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    • 3. 发明授权
    • Method for the correction of the output signal of an infra red radiation multiple element sensor
    • 用于校正红外辐射多元传感器的输出信号的方法
    • US06871999B2
    • 2005-03-29
    • US10168484
    • 2000-12-22
    • Jörg SchieferdeckerKarlheinz Storck
    • Jörg SchieferdeckerKarlheinz Storck
    • G01N21/35G01J1/02G01J1/42G01J5/00G01J5/10G01J5/14G01J5/22G01N21/61G01J5/18
    • G01J5/10G01J5/14G01J5/22H01L2224/48137H01L2924/3025H01L2924/00
    • A method for the correction of the output signal of an infra red radiation multiple element sensor comprises the steps of determining and storing a parameter of a sensor element of the sensor and of generating a corrected signal of the sensor element in accordance with the stored parameter, where the storage of the parameter takes place in a memory supplied by the manufacturer and where prior to the correction being carried out, the parameter is transmitted to a correction device which is separate from the sensor. A sensor has several sensor elements (11a to 11i) which generate an output signal and a memory (14) provided on the sensor for the storage of at least one parameter of at least one sensor element. A sensor system has a sensor (20) as described earlier, a socket (31) which can be connected with the sensor for the purpose of signal transmission and a correction device (32) connected to the socket for receiving the sensor output signal and the parameters and for the generation of a corrected sensor signal.
    • 用于校正红外辐射多元素传感器的输出信号的方法包括以下步骤:确定和存储传感器的传感器元件的参数并根据所存储的参数产生传感器元件的校正信号, 其中参数的存储发生在由制造商提供的存储器中,并且在执行校正之前,将参数发送到与传感器分离的校正装置。 传感器具有产生输出信号的多个传感器元件(11a至11i)和设置在传感器上用于存储至少一个传感器元件的至少一个参数的存储器(14)。 传感器系统具有如前所述的传感器(20),可以与传感器连接以用于信号传输的插座(31)和连接到插座的用于接收传感器输出信号的校正装置(32) 参数和校正的传感器信号的产生。
    • 8. 发明授权
    • Thermopile infrared sensor array
    • 热电堆红外传感器阵列
    • US07842922B2
    • 2010-11-30
    • US11913443
    • 2006-05-16
    • Wilhelm LenekeMarion SimonMischa SchulzeKarlheinz StorckJoerg Schieferdecker
    • Wilhelm LenekeMarion SimonMischa SchulzeKarlheinz StorckJoerg Schieferdecker
    • G01J5/16G01J5/04G01J5/12
    • G01J5/06G01J5/12H01L2224/48091H01L2224/48472H01L2924/1461H01L2924/3025H04N5/2253H04N5/33H01L2924/00014H01L2924/00
    • A thermopile infrared sensor array, comprises a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components. The sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. The aim is achieved by arranging a thin membrane made from non-conducting material on the semiconductor substrate of the sensor chip on which the thermopile sensor elements are located in an array. Under each thermopile sensor element, the back side of the membrane is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier with a subsequent low-pass filter may be provided for each column and each row of sensor elements.
    • 热电堆红外传感器阵列包括具有多个热电堆传感器元件的传感器芯片,由半导体衬底和相应的电子部件制成。 传感器芯片安装在支撑电路板上,并由其中布置透镜的盖子包围。 其目的是生产具有小的芯片尺寸并且经济地制造的具有高热分辨能力的单片式红外传感器阵列。 其目的是通过在传感器芯片的半导体衬底上布置由非导电材料制成的薄膜,其中热电堆传感器元件位于阵列中。 在每个热电堆传感器元件下,通过蚀刻将膜的背面未被覆盖成蜂窝图案,并且电子部件布置在传感器芯片的边界区域中。 可以为每列和每行传感器元件提供具有随后的低通滤波器的单个前置放大器。