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    • 1. 发明授权
    • Method of chemically etching semiconductor substrate
    • 化学蚀刻半导体衬底的方法
    • US4836888A
    • 1989-06-06
    • US194943
    • 1988-05-17
    • Hidetoshi NojiriRyuta Hirayama
    • Hidetoshi NojiriRyuta Hirayama
    • H01L21/306H01L21/3063
    • H01L21/3063Y10S438/977
    • In a method of etching a semiconductor substrate to a desired depth from the principal surface is a selected area or selected areas by immersing the semiconductor substrate with a patterned mask such as oxide film in an etching liquid such as hydrated hydrazine, an electrode is formed on a surface of the semiconductor substrate in an area separated from the area(s) to be etched before immersing the substrate in the etching liquid. The material of the electrode is chemically stable and insusceptible to reaction with the etching liquid. In the disclosed etching method, a cathodic reduction reaction takes place on the aforementioned electrode while an anodic oxidation reaction, which causes anodic dissolution of the semiconductor material, takes place in the exposed area(s) of the semiconductor substrate. Therefore, etching is not obstacled by precipitation of the material once dissolved in the etching liquid, so that the new surface provided by etching is excellen in flatness.
    • 在通过将诸如氧化物膜的图案化掩模的半导体衬底浸入诸如水合肼的蚀刻液中的方法中,将半导体衬底蚀刻到从主表面到期望深度的方法是选定区域或选定区域, 在将基板浸渍在蚀刻液中之前,在与要蚀刻的区域分离的区域中的半导体衬底的表面。 电极的材料是化学稳定的并且不易与蚀刻液体反应。 在所公开的蚀刻方法中,在上述电极上进行阴极还原反应,同时在半导体衬底的暴露区域发生导致半导体材料的阳极溶解的阳极氧化反应。 因此,蚀刻不会被溶解在蚀刻液中的材料的沉淀所阻挡,因此通过蚀刻提供的新表面的平坦性优异。