并且沿着传动轴线使用行星滚柱螺杆不仅减少了现有技术系统所需的接头或连杆的数量，而且允许冲压机提供优异的速度和夹紧吨位。分别为夹紧和传送轴提供闭环控制，以最小化机电压力机的不相称驱动力。除了控制器和驱动器之外，闭环控制提供对连杆上的夹紧吨位的直接反馈和模块中的传递压力。

8. 发明授权

US5520874A Compressible mold plunger 失效
标题翻译：可压缩模具柱塞
公开(公告)号：US5520874A
公开(公告)日：1996-05-28
申请号：US314997
申请日：1994-09-29
申请人： C. H. Chou , T. H. Wang , C. S. Chen , Y. C. Chen , S. P. Ko
发明人： C. H. Chou , T. H. Wang , C. S. Chen , Y. C. Chen , S. P. Ko
IPC分类号： B29C45/02 , B29C45/58
CPC分类号： B29C45/586 , B29C45/02 , Y10S425/228
摘要： A plunger (22), used in a standard mold, has a movable piston (23) and spring (24) that reduce the cull space when piston (23) is pressed downward into the cull mold compound.
摘要翻译：在标准模具中使用的柱塞（22）具有可动活塞（23）和弹簧（24），当活塞（23）被向下压入拣选模具组合件时，该活塞（23）和弹簧（24）减小了剔除空间。

9. 发明授权

US5501588A Mold for a semiconductor package 失效
标题翻译：模具用于半导体封装
公开(公告)号：US5501588A
公开(公告)日：1996-03-26
申请号：US423165
申请日：1995-04-17
申请人： Nho K. Kwak
发明人： Nho K. Kwak
IPC分类号： B29C45/26 , B29C45/02 , B29C45/14 , B29L31/34 , H01L21/56
CPC分类号： B29C45/14655 , B29C45/02 , Y10S425/228
摘要： A mold for a semiconductor package having a port for feeding resin which can be fixed either in an upper mold (1) or a bottom mold (2) corresponding to the location of the flange tip so that the operating rate of the equipment is increased to achieve high productivity.
摘要翻译：一种用于半导体封装的模具，具有用于输送树脂的端口，该端口可以固定在对应于凸缘尖端的位置的上模具（1）或底模具（2）中，使得设备的操作速率增加到实现高生产率。

10. 发明授权

US5297897A Single-strip molding apparatus 失效
标题翻译：单条成型设备
公开(公告)号：US5297897A
公开(公告)日：1994-03-29
申请号：US858979
申请日：1992-05-20
申请人： Johannes L. G. M. Venrooij , Wouter B. Verwoerd , Wilhelmus H. J. Harmsen
发明人： Johannes L. G. M. Venrooij , Wouter B. Verwoerd , Wilhelmus H. J. Harmsen
IPC分类号： B22D17/26 , B29C31/06 , B29C31/08 , B29C33/72 , B29C37/00 , B29C43/02 , B29C43/18 , B29C43/34 , B29C43/36 , B29C43/50 , B29C45/02 , B29C45/14 , B29C45/17 , B29C45/42 , B29C45/66 , B29C45/67 , B29L31/34 , B30B1/10 , B30B1/32 , B30B15/00 , B30B15/14 , H01C17/00 , H01C17/28 , H01G13/00 , H01L21/00 , B29C45/76
CPC分类号： H01L21/67126 , B29C31/066 , B29C33/72 , B29C37/0007 , B29C43/02 , B29C43/34 , B29C45/021 , B29C45/14655 , B29C45/1753 , B29C45/42 , B29C45/661 , B29C45/6707 , B30B1/103 , B30B1/323 , B30B15/0082 , B30B15/148 , B29C2043/3283 , B29C2043/3444 , B29C2043/5833 , B29C2045/662 , B29C31/08 , B29C33/20 , B29C43/32 , B29C70/72 , B29K2105/251 , Y10S425/228
摘要： An apparatus for molding electronic components. The single-strip molding apparatus has a mold die formed from two mold halves which are movable relative to each other and can be closed upon one another. A leadframe for the component to be molded is placed into a recess in one of the mold halves. Molding material is heated and forced under pressure into the recess containing the leadframe. After the component is molded the mold is opened and the upper half of the mold is cleaned by a combined cleaning-discharge unit. Upon the return stroke of the cleaning-discharge unit, the molded component is removed and the lower half of the mold is cleaned.
摘要翻译： PCT No.PCT / EP90 / 02032 Sec。 371日期：1992年5月20日 102（e）日期1992年5月20日PCT提交1990年11月23日PCT公布。出版物WO91 / 08095 日期1991年6月13日。一种用于模制电子元件的设备。单条带成型装置具有由两个半模形成的模具，它们可相对于彼此移动并且可以相互封闭。将要成型的部件的引线框架放置在其中一个半模中的凹部中。将成型材料加热并在压力下被压入含有引线框架的凹槽中。在模制成型之后，模具打开，并且模具的上半部分通过组合的清洁 - 排出单元来清洁。在清洁排放单元的返回行程时，去除模制部件并清洁模具的下半部分。

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