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1. 发明授权

US07277271B2 Solid electrolytic capacitor 有权
标题翻译：固体电解电容器
公开(公告)号：US07277271B2
公开(公告)日：2007-10-02
申请号：US11488780
申请日：2006-07-19
申请人： Hideto Yamaguchi , Katsuhisa Ishizaki
发明人： Hideto Yamaguchi , Katsuhisa Ishizaki
IPC分类号： H01G9/00
CPC分类号： H01G2/065 , H01G9/012 , H01G9/08 , H01G9/15 , Y10T29/41 , Y10T29/417
摘要： A solid electrolytic capacitor includes a capacitor unit having a cathode frame coupled to a cathode part of a capacitor element, and anode frames formed at the opposite sides of the capacitor unit sandwiching a cathode frame, and coupled to an anode part of the capacitor element. Flat parts provided at the opposite ends of anode terminals are coupled to the anode frames. A flat part provided in the center of a cathode terminal is coupled to the cathode frame. The capacitor unit is covered with coating resin. The solid electrolytic capacitor has a simplified structure and a lower ESL.
摘要翻译：固体电解电容器包括电容器单元，其具有耦合到电容器元件的阴极部分的阴极框架，以及形成在电容器单元的相对侧并夹持阴极框架并且耦合到电容器元件的阳极部分的阳极框架。设置在阳极端子的相对端的平坦部分耦合到阳极框架。设置在阴极端子的中心的平坦部分耦合到阴极框架。电容器单元被涂覆树脂覆盖。固体电解电容器结构简单，ESL较低。

2. 发明申请

US20070019366A1 Solid electrolytic capacitor 有权
标题翻译：固体电解电容器
公开(公告)号：US20070019366A1
公开(公告)日：2007-01-25
申请号：US11488780
申请日：2006-07-19
申请人： Hideto Yamaguchi , Katsuhisa Ishizaki
发明人： Hideto Yamaguchi , Katsuhisa Ishizaki
IPC分类号： H01G9/00 , H01G4/228
CPC分类号： H01G2/065 , H01G9/012 , H01G9/08 , H01G9/15 , Y10T29/41 , Y10T29/417
摘要： A solid electrolytic capacitor including capacitor unit having cathode frame coupled to cathode part of capacitor element, and anode frames formed at the opposite sides of capacitor unit sandwiching cathode frame, and coupled to anode part of capacitor element. Flat parts provided at the opposite ends of anode terminals are coupled to anode frames. Flat part provided in the center of cathode terminal is coupled to cathode frame. Capacitor unit is covered with coating resin. The solid electrolytic capacitor has simplified structure and a lower ESL.
摘要翻译：一种固体电解电容器，包括具有耦合到电容器元件的阴极部分的阴极框架的电容器单元，以及形成在电容器单元夹持阴极框架的相对侧的阳极框架，并且耦合到电容器元件的阳极部分。设置在阳极端子的相对端的平坦部分耦合到阳极框架。设置在阴极端子中心的平坦部分耦合到阴极框架。电容器单元覆盖有涂层树脂。固体电解电容器结构简单，ESL较低。

3. 发明申请

US20060262486A1 Solid electrolytic capacitor 有权
标题翻译：固体电解电容器
公开(公告)号：US20060262486A1
公开(公告)日：2006-11-23
申请号：US11415077
申请日：2006-05-02
申请人： Kazuo Tadanobu , Hideto Yamaguchi , Kazuyo Nishida
发明人： Kazuo Tadanobu , Hideto Yamaguchi , Kazuyo Nishida
IPC分类号： H01G9/00
CPC分类号： H01G9/26 , H01G9/012 , H01G9/06 , H01G9/14 , Y10T29/41 , Y10T29/417
摘要： A solid electrolytic capacitor includes a plurality of laminated capacitor elements; an anode terminal connected to an anode portion where anode exposed portions of the capacitor elements are connected together; and a cathode terminal connected to a cathode portion where cathode layers of the capacitor elements are bonded together. Between lamination planes of the cathode layers of the capacitor elements, a conductive sheet is disposed. The capacitor elements are coated with a packaging resin layer in such a manner that a part of the anode terminal and a part of the cathode terminal are exposed.
摘要翻译：固体电解电容器包括多个叠层电容器元件; 连接到阳极部分的阳极端子，其中电容器元件的阳极暴露部分连接在一起; 以及连接到阴极部分的阴极端子，其中电容器元件的阴极层结合在一起。在电容器元件的阴极层的层叠平面之间设置导电片。电容器元件以阳极端子的一部分和阴极端子的一部分露出的方式涂覆有封装树脂层。

4. 发明申请

US20060040557A1 Electrical connector having a shield 失效
公开(公告)号：US20060040557A1
公开(公告)日：2006-02-23
申请号：US11196423
申请日：2005-08-04
申请人： Hideto Yamaguchi
发明人： Hideto Yamaguchi
IPC分类号： H01R13/648
CPC分类号： H01R13/6583 , H01R13/6594
摘要： A shielding member (30) of the receptacle connector (A) has a fully shielding structure that surrounds the connector fitting section (2), and the shielding member (80) of the plug connector (B) has a fully shielding structure that surrounds the connector fitting section (54).

5. 发明授权

US08266095B2 Substrate processing system and operation inspecting method 有权
标题翻译：基板加工系统及运行检查方法
公开(公告)号：US08266095B2
公开(公告)日：2012-09-11
申请号：US12225390
申请日：2007-06-18
申请人： Hideto Yamaguchi , Yasuhiro Joho , Mitsuhiro Matsuda , Yoshitaka Koyama
发明人： Hideto Yamaguchi , Yasuhiro Joho , Mitsuhiro Matsuda , Yoshitaka Koyama
IPC分类号： G06F15/00 , G06F15/18
CPC分类号： G05B19/4184 , G05B23/0235 , G05B2219/32196 , G05B2219/45031 , H01L21/67276 , Y02P90/14 , Y02P90/18 , Y02P90/22
摘要： There is provided a substrate processing system that can automatically inspect the operation of various kinds of parts of a semiconductor manufacturing apparatus without increasing the load of a main controller in the semiconductor manufacturing apparatus. In the substrate processing system of the present invention, inspection data of the semiconductor manufacturing apparatus 1 under operation are shared and collected online by a main controller 5, a data collection auxiliary computer 2 and a data collecting computer 3 through a network 6, and the operation state is collectively inspected by an inspecting computer 4.
摘要翻译：提供了一种可以自动检查半导体制造装置的各种部件的操作而不增加半导体制造装置中的主控制器的负载的基板处理系统。在本发明的基板处理系统中，正在运行的半导体制造装置1的检查数据由主控制器5，数据采集辅助计算机2和数据采集计算机3通过网络6在线共享和收集，并且操作状态由检查计算机4统一检查。

6. 发明授权

US06746908B2 Temperature controlling method, thermal treating apparatus, and method of manufacturing semiconductor device 有权
标题翻译：温度控制方法，热处理装置以及半导体装置的制造方法
公开(公告)号：US06746908B2
公开(公告)日：2004-06-08
申请号：US09964863
申请日：2001-09-28
申请人： Kazuo Tanaka , Masaaki Ueno , Minoru Nakano , Hideto Yamaguchi
发明人： Kazuo Tanaka , Masaaki Ueno , Minoru Nakano , Hideto Yamaguchi
IPC分类号： H01L218238
CPC分类号： H01L21/67248 , C23C16/46 , C30B25/16 , C30B31/18 , F27D19/00 , F27D2019/0018 , F27D2019/0028
摘要： A temperature control method is provided which is capable of performing quick, accurate, and error-free soaking control over all wafer areas to be thermally treated at a target temperature without requiring any skilled operator and which can be automated by using a computer. In the temperature control method of controlling a heating apparatus having at least two heating zones in such a manner that temperatures detected at predetermined locations equal a target temperature therefor, temperatures are detected at predetermined locations the number of which is larger than the number of the heating zones, and the heating apparatus is controlled in such a manner that the target temperature falls between a maximum value and a minimum value of a plurality of detected temperatures.
摘要翻译：提供一种温度控制方法，其能够对目标温度下热处理的所有晶片区域执行快速，准确和无错误的均热控制，而不需要任何熟练的操作者并且可以通过使用计算机自动化。在控制具有至少两个加热区域的加热装置的温度控制方法中，使得在预定位置处检测的温度等于目标温度，在预定位置检测温度，其数量大于加热次数区域，并且加热装置以使得目标温度落在多个检测温度的最大值和最小值之间的方式被控制。

7. 发明授权

US09418881B2 Substrate processing apparatus capable of switching control mode of heater 有权
标题翻译：能够切换加热器的控制模式的基板处理装置
公开(公告)号：US09418881B2
公开(公告)日：2016-08-16
申请号：US13192784
申请日：2011-07-28
申请人： Shinobu Sugiura , Masaaki Ueno , Kazuo Tanaka , Masashi Sugishita , Hideto Yamaguchi , Kenji Shirako
发明人： Shinobu Sugiura , Masaaki Ueno , Kazuo Tanaka , Masashi Sugishita , Hideto Yamaguchi , Kenji Shirako
IPC分类号： H01L21/67 , G05D23/19 , G05D23/20 , C23C14/54 , C23C16/458 , C23C16/52 , G05D23/22
CPC分类号： H01L21/67248 , C23C14/541 , C23C16/4584 , C23C16/52 , G05D23/1931 , G05D23/22 , H01L21/67109
摘要： Provided is a substrate processing apparatus capable of suppressing inferiority when heat treatment is controlled using a temperature sensor. The substrate processing apparatus includes a heating means configured to heat a process chamber wherein a substrate is accommodated; a first temperature detection means configured to detect a temperature about the substrate using a first thermocouple; a second temperature detection means configured to detect a temperature about the heating means using a second thermocouple; a control unit configured to control the heating means based on the temperature detected by the first temperature detection means and the temperature detected by the second temperature detection means; and a control switching means configured to control the control unit based on the temperatures detected by the first temperature detection means and the second temperature detection means such that the control unit is switched between a first control mode and a second control mode, wherein a heat resistance of the first thermocouple is greater than that of the second thermocouple, and a temperature detection performance of the second thermocouple is higher than that of the first thermocouple.
摘要翻译：提供一种当使用温度传感器控制热处理时能够抑制劣化的基板处理装置。基板处理装置包括加热装置，其构造成加热容纳基板的处理室; 第一温度检测装置，被配置为使用第一热电偶检测关于所述基板的温度; 第二温度检测装置，被配置为使用第二热电偶检测关于加热装置的温度; 控制单元，被配置为基于由第一温度检测装置检测的温度和由第二温度检测装置检测的温度来控制加热装置; 以及控制切换装置，被配置为基于由第一温度检测装置和第二温度检测装置检测到的温度来控制控制单元，使得控制单元在第一控制模式和第二控制模式之间切换，其中耐热性的第一热电偶的温度检测性能高于第一热电偶的温度检测性能。

8. 发明授权

US07394649B2 Solid electrolytic capacitor with an improved mounting property, and manufacturing method of the same 有权
标题翻译：具有改进的安装性能的固体电解电容器及其制造方法
公开(公告)号：US07394649B2
公开(公告)日：2008-07-01
申请号：US11783699
申请日：2007-04-11
申请人： Katsuyuki Nakamura , Kazuo Kawahito , Takahiro Jodoi , Hideto Yamaguchi
发明人： Katsuyuki Nakamura , Kazuo Kawahito , Takahiro Jodoi , Hideto Yamaguchi
IPC分类号： H01G9/00
CPC分类号： H01G9/012 , H01G9/10 , H01G9/15 , Y10T29/417
摘要： A solid electrolytic capacitor includes a capacitor element, an anode terminal, a cathode terminal, and an outer casing resin. The anode and cathode terminals constitute parts of the mounting surface, and are drawn immediately below the capacitor element. The anode terminal and the cathode terminal are electrically coupled with an anode leader of the capacitor element and a cathode layer, respectively. The outer casing resin covers the capacitor element, and exposes the anode and cathode terminals on the mounting surface. At least one recess is provided on a mounting surface side of at least one of the anode and cathode terminals having a larger area projected onto the mounting surface.
摘要翻译：固体电解电容器包括电容器元件，阳极端子，阴极端子和外壳树脂。阳极和阴极端子构成安装表面的一部分，并在电容器元件的正下方被拉出。阳极端子和阴极端子分别与电容器元件的阳极引线和阴极层电耦合。外壳树脂覆盖电容器元件，并将阳极和阴极端子暴露在安装表面上。在至少一个阳极和阴极端子的安装表面侧设置至少一个凹部，其具有投影到安装表面上的较大面积。

9. 发明授权

US07342772B2 Solid electrolytic capacitor 有权
标题翻译：固体电解电容器
公开(公告)号：US07342772B2
公开(公告)日：2008-03-11
申请号：US11415077
申请日：2006-05-02
申请人： Kazuo Tadanobu , Hideto Yamaguchi , Kazuyo Nishida
发明人： Kazuo Tadanobu , Hideto Yamaguchi , Kazuyo Nishida
IPC分类号： H01G9/00
CPC分类号： H01G9/26 , H01G9/012 , H01G9/06 , H01G9/14 , Y10T29/41 , Y10T29/417
摘要： A solid electrolytic capacitor includes a plurality of laminated capacitor elements; an anode terminal connected to an anode portion where anode exposed portions of the capacitor elements are connected together; and a cathode terminal connected to a cathode portion where cathode layers of the capacitor elements are bonded together. Between lamination planes of the cathode layers of the capacitor elements, a conductive sheet is disposed. The capacitor elements are coated with a packaging resin layer in such a manner that a part of the anode terminal and a part of the cathode terminal are exposed.
摘要翻译：固体电解电容器包括多个叠层电容器元件; 连接到阳极部分的阳极端子，其中电容器元件的阳极暴露部分连接在一起; 以及连接到阴极部分的阴极端子，其中电容器元件的阴极层结合在一起。在电容器元件的阴极层的层叠平面之间设置导电片。电容器元件以阳极端子的一部分和阴极端子的一部分露出的方式涂覆有封装树脂层。

10. 发明授权

US5390074A Chip-type solid electrolytic capacitor and method of manufacturing the same 失效
标题翻译：片式固体电解电容器及其制造方法
公开(公告)号：US5390074A
公开(公告)日：1995-02-14
申请号：US948577
申请日：1992-09-23
申请人： Nobuo Hasegawa , Sumio Nishiyama , Hideto Yamaguchi , Takashi Ida , Junichi Kurita , Koji Ueoka , Yasuhiro Kobashi , Hideo Hashimoto
发明人： Nobuo Hasegawa , Sumio Nishiyama , Hideto Yamaguchi , Takashi Ida , Junichi Kurita , Koji Ueoka , Yasuhiro Kobashi , Hideo Hashimoto
IPC分类号： H01G9/00 , H01G9/012 , H01G9/15 , H01G9/05 , H01G9/24
CPC分类号： H01G9/012 , H01G9/15 , Y10T29/417
摘要： A chip-type solid electrolytic capacitor includes a cathode conductive layer provided on a whole surface of a cathode layer formed on an outer surface of a capacitor element, which whole surface is opposite to a surface where an anode lead wire is lead out, and on a surface adjacent to the first-mentioned whole surface. With this arrangement, if the capacitor element is obliquely inserted into a mold during the formation of a resin shell, the inner walls of the mold will not come into contact with cathode layer of the capacitor element, but will instead come into contact with the cathode conductive layer to prevent the cathode layer from being exposed to the resin shell. As a result, any possible damage to the cathode layer of the capacitor element when the peripheral surface of the resin shell on a cathode side is subjected to roughening is prevented to eliminate defects in electric characteristics such as leakage of electric current and a tan.delta. value.
摘要翻译：芯片型固体电解电容器包括阴极导电层，阴极导电层设置在形成于电容器元件的外表面的阴极层的整个表面上，整个表面与阳极引线导出的表面相反，并且导通与第一个提及的整个表面相邻的表面。通过这种布置，如果电容器元件在形成树脂壳时倾斜地插入模具中，则模具的内壁将不会与电容器元件的阴极层接触，而是与阴极接触导电层，以防止阴极层暴露于树脂壳体。结果，防止当阴极侧的树脂壳体的外周表面经受粗糙化时对电容器元件的阴极层的任何可能的损坏，以消除电特性的缺陷，例如电流泄漏和tanδ值。

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