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    • 3. 发明授权
    • Pattern forming method
    • 图案形成方法
    • US09207531B2
    • 2015-12-08
    • US13239449
    • 2011-09-22
    • Hiroko NakamuraKoji AsakawaShigeki HattoriSatoshi TanakaToshiya Kotani
    • Hiroko NakamuraKoji AsakawaShigeki HattoriSatoshi TanakaToshiya Kotani
    • H01L21/31H01L21/469G03F7/00B81C1/00B82Y10/00B82Y40/00
    • G03F7/0002B81C1/00031B81C2201/0149B82Y10/00B82Y40/00
    • According to one embodiment, a pattern including first and second block phases is formed by self-assembling a block copolymer onto a film to be processed. The entire block copolymer present in a first region is removed under a first condition by carrying out energy beam irradiation and development, thereby leaving a pattern including the first and second block phases in a region other than the first region. The first block phase present in a second region is selectively removed under a second condition by carrying out energy beam irradiation and development, thereby leaving a pattern including the first and second block phases in an overlap region between a region other than the first region and a region other than the second region, and leaving a pattern of second block phase in the second region excluding the overlap region. The film is etched with the left patterns as masks.
    • 根据一个实施方案,通过将嵌段共聚物自组装成待加工的膜来形成包括第一和第二嵌段相的图案。 存在于第一区域中的整个嵌段共聚物在第一条件下通过进行能量束照射和显影而除去,从而在第一区域以外的区域留下包括第一和第二嵌段相的图案。 存在于第二区域中的第一块相位通过进行能量束照射和显影而在第二条件下被选择性地去除,从而在包括第一区域和第一区域之间的重叠区域中留下包括第一和第二块相的图案, 区域,并且在除了重叠区域之外的第二区域中留下第二块相位的图案。 用左图案蚀刻该胶片作为掩模。
    • 4. 发明申请
    • PATTERN FORMING METHOD
    • 图案形成方法
    • US20120127454A1
    • 2012-05-24
    • US13239449
    • 2011-09-22
    • Hiroko NAKAMURAKoji AsakawaShigeki HattoriSatoshi TanakaToshiya Kotani
    • Hiroko NAKAMURAKoji AsakawaShigeki HattoriSatoshi TanakaToshiya Kotani
    • G03B27/32
    • G03F7/0002B81C1/00031B81C2201/0149B82Y10/00B82Y40/00
    • According to one embodiment, a pattern including first and second block phases is formed by self-assembling a block copolymer onto a film to be processed. The entire block copolymer present in a first region is removed under a first condition by carrying out energy beam irradiation and development, thereby leaving a pattern including the first and second block phases in a region other than the first region. The first block phase present in a second region is selectively removed under a second condition by carrying out energy beam irradiation and development, thereby leaving a pattern including the first and second block phases in an overlap region between a region other than the first region and a region other than the second region, and leaving a pattern of second block phase in the second region excluding the overlap region. The film is etched with the left patterns as masks.
    • 根据一个实施方案,通过将嵌段共聚物自组装成待加工的膜来形成包括第一和第二嵌段相的图案。 存在于第一区域中的整个嵌段共聚物在第一条件下通过进行能量束照射和显影而除去,从而在第一区域以外的区域留下包括第一和第二嵌段相的图案。 存在于第二区域中的第一块相位通过进行能量束照射和显影而在第二条件下被选择性地去除,从而在包括第一区域和第一区域之间的重叠区域中留下包括第一和第二块相的图案, 区域,并且在除了重叠区域之外的第二区域中留下第二块相位的图案。 用左图案蚀刻该胶片作为掩模。
    • 5. 发明授权
    • Method of forming contact hole and method of manufacturing semiconductor device
    • 形成接触孔的方法和制造半导体器件的方法
    • US07148138B2
    • 2006-12-12
    • US10969996
    • 2004-10-22
    • Shoji MimotogiHiroko NakamuraKazuya FukuharaSatoshi TanakaSoichi Inoue
    • Shoji MimotogiHiroko NakamuraKazuya FukuharaSatoshi TanakaSoichi Inoue
    • H01L21/4763
    • G03F7/70425G03F7/70466H01L21/76816
    • A method of forming a contact hole on a substrate by using a projection aligner comprising a lighting system including a light source, an aperture, and a condenser lens, a photo mask on which light from the lighting system is incident, and a projection lens for projecting the light from the photo mask onto the substrate, comprises forming a first photosensitive resist film on the substrate; exposing the first photosensitive resist film by using a photo mask in which mask patterns are cyclically arranged in a first direction and a second direction which is orthogonal to the first direction and a first aperture having light transmission parts arranged symmetrically with respect to a center point in the first direction; developing the exposed first photosensitive resist film to form first lines and linear spaces; forming a second photosensitive resist film on the substrate; exposing the second photosensitive resist film by using the photo mask and a second aperture having light transmission parts arranged symmetrically with respect to a center point in the second direction; and developing the second photosensitive resist film to form second lines and linear spaces which are orthogonal to the first lines and linear spaces.
    • 一种通过使用包括光源,孔径和聚光透镜的照明系统的投影对准器在基板上形成接触孔的方法,来自照明系统的光入射的光掩模和用于 将来自光掩模的光投射到基板上,包括在基板上形成第一光敏抗蚀剂膜; 通过使用掩模图案沿与第一方向正交的第一方向和第二方向循环布置的光掩模曝光第一光敏抗蚀剂膜,以及具有相对于中心点对称布置的光传输部分的第一孔 第一个方向 显影第一光敏抗蚀剂膜以形成第一线和线性空间; 在所述基板上形成第二光敏抗蚀剂膜; 通过使用光掩模曝光第二光敏抗蚀剂膜,并且具有相对于第二方向的中心点对称布置的透光部分的第二孔; 并显影第二光敏抗蚀剂膜以形成与第一线和线性空间正交的第二线和线性空间。
    • 7. 发明授权
    • Photomask and method of manufacturing the same
    • 光掩模及其制造方法
    • US5549995A
    • 1996-08-27
    • US402656
    • 1995-03-13
    • Satoshi TanakaSoichi InoueHiroko Nakamura
    • Satoshi TanakaSoichi InoueHiroko Nakamura
    • G03F1/30G03F1/68H01L21/027G03F9/00
    • G03F1/30
    • A transmitting photomask includes an optically transparent substrate having a major surface on which a plurality of recesses are selectively formed and transmitting exposure light, a plurality of opaque materials formed on the portions of the major surface of the transparent substrate, other than the recesses and preventing the exposure light from passing therethrough, and a plurality of transmitting portions constituted of the recesses. Each of the recesses has side walls formed perpendicular to the major surface of the transparent substrate so as to substantially coincide with a corresponding end face of each of the opaque materials, and adjacent transmitting portions have different depths. A method of manufacturing a transmitting photomask, includes a step of forming an opaque film preventing exposure light from passing therethrough on an optically transparent substrate transmitting the exposure light, a step of forming a plurality of opening patterns for forming a transmitting portion on the opaque film and thus forming a plurality of opaque materials with remaining portions of the opaque film, and a step of forming a plurality of transmitting portions including recesses having different depths alternately by etching the transparent substrate through the opening patterns by use of anisotropic etching.
    • 发送光掩模包括具有主表面的光学透明基板,多个凹部被选择性地形成在其上并透射曝光光,多个不透明材料形成在透明基板的主表面的除了凹部之外的部分上,并防止 来自其的曝光光,以及由凹部构成的多个透光部。 每个凹部具有垂直于透明基板的主表面形成的侧壁,以便与每个不透明材料的相应端面基本上重合,并且相邻的透光部分具有不同的深度。 一种发送光掩模的制造方法,其特征在于,包括以下步骤:在透光曝光用光学透明基板上形成防止曝光的透光的不透明膜,在不透明膜上形成多个用于形成透光部的开口图案的工序 并且由此形成多个不透明材料,其余部分是不透明膜,以及通过使用各向异性蚀刻通过开口图案蚀刻透明基板而交替地形成包括具有不同深度的凹槽的多个透光部分的步骤。
    • 9. 发明申请
    • Method of forming contact hole and method of manufacturing semiconductor device
    • 形成接触孔的方法和制造半导体器件的方法
    • US20050153540A1
    • 2005-07-14
    • US10969996
    • 2004-10-22
    • Shoji MimotogiHiroko NakamuraKazuya FukuharaSatoshi TanakaSoichi Inoue
    • Shoji MimotogiHiroko NakamuraKazuya FukuharaSatoshi TanakaSoichi Inoue
    • G03F7/26G03F7/20H01L21/027H01L21/302H01L21/3065H01L21/461H01L21/4763H01L21/768
    • G03F7/70425G03F7/70466H01L21/76816
    • A method of forming a contact hole on a substrate by using a projection aligner comprising a lighting system including a light source, an aperture, and a condenser lens, a photo mask on which light from the lighting system is incident, and a projection lens for projecting the light from the photo mask onto the substrate, comprises forming a first photosensitive resist film on the substrate; exposing the first photosensitive resist film by using a photo mask in which mask patterns are cyclically arranged in a first direction and a second direction which is orthogonal to the first direction and a first aperture having light transmission parts arranged symmetrically with respect to a center point in the first direction; developing the exposed first photosensitive resist film to form first lines and linear spaces; forming a second photosensitive resist film on the substrate; exposing the second photosensitive resist film by using the photo mask and a second aperture having light transmission parts arranged symmetrically with respect to a center point in the second direction; and developing the second photosensitive resist film to form second lines and linear spaces which are orthogonal to the first lines and linear spaces.
    • 一种通过使用包括光源,孔径和聚光透镜的照明系统的投影对准器在基板上形成接触孔的方法,来自照明系统的光入射的光掩模和用于 将来自光掩模的光投射到基板上,包括在基板上形成第一光敏抗蚀剂膜; 通过使用掩模图案沿与第一方向正交的第一方向和第二方向循环布置的光掩模曝光第一光敏抗蚀剂膜,以及具有相对于中心点对称布置的光传输部分的第一孔 第一个方向 显影第一光敏抗蚀剂膜以形成第一线和线性空间; 在所述基板上形成第二光敏抗蚀剂膜; 通过使用光掩模曝光第二光敏抗蚀剂膜,并且具有相对于第二方向的中心点对称布置的透光部分的第二孔; 并显影第二光敏抗蚀剂膜以形成与第一线和线性空间正交的第二线和线性空间。