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    • 3. 发明授权
    • Thermopile infrared sensor array
    • 热电堆红外传感器阵列
    • US07842922B2
    • 2010-11-30
    • US11913443
    • 2006-05-16
    • Wilhelm LenekeMarion SimonMischa SchulzeKarlheinz StorckJoerg Schieferdecker
    • Wilhelm LenekeMarion SimonMischa SchulzeKarlheinz StorckJoerg Schieferdecker
    • G01J5/16G01J5/04G01J5/12
    • G01J5/06G01J5/12H01L2224/48091H01L2224/48472H01L2924/1461H01L2924/3025H04N5/2253H04N5/33H01L2924/00014H01L2924/00
    • A thermopile infrared sensor array, comprises a sensor chip with a number of thermopile sensor elements, made from a semiconductor substrate and corresponding electronic components. The sensor chip is mounted on a support circuit board and enclosed by a cap in which a lens is arranged. The aim is the production of a monolithic infrared sensor array with a high thermal resolution capacity with a small chip size and which may be economically produced. The aim is achieved by arranging a thin membrane made from non-conducting material on the semiconductor substrate of the sensor chip on which the thermopile sensor elements are located in an array. Under each thermopile sensor element, the back side of the membrane is uncovered in a honeycomb pattern by etching and the electronic components are arranged in the boundary region of the sensor chip. An individual pre-amplifier with a subsequent low-pass filter may be provided for each column and each row of sensor elements.
    • 热电堆红外传感器阵列包括具有多个热电堆传感器元件的传感器芯片,由半导体衬底和相应的电子部件制成。 传感器芯片安装在支撑电路板上,并由其中布置透镜的盖子包围。 其目的是生产具有小的芯片尺寸并且经济地制造的具有高热分辨能力的单片式红外传感器阵列。 其目的是通过在传感器芯片的半导体衬底上布置由非导电材料制成的薄膜,其中热电堆传感器元件位于阵列中。 在每个热电堆传感器元件下,通过蚀刻将膜的背面未被覆盖成蜂窝图案,并且电子部件布置在传感器芯片的边界区域中。 可以为每列和每行传感器元件提供具有随后的低通滤波器的单个前置放大器。