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1. 发明申请

US20120127681A1 SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MOUNTING SEMICONDUCTOR CHIP USING THE SAME 审中-公开
标题翻译：焊接连接引线，半导体封装基板及使用其安装半导体芯片的方法
公开(公告)号：US20120127681A1
公开(公告)日：2012-05-24
申请号：US13010709
申请日：2011-01-20
申请人： Ji Man RYU , Kwan Ho LEE , Kyu Bum HAN , Seog Moon CHOI , Jin Su KIM
发明人： Ji Man RYU , Kwan Ho LEE , Kyu Bum HAN , Seog Moon CHOI , Jin Su KIM
IPC分类号： H01R9/00 , H05K3/00 , H01B5/00
CPC分类号： H05K3/306 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13017 , H01L2224/1601 , H01L2224/16057 , H01L2224/16058 , H01L2224/16059 , H01L2224/1607 , H01L2224/16235 , H01L2224/16501 , H01L2224/811 , H01L2224/81193 , H01L2224/81385 , H01L2224/81447 , H01L2224/81815 , H01L2224/81899 , H01L2224/81906 , H01L2224/8192 , H01L2224/81951 , H01L2224/81986 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/351 , H05K3/3447 , H05K2201/10166 , H05K2201/10401 , Y10T29/49155 , H01L2924/00014 , H01L2924/00
摘要： Disclosed herein are a soldering connecting pin, a semiconductor package substrate and a method of mounting a semiconductor chip using the same. A semiconductor chip is mounted on the printed circuit board using the soldering connecting pin inserted into a through-hole of the printed circuit board, thereby preventing deformation of the semiconductor package substrate and fatigue failure due to external shocks.
摘要翻译：这里公开了一种焊接连接引脚，半导体封装基板和使用该半导体封装基板的半导体芯片的安装方法。使用插入印刷电路板的通孔中的焊接连接销将半导体芯片安装在印刷电路板上，从而防止半导体封装基板的变形和由于外部冲击引起的疲劳失效。

2. 发明申请

US20120121361A1 LOOSE PREVENTING ASSEMBLY 审中-公开
标题翻译：松动防止装配
公开(公告)号：US20120121361A1
公开(公告)日：2012-05-17
申请号：US13091058
申请日：2011-04-20
申请人： Kwan Ho LEE , Kyu Bum HAN , Young Ho SOHN , Seog Moon CHOI
发明人： Kwan Ho LEE , Kyu Bum HAN , Young Ho SOHN , Seog Moon CHOI
IPC分类号： F16B39/04
CPC分类号： F16B39/06 , F16B39/282
摘要： Disclosed herein is a loose preventing assembly including a bolt, a fastening member, and a pin-spring washer coupled between the bolt and the fastening member. The pin-spring washer includes a spring washer portion, a curved portion of which one end is connected to the spring washer portion to be curved upward and the other end is positioned in an inward direction of the spring washer portion, and a pin portion which extends in one direction from the other end of the curved portion tightens the bolt to couple the pin portion to an insertion groove formed in the bolt, thereby preventing the bolt and the fastening member from being loosened from each other.
摘要翻译：本文公开了一种松散防止组件，其包括螺栓，紧固构件和联接在螺栓和紧固构件之间的销弹簧垫圈。销弹簧垫圈包括弹簧垫圈部分，弯曲部分的一端连接到弹簧垫圈部分以向上弯曲，另一端位于弹簧垫圈部分的向内方向上，销部分从弯曲部分的另一端沿一个方向延伸，将螺栓拧紧以将销部分联接到形成在螺栓中的插入槽，从而防止螺栓和紧固构件彼此松动。

3. 发明申请

US20120049993A1 TRANSFORMER INTEGRATED WITH INDUCTOR 审中-公开
标题翻译：变压器与电感器集成
公开(公告)号：US20120049993A1
公开(公告)日：2012-03-01
申请号：US13219800
申请日：2011-08-29
申请人： Kyu Bum HAN , Seog Moon CHOI , Young Ho SON
发明人： Kyu Bum HAN , Seog Moon CHOI , Young Ho SON
IPC分类号： H01F27/28
CPC分类号： H01F27/38
摘要： Disclosed herein is a transformer integrated with an inductor. The transformer includes a transformer unit configured to perform voltage transformation by mutual induction between first and second cores connected opposite to each other and primary and secondary coils included in a space between the first core and the second core; and an inductor unit having a third core connected to the second core and an inductor included in a space between the second core and the third core. The transformer is fabricated by physically integrating two elements having different functions into one element, thereby simplifying the configuration of a system.
摘要翻译：本文公开了与电感器集成的变压器。变压器包括变压器单元，其被配置为通过在彼此相对连接的第一和第二芯之间的相互感应和包括在第一芯和第二芯之间的空间中的初级和次级线圈进行电压变换; 以及电感器单元，其具有连接到第二芯的第三芯和包括在第二芯和第三芯之间的空间中的电感器。通过将具有不同功能的两个元件物理地集成到一个元件中来制造变压器，从而简化了系统的配置。

4. 发明申请

US20120049788A1 CHARGE MODULE 审中-公开
标题翻译：充电模块
公开(公告)号：US20120049788A1
公开(公告)日：2012-03-01
申请号：US13018806
申请日：2011-02-01
申请人： Jong Man KIM , Seog Moon CHOI , Kyu Bum HAN
发明人： Jong Man KIM , Seog Moon CHOI , Kyu Bum HAN
IPC分类号： H02J7/00
CPC分类号： H05K7/20918
摘要： Disclosed herein is a charge module for charging a high-capacity battery.The charge module according to the exemplary embodiment of the present invention includes: a heat sink; a fan cover covering the top of the heat sink; a fan mounted on the upper center of the fan cover; and a heat pipe inserted into the side wall of the heat sink to dissipate heat from the side wall of the heat sink through the circulation of refrigerants.
摘要翻译：这里公开了一种用于对高容量电池进行充电的充电模块。根据本发明的示例性实施例的充电模块包括：散热器; 覆盖散热器顶部的风扇盖; 风扇安装在风扇罩的上部中心; 以及插入散热器的侧壁中的热管，以通过制冷剂的循环从散热器的侧壁散发热量。

5. 发明申请

US20120122278A1 Method Of Manufacturing Semiconductor Package Board 审中-公开
标题翻译：半导体封装板制造方法
公开(公告)号：US20120122278A1
公开(公告)日：2012-05-17
申请号：US13007530
申请日：2011-01-14
申请人： Kwan Ho LEE , Yong Hui Joo , Tae Hyun KIM , Seog Moon CHOI
发明人： Kwan Ho LEE , Yong Hui Joo , Tae Hyun KIM , Seog Moon CHOI
IPC分类号： H01L21/98
CPC分类号： H01L24/83 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/73 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/05001 , H01L2224/0554 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/82801 , H01L2224/83192 , H01L2224/83238 , H01L2224/83385 , H01L2224/838 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/1579 , H01L2924/351 , H05K3/3494 , H05K2201/09681 , H05K2203/1115 , H05K2203/1121 , H01L2924/00014 , H01L2924/00 , H01L2924/01083 , H01L2924/00012
摘要： Disclosed herein is a method of method of manufacturing a semiconductor package board, including: providing a substrate including a connection part formed on one side thereof, the connection part being provided thereon with a solder layer; disposing a conductive heat generator equipped with current wiring on the solder layer; applying current to the current wiring and thus heating the solder layer to attach a semiconductor chip to the connection part; and removing the current wiring from the conductive heat generator. The method is advantageous in that the semiconductor chip is attached to the substrate by applying current to the current wiring of the conductive heat generator to locally heat only the solder layer, thus reducing thermal stress and preventing the deformation of the substrate.
摘要翻译：本发明公开了一种制造半导体封装板的方法，包括：提供包括形成在其一侧上的连接部分的基板，所述连接部分设置有焊料层; 在焊料层上配置配有电流布线的导电发热体; 向当前布线施加电流，从而加热焊料层以将半导体芯片附接到连接部分; 并从导电热发生器去除当前布线。该方法的优点在于，通过向导电发热体的电流布线施加电流而将半导体芯片附接到基板，以仅局部加热焊料层，从而降低热应力并防止基板的变形。

6. 发明申请

US20120118615A1 METAL CLAD LAMINATE, METHOD OF MANUFACTURING THE SAME, AND HEAT-RADIATING SUBSTRATE 审中-公开
标题翻译：金属层压板，其制造方法和加热基板
公开(公告)号：US20120118615A1
公开(公告)日：2012-05-17
申请号：US13091016
申请日：2011-04-20
申请人： Kwan Ho LEE , Seog Moon CHOI , Tae Hyun KIM
发明人： Kwan Ho LEE , Seog Moon CHOI , Tae Hyun KIM
IPC分类号： H05K1/03 , B32B37/24 , B32B15/04 , B32B7/02 , B82Y40/00 , B82Y30/00
CPC分类号： B82Y30/00 , B32B15/08 , B32B15/14 , B32B2255/06 , B32B2255/20 , B32B2260/021 , B32B2260/046 , B32B2262/106 , B32B2264/108 , B32B2457/00 , Y10T428/2495 , Y10T428/31678
摘要： Disclosed herein is a metal clad laminate, a method of manufacturing the same and a heat-radiating substrate using the same. The metal clad laminate has increased adhesion because a layer of carbon nanoparticles is formed between bonding surfaces of upper and lower metal foils to a prepreg, and has improved heat conductive properties and mechanical properties because the prepreg has carbon fibers incorporated therein. Also, resin members having carbon nanofibers incorporated therein may be alternately stacked with metal layers, and metal layers may be inserted in the prepreg thus improving heat conductive properties, and the number of stacked layers may vary depending on the end use thereby controlling heat conductive properties and mechanical properties of the metal clad laminate.
摘要翻译：本文公开了一种金属覆层压板，其制造方法和使用其的散热基板。金属复合层压板具有增加的粘附性，因为在上金属箔和下金属箔的接合表面之间形成一层碳纳米颗粒与预浸料，并且由于预浸料坯具有掺入碳纤维，所以具有改善的导热性能和机械性能。此外，其中结合有碳纳米纤维的树脂构件可以交替地层叠有金属层，并且金属层可以插入预浸料中，从而改善导热性能，并且堆叠层的数量可以根据最终用途而变化，从而控制导热性能和金属包覆层压板的机械性能。

7. 发明申请

US20120139098A1 POWER PACKAGE MODULE 审中-公开
标题翻译：电源封装模块
公开(公告)号：US20120139098A1
公开(公告)日：2012-06-07
申请号：US13009812
申请日：2011-01-19
申请人： Kwan Ho LEE , Seog Moon CHOI
发明人： Kwan Ho LEE , Seog Moon CHOI
IPC分类号： H01L23/36
CPC分类号： H01L23/427 , H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a power package module, including: a power package mounted with a plurality of semiconductor chips; a heat radiation module coming into contact with the power package and including a first heat radiation member for discharging heat generated from the power package; and a second heat radiation member, one side of which is connected to the first heat radiation member and the other side of which is connected to the power package.
摘要翻译：本文公开了一种功率封装模块，包括：安装有多个半导体芯片的功率封装; 热辐射模块与功率封装接触并且包括用于排放从功率封装产生的热量的第一散热构件; 以及第二散热构件，其一侧连接到第一散热构件，另一侧连接到动力封装。

8. 发明申请

US20120073863A1 ANODIZED HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：阳极加热基板及其制造方法
公开(公告)号：US20120073863A1
公开(公告)日：2012-03-29
申请号：US13007464
申请日：2011-01-14
申请人： Jung Eun KANG , Kwang Soo KIM , Seog Moon CHOI , Sung Keun PARK , Chang Hyun LIM
发明人： Jung Eun KANG , Kwang Soo KIM , Seog Moon CHOI , Sung Keun PARK , Chang Hyun LIM
IPC分类号： H05K1/00 , H05K3/44
CPC分类号： H05K1/053 , H05K3/445 , Y10T29/49147
摘要： Disclosed herein is an anodized heat-radiating substrate. The anodized heat-radiating substrate is advantageous in that it has good radiation characteristics because an anodized oxide layer is formed on the entire surface of a metal layer. And, the anodized heat-radiating substrate is advantageous in that it has high-density/high accumulation characteristics because it forms multi-layered structure by using the connecting member.
摘要翻译：本文公开了一种阳极氧化散热基板。阳极氧化的散热基板的优点在于它具有良好的辐射特性，因为在金属层的整个表面上形成阳极氧化的氧化物层。并且，阳极氧化散热基板的优点在于它具有高密度/高的积聚特性，因为它通过使用连接件形成多层结构。

9. 发明申请

US20110312109A1 LIGHT EMITTING DIODE PACKAGE HAVING ANODIZED INSULATION LAYER AND FABRICATION METHOD THEREFOR 有权
标题翻译：具有阳离子绝缘层的发光二极管封装及其制造方法
公开(公告)号：US20110312109A1
公开(公告)日：2011-12-22
申请号：US13220258
申请日：2011-08-29
申请人： Young Ki LEE , Seog Moon CHOI , Sang Hyun SHIN
发明人： Young Ki LEE , Seog Moon CHOI , Sang Hyun SHIN
IPC分类号： H01L33/48
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/58 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.
摘要翻译：一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

10. 发明申请

US20110075374A1 RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：刚性柔性电路板及其制造方法
公开(公告)号：US20110075374A1
公开(公告)日：2011-03-31
申请号：US12618726
申请日：2009-11-14
申请人： Jung Eun KANG , Seog Moon CHOI , Tae Hoon KIM , Young Ki LEE , Hye Sook SHIN , Chang Hyun LIM
发明人： Jung Eun KANG , Seog Moon CHOI , Tae Hoon KIM , Young Ki LEE , Hye Sook SHIN , Chang Hyun LIM
IPC分类号： H05K7/20 , H05K1/00 , H05K3/10
CPC分类号： H05K3/4641 , H05K1/0203 , H05K1/053 , H05K1/189 , H05K3/462 , H05K3/4691 , H05K2203/0315 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.
摘要翻译：公开了一种刚性柔性电路板，其包括刚性区域和柔性区域，所述刚性区域包括在其两个表面上具有第一电路层的柔性基板，形成在柔性基板上的金属芯基板，并具有第二电路并且设置在柔性基板和金属芯基板之间的粘合层，其中金属芯基板包括具有通孔的金属芯和形成在金属芯的表面上的绝缘层，使得刚性区域和柔性区域彼此热分离，改善了刚性区域的散热性能。还提供了制造刚性柔性电路板的方法。

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