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1. 发明授权

US5707749A Method for producing thin film multilayer wiring board 失效
标题翻译：薄膜多层布线板的制造方法
公开(公告)号：US5707749A
公开(公告)日：1998-01-13
申请号：US494974
申请日：1995-06-26
申请人： Junichi Katagiri , Akio Takahashi , Akira Nagai , Haruo Akahoshi , Kouji Fujisaki , Akio Mukoh , Fumiyuki Kobayashi
发明人： Junichi Katagiri , Akio Takahashi , Akira Nagai , Haruo Akahoshi , Kouji Fujisaki , Akio Mukoh , Fumiyuki Kobayashi
IPC分类号： B32B15/08 , H05K3/00 , H05K3/38 , H05K3/46 , B32B7/12 , B32B27/00
CPC分类号： H05K3/4655 , B32B15/08 , H05K2201/0154 , H05K2201/0195 , H05K2203/107 , H05K3/0017 , H05K3/386 , H05K3/4652 , Y10T29/49165 , Y10T428/2848 , Y10T428/31721
摘要： A thin film multilayer wiring material excellent in reliability, yield, productivity, and higher positioning accuracy includes an insulation organic film having a wiring pattern on one surface and an adhesive layer on another principal surface. The insulation organic film is a polyimide film having a heat resistance at a pyrolysis beginning temperature of 350.degree. to 550.degree. C., a dielectric constant of 3.5-2.2 and a flame retardance of V-0 or V-1 according to the UL-94 standard. The adhesive layer contains an ether bismaleimide compound.
摘要翻译：可靠性，产率，生产率和更高的定位精度优异的薄膜多层布线材料包括在一个表面上具有布线图案的绝缘有机膜和在另一个主表面上的粘合剂层。绝缘性有机膜是在热解开始温度为350〜550℃，介电常数为3.5〜2.2的耐热性，V-0或V-1的阻燃性根据UL- 94标准。粘合层含有醚双马来酰亚胺化合物。

2. 发明授权

US5352762A Multilayer printed circuit board and production thereof 失效
标题翻译：多层印刷电路板及其生产
公开(公告)号：US5352762A
公开(公告)日：1994-10-04
申请号：US676383
申请日：1991-03-28
申请人： Akira Nagai , Shin Nishimura , Masahiro Suzuki , Masao Suzuki , Junichi Katagiri , Akio Takahashi , Akio Mukoh
发明人： Akira Nagai , Shin Nishimura , Masahiro Suzuki , Masao Suzuki , Junichi Katagiri , Akio Takahashi , Akio Mukoh
IPC分类号： C08G12/32 , C08G18/30 , C08G18/38 , C08G59/40 , C08G73/06 , H01B3/30 , H01B3/44 , H01L23/12 , H05K1/03 , H05K3/46 , C08G83/00 , C08G73/12
CPC分类号： H05K3/4626 , H05K1/0346 , H05K1/034 , H05K2201/015 , Y10S428/901 , Y10T428/31504 , Y10T428/31551 , Y10T442/2213 , Y10T442/2713 , Y10T442/2738
摘要： A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.
摘要翻译：包括绝缘层的多个交替层叠层和具有6.0ns / m以下的信号传输延迟时间的电路导体层的多层印刷电路板，耐热性，粘合剂，阻燃性等优异，可以通过形成使用含氟热固性树脂组合物的绝缘层。

3. 发明授权

US5356698A Adhesive agent for substrate of electroless plating, printed circuit board using same, and method of producing same 失效
标题翻译：无电解电镀用基板用粘合剂，使用其的印刷电路板及其制造方法
公开(公告)号：US5356698A
公开(公告)日：1994-10-18
申请号：US705
申请日：1993-01-05
申请人： Mineo Kawamoto , Haruo Akahoshi , Akio Takahashi , Akio Mukoh , Kazuo Tanje , Toyofusa Yoshimura , Tokihito Suwa , Iwao Kaminaga , Toshiyuki Chida
发明人： Mineo Kawamoto , Haruo Akahoshi , Akio Takahashi , Akio Mukoh , Kazuo Tanje , Toyofusa Yoshimura , Tokihito Suwa , Iwao Kaminaga , Toshiyuki Chida
IPC分类号： C08K3/22 , H01B3/28 , H01B3/36 , H01B3/40 , H05K3/18 , H05K3/38 , B32B9/00
CPC分类号： C08K3/22 , H01B3/28 , H01B3/36 , H01B3/40 , H05K3/387 , H05K2201/0133 , H05K2201/0209 , H05K3/181 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/254 , Y10T428/2852
摘要： Adhesive agent for substrate of electroless plating characterized in comprising epoxy resin, synthetic rubber, and phenolic resin as main components, a hardener of the epoxy resin, inorganic filler having hydroxyl group, and solvent.The adhesive agent is hardened at relatively low temperature (about 150.degree. C.) in short period (within 30 minutes) without giving warp and distortion to the insulation substrate, and moreover its insulation resistance after hardening is high.The adhesive agent is preferable as an adhesive agent for a printed circuit board.
摘要翻译：化学镀基材用粘合剂，其特征在于包括环氧树脂，合成橡胶和酚醛树脂作为主要成分，环氧树脂的固化剂，具有羟基的无机填料和溶剂。粘合剂在短时间内（30分钟内）在相对较低的温度（约150℃）下硬化，而不会对绝缘基材产生翘曲和变形，此外，其硬化后的绝缘电阻高。优选粘合剂作为印刷电路板的粘合剂。

4. 发明授权

US5350886A Mounting substrate 失效
标题翻译：安装基板
公开(公告)号：US5350886A
公开(公告)日：1994-09-27
申请号：US659672
申请日：1991-02-25
申请人： Kunio Miyazaki , Yutaka Sugita , Akio Mukoh , Tadahiko Miyoshi , Osamu Miura , Akio Takahashi , Shunichi Numata , Satoru Ogihara , Kazuji Yamada , Hirokazu Inoue , Fumiyuki Kobayashi
发明人： Kunio Miyazaki , Yutaka Sugita , Akio Mukoh , Tadahiko Miyoshi , Osamu Miura , Akio Takahashi , Shunichi Numata , Satoru Ogihara , Kazuji Yamada , Hirokazu Inoue , Fumiyuki Kobayashi
IPC分类号： H01L23/538 , H05K1/03 , H05K3/46 , H05K1/00
CPC分类号： H01L23/5385 , H05K3/462 , H05K3/4629 , H01L2924/0002 , H05K1/0306 , H05K2201/0379 , H05K2203/061
摘要： An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.
摘要翻译：一种具有多层薄膜布线部分的LSI安装基板，薄膜布线部分被分成多个布线层的布线单元，各单元之间的布线通过与该单元的表面导电层的那个。

5. 发明授权

US5565536A Polymerizable compouund, process for producing same and setting composition containing polymerizable compound 失效
标题翻译：可聚合组合物，其制备方法和含可聚合化合物的组合物
公开(公告)号：US5565536A
公开(公告)日：1996-10-15
申请号：US423344
申请日：1995-04-18
申请人： Shin Nishimura , Yoshinori Kawai , Satoru Amou , Akira Nagai , Masahiro Suzuki , Akio Takahashi , Akio Mukoh
发明人： Shin Nishimura , Yoshinori Kawai , Satoru Amou , Akira Nagai , Masahiro Suzuki , Akio Takahashi , Akio Mukoh
IPC分类号： C07D207/44 , C07D207/444 , C07D207/452 , C07D207/456 , C08F12/26 , C08F22/36 , C08F22/40 , C08L33/24 , C08L35/00 , C08F122/40 , C08F114/18 , C08F128/02 , C08F130/08
CPC分类号： C07D207/452 , C07D207/444 , C07D207/456 , C08F12/26 , C08F22/40
摘要： A polymerzable compound represented by the general formula (1) X--R.sub.1 --Y where X is an unsaturated imide group having substituents R.sub.2 and R.sub.3, or an itacon imide group where R.sub.2 and R.sub.3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R.sub.1 is a divalent organic group.The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.
摘要翻译：由通式（1）X-R1-Y表示的可聚合化合物，其中X是具有取代基R 2和R 3的不饱和酰亚胺基，或其中R 2和R 3选自氢，低级烷基基团和具有取代基p的芳基，其为氢，低级烷基或烷氧基，Y为苯乙烯基，R1为二价有机基团。可聚合化合物的成形性优异，因为它们具有彼此反应性不同的官能团，因此允许固化条件进行控制，因此得到广泛的应用。固化的聚合物的热耐久性，机械性能和电气性能优异，可以实现电气设备和电子部件的更高的性能，更高的可靠性，高度紧凑和更低的重量。

6. 发明授权

US5410069A Polymerizable compound, process for producing same and setting composition containing polymerizable compound 失效
标题翻译：可聚合化合物，其制备方法和含可聚合化合物的组合物
公开(公告)号：US5410069A
公开(公告)日：1995-04-25
申请号：US986758
申请日：1992-12-08
申请人： Shin Nishimura , Yoshinori Kawai , Satoru Amou , Akira Nagai , Masahiro Suzuki , Akio Takahashi , Akio Mukoh
发明人： Shin Nishimura , Yoshinori Kawai , Satoru Amou , Akira Nagai , Masahiro Suzuki , Akio Takahashi , Akio Mukoh
IPC分类号： C07D207/44 , C07D207/444 , C07D207/452 , C07D207/456 , C08F12/26 , C08F22/36 , C08F22/40 , C08L33/24 , C08L35/00
CPC分类号： C07D207/452 , C07D207/444 , C07D207/456 , C08F12/26 , C08F22/40
摘要： A polymerzable compound represented by the general formula (1) X--R.sub.1 --Y where X is un unsaturated imide group having substituents R.sub.2 and R.sub.3, or an itacon imide group where R.sub.2 and R.sub.3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R.sub.1 is a divalent organic group.The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.
摘要翻译：由通式（1）X-R1-Y表示的可聚合化合物，其中X是具有取代基R2和R3的不饱和酰亚胺基，或其中R2和R3选自氢，低级烷基基团和具有取代基p的芳基，其为氢，低级烷基或烷氧基，Y为苯乙烯基，R1为二价有机基团。可聚合化合物的成形性优异，因为它们具有彼此反应性不同的官能团，因此允许固化条件进行控制，因此得到广泛的应用。固化的聚合物的热耐久性，机械性能和电气性能优异，可以实现电气设备和电子部件的更高的性能，更高的可靠性，高度紧凑和更低的重量。

7. 发明授权

US5538942A Method for producing a superconducting magnet coil 失效
标题翻译：超导磁体线圈的制造方法
公开(公告)号：US5538942A
公开(公告)日：1996-07-23
申请号：US375660
申请日：1995-01-20
申请人： Toru Koyama , Koo Honjo , Masao Suzuki , Akio Takahashi , Akio Mukoh , Keiji Fukushi , Seiji Numata
发明人： Toru Koyama , Koo Honjo , Masao Suzuki , Akio Takahashi , Akio Mukoh , Keiji Fukushi , Seiji Numata
IPC分类号： C08G59/18 , H01B3/30 , H01B3/40 , H01F6/00 , H01F6/06 , H01F41/00
CPC分类号： H01F6/06 , Y10S428/93 , Y10S505/705 , Y10S505/813 , Y10S505/884 , Y10S505/887 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721 , Y10T428/31725
摘要： A superconducting magnet coil is produced by winding a superconducting wire to form a coil; impregnating the coil with a curable resin composition of low viscosity which contains for example at least one epoxy resin selected from the group consisting of diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F and diglycidyl ether of bisphenol AF, all having a number-average molecular weight of 350-1,000, a flexibilizer and a curing catalyst, to obtain a curable-resin composition-impregnated coil; and heating the curable-resin-composition-impregnated coil to cure the composition.
摘要翻译：通过缠绕超导线形成线圈来制造超导磁体线圈; 用低粘度的可固化树脂组合物浸渍线圈，其包含例如至少一种选自双酚A的二缩水甘油醚，双酚F的二缩水甘油醚和双酚AF的二缩水甘油醚的环氧树脂，其全部具有数均分子量分子量为350〜1,000，增韧剂和固化催化剂，得到固化树脂组合物浸渍线圈; 并加热固化树脂组合物浸渍的线圈以固化组合物。

8. 发明授权

US5384197A Superconducting magnet coil and curable resin composition used therein 失效
标题翻译：超导磁体线圈及其中使用的可固化树脂组合物
公开(公告)号：US5384197A
公开(公告)日：1995-01-24
申请号：US171780
申请日：1993-12-22
申请人： Toru Koyama , Koo Honjo , Masao Suzuki , Akio Takahashi , Akio Mukoh , Keiji Fukushi , Seiji Numata
发明人： Toru Koyama , Koo Honjo , Masao Suzuki , Akio Takahashi , Akio Mukoh , Keiji Fukushi , Seiji Numata
IPC分类号： C08G59/18 , H01B3/30 , H01B3/40 , H01F6/00 , H01F6/06 , B32B9/00
CPC分类号： H01F6/06 , Y10S428/93 , Y10S505/705 , Y10S505/813 , Y10S505/884 , Y10S505/887 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721 , Y10T428/31725
摘要： A superconducting magnet coil contains a coil of superconducting wire and a cured product of a curable resin composition with which the coil has been impregnated, the cured product having a thermal shrinkage factor of 1.5-0.3%, preferably 1.0-0.3%, when cooled from the glass transition temperature to 4.2K, a bend-breaking strain of 2.9-3.9%, preferably 3.2-3.9%, at 4.2K and a modulus of 500-1,000 kg/mm.sup.2 at 4.2K, or undergoing a thermal stress of 0-10 kg/mm.sup.2 when cooled from the glass transition temperature to 4.2K and resisting to quench during superconducting operation. It is produced by winding a superconducting wire to form a coil; impregnating the coil with a curable resin composition of low viscosity which contains for example at least one epoxy resin selected from the group consisting of diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F and diglycidyl ether of bisphenol AF, all having a number-average molecular weight of 350-1,000, a flexibilizer and a curing catalyst, to obtain a curable-resin composition-impregnated coil; and heating the curable-resin-composition-impregnated coil to cure the composition.
摘要翻译：超导磁体线圈包含超导线圈和固化树脂组合物的固化物，线圈已被浸渍，固化产物的热收缩率为1.5-0.3％，优选为1.0-0.3％，优选为1.0-0.3％，当从玻璃化转变温度为4.2K，4.2K时的断裂应变为2.9-3.9％，优选为3.2-3.9％，4.2K时的弯曲应变为500-1,000 kg / mm2，或者经受0〜从玻璃化转变温度冷却至4.2K，并在超导操作期间耐猝熄时为10kg / mm2。通过缠绕超导线形成线圈产生; 用低粘度的可固化树脂组合物浸渍线圈，其包含例如至少一种选自双酚A的二缩水甘油醚，双酚F的二缩水甘油醚和双酚AF的二缩水甘油醚的环氧树脂，其全部具有数均分子量分子量为350〜1,000，增韧剂和固化催化剂，得到固化树脂组合物浸渍线圈; 并加热固化树脂组合物浸渍的线圈以固化组合物。

9. 发明授权

US5324767A Thermosetting resin composition for casting high-voltage coil, and molded coil and panel formed by casting and curing the composition 失效
标题翻译：用于铸造高压线圈的热固性树脂组合物，以及通过浇铸和固化组合物形成的模制线圈和板
公开(公告)号：US5324767A
公开(公告)日：1994-06-28
申请号：US887769
申请日：1992-05-22
申请人： Tohru Koyama , Hirokazu Takasaki , Hiroshi Suzuki , Shigeo Amagi , Akio Mukoh , Ikushi Kano
发明人： Tohru Koyama , Hirokazu Takasaki , Hiroshi Suzuki , Shigeo Amagi , Akio Mukoh , Ikushi Kano
IPC分类号： C08G59/24 , C08G59/00 , C08G59/20 , C08G59/42 , C08K3/34 , C08K3/36 , C08K5/00 , C08L63/00 , H01B3/00 , H01B3/40 , H01B17/60 , H01F27/32 , H02K15/12
CPC分类号： H02K15/12 , C08K3/36 , H01B3/40 , H01F27/327
摘要： A thermoplastic resin composition for casting high-voltage coils containing two kinds of fillers (A) and (B), and products as molded coils and panels obtained by casting and curing the composition.The composition of the present invention contains 60%-85% by weight, based on the total weight of the composition, of a silica type filler which is an admixture (A) a spherical silica having an average particle diameter of 0.1-0.9 .mu.m and (B) a ground silica having an average particle diameter of 3-9 .mu., the ratio A/(A+B) being 1%-7% by weight.Products as molded coils and panels prepared by using the composition have good resistance to cracking and resistance to moisture.
摘要翻译：一种用于铸造含有两种填料（A）和（B）的高压线圈的热塑性树脂组合物，以及通过浇铸和固化该组合物获得的模制线圈和面板的产品。基于组合物的总重量，本发明的组合物含有60重量％-85重量％的二氧化硅型填料，其是平均粒径为0.1-0.9μm的混合物（A）的球形二氧化硅和（B）平均粒径为3-9μm的研磨二氧化硅，A /（A + B）的比例为1〜7重量％。通过使用该组合物制备的模制线圈和面板的产品具有良好的抗开裂性和耐潮湿性。

10. 发明授权

US5322760A Nonlinear optical element 失效
标题翻译：非线性光学元件
公开(公告)号：US5322760A
公开(公告)日：1994-06-21
申请号：US800427
申请日：1991-11-29
申请人： Yuzo Itoh , Atsushi Kakuta , Akio Mukoh
发明人： Yuzo Itoh , Atsushi Kakuta , Akio Mukoh
IPC分类号： C09K9/02 , C07D487/22 , G02F1/35 , G02F1/355 , G02F1/361 , G03C1/76
CPC分类号： B82Y20/00 , C07D487/22 , G02F1/3618
摘要： A nonlinear optical element comprising a tetraazaporphyrin compound represented by the formula (I): ##STR1## This nonlinear optical element is excellent in that it is improved over low switching speed of the conventional inorganic materials and over small nonlinearity and poor chemical and physical stability and workability of the conventional organic materials.
摘要翻译：包含由式（I）表示的四氮杂卟啉化合物的非线性光学元件：优于常规无机材料的低切换速度和小的非线性以及常规有机材料的较小的化学和物理稳定性和可加工性的改进。

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