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    • 10. 发明授权
    • Method for forming a three-component nitride film containing metal and silicon
    • 用于形成含有金属和硅的三组分氮化物膜的方法
    • US06426117B1
    • 2002-07-30
    • US09554443
    • 2000-05-10
    • Kyoung Soo YiWon Yong KohSang Won Kang
    • Kyoung Soo YiWon Yong KohSang Won Kang
    • C23C1634
    • H01L21/76843C23C16/34C23C16/45531H01L21/28562H01L21/76846H01L2221/1078
    • A method for forming a three-component film containing metal, silicon and nitrogen for use in semiconductor devices on a substrate. The method of the present invention comprises the steps of: preparing separate reactive gases each including at least one selected from the group consisting of a gaseous metal compound, a gaseous silicon compound and an ammonia gas under conditions such that the gaseous meta compound and the ammonia gas does not form a mixture; determining a sequential gas supply cycle of the reactive gases so that supplies of the gaseous metal compound, the gaseous silicon compound and the ammonia gas are each included at least once within one gas supply cycle; and applying the reactive gases to the substrate by repeating the gas supply cycle at least once. According to the present invention, a three-component nitride film can be formed with a uniform thickness despite unevenness of a semiconductor substrate surface.
    • 一种用于形成用于半导体器件中的金属,硅和氮的三组分膜的方法。 本发明的方法包括以下步骤:制备各自包括选自气态金属化合物,气态硅化合物和氨气中的至少一种的单独的反应性气体,使得气态化合物和氨 气体不形成混合物; 确定反应气体的顺序气体供应循环,使得气体金属化合物,气态硅化合物和氨气的供应在一个气体供应循环内至少包含一次; 并且通过重复气体供应循环至少一次将反应性气体施加到基底。 根据本发明,即使半导体衬底表面的不均匀,也可以均匀地形成三组分氮化物膜。