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1. 发明授权

US08822240B2 Temperature detecting apparatus, substrate processing apparatus and method of manufacturing semiconductor device 有权
标题翻译：温度检测装置，基板处理装置及半导体装置的制造方法
公开(公告)号：US08822240B2
公开(公告)日：2014-09-02
申请号：US13536418
申请日：2012-06-28
申请人： Tetsuya Kosugi , Masaaki Ueno , Hideto Yamaguchi
发明人： Tetsuya Kosugi , Masaaki Ueno , Hideto Yamaguchi
IPC分类号： G01R31/26 , H01L21/66 , G01K1/12 , H01L21/67 , G01K7/04 , G01K7/02
CPC分类号： H01L22/10 , C23C16/0209 , G01K1/12 , G01K7/026 , G01K7/04 , G01K13/02 , G01K2013/024 , H01L21/67248 , H01L22/30 , H01L2924/0002 , H01L2924/00
摘要： A temperature detecting apparatus is provided which is capable of suppressing disconnection of a thermocouple wire or positional deviation of a thermocouple junction portion caused by change over time. The temperature detecting apparatus includes: an insulation rod installed to extend in a vertical direction and including a through-hole in vertical direction; a thermocouple wire inserted in the through-hole of the insulation rod, the thermocouple wire including a thermocouple junction portion at an upper end thereof and an angled portion at a lower end of the insulation rod; and a buffer area installed below the insulation rod and configured to suppress a restriction of a horizontal portion of the angled portion upon heat expansion, wherein an upper portion of the thermocouple wire or a middle portion in the vertical direction are supported by the insulation rod.
摘要翻译：提供一种温度检测装置，其能够抑制由于随时间的变化而导致的热电偶线的断开或热电偶接合部的位置偏离。温度检测装置包括：安装成沿垂直方向延伸并且在垂直方向上包括通孔的绝缘杆; 插入所述绝缘棒的通孔中的热电偶线，所述热电偶线在其上端包括热电偶接合部分和所述绝缘棒的下端处的倾斜部分; 以及安装在所述绝缘杆下方的缓冲区，并且被构造成在热膨胀时抑制所述成角度部分的水平部分的限制，其中所述热电偶线的上部或所述垂直方向上的中间部分由所述绝缘杆支撑。

2. 发明授权

US08380360B2 Temperature control method, method of obtaining a temperature correction value, method of manufacturing a semiconductor device and substrate treatment apparatus 有权
公开(公告)号：US08380360B2
公开(公告)日：2013-02-19
申请号：US12232007
申请日：2008-09-09
申请人： Hideto Yamaguchi
发明人： Hideto Yamaguchi
IPC分类号： G05D23/00
CPC分类号： H01L21/67248 , C23C16/46 , G05D23/1931 , G05D23/22 , H01L21/67109
摘要： In a temperature control method in which a target temperature is given in a thermal treatment furnace and plural heaters are controlled according to the target temperature, the correlation of the each heater and plural profile temperature sensors provided in the thermal treatment furnace is determined, a virtual temperature is calculated on the basis of the detection temperature of each profile temperature sensor and a weighting factor calculated from the correlation, and the each heater is controlled so that the virtual temperature is coincident with the target temperature.

3. 发明申请

US20100223277A1 Substrate Processing System and Operation Inspecting Method 有权
标题翻译：基板加工系统及运行检查方法
公开(公告)号：US20100223277A1
公开(公告)日：2010-09-02
申请号：US12225390
申请日：2007-06-18
申请人： Hideto Yamaguchi , Yasuhiro Joho , Mitsuhiro Matsuda , Yoshitaka Koyama
发明人： Hideto Yamaguchi , Yasuhiro Joho , Mitsuhiro Matsuda , Yoshitaka Koyama
IPC分类号： G06F17/30
CPC分类号： G05B19/4184 , G05B23/0235 , G05B2219/32196 , G05B2219/45031 , H01L21/67276 , Y02P90/14 , Y02P90/18 , Y02P90/22
摘要： There is provided a substrate processing system that can automatically inspect the operation of various kinds of parts of a semiconductor manufacturing apparatus without increasing the load of a main controller in the semiconductor manufacturing apparatus. In the substrate processing system of the present invention, inspection data of the semiconductor manufacturing apparatus 1 under operation are shared and collected online by a main controller 5, a data collection auxiliary computer 2 and a data collecting computer 3 through a network 6, and the operation state is collectively inspected by an inspecting computer 4.
摘要翻译：提供了一种可以自动检查半导体制造装置的各种部件的操作而不增加半导体制造装置中的主控制器的负载的基板处理系统。在本发明的基板处理系统中，正在运行的半导体制造装置1的检查数据由主控制器5，数据采集辅助计算机2和数据采集计算机3通过网络6在线共享和收集，并且操作状态由检查计算机4统一检查。

4. 发明申请

US20070242409A1 Solid electrolytic capacitor and manufacturing method of the same 有权
标题翻译：固体电解电容器及其制造方法相同
公开(公告)号：US20070242409A1
公开(公告)日：2007-10-18
申请号：US11783699
申请日：2007-04-11
申请人： Katsuyuki Nakamura , Kazuo Kawahito , Takahiro Jodoi , Hideto Yamaguchi
发明人： Katsuyuki Nakamura , Kazuo Kawahito , Takahiro Jodoi , Hideto Yamaguchi
IPC分类号： H01G4/255
CPC分类号： H01G9/012 , H01G9/10 , H01G9/15 , Y10T29/417
摘要： A solid electrolytic capacitor includes a capacitor element, an anode terminal, a cathode terminal, and an outer casing resin. The anode and cathode terminals constitute parts of the mounting surface, and are drawn immediately below the capacitor element. The anode terminal and the cathode terminal are electrically coupled with an anode leader of the capacitor element and a cathode layer, respectively. The outer casing resin covers the capacitor element, and exposes the anode and cathode terminals on the mounting surface. At least one recess is provided on a mounting surface side of at least one of the anode and cathode terminals having a larger area projected onto the mounting surface.
摘要翻译：固体电解电容器包括电容器元件，阳极端子，阴极端子和外壳树脂。阳极和阴极端子构成安装表面的一部分，并在电容器元件的正下方被拉出。阳极端子和阴极端子分别与电容器元件的阳极引线和阴极层电耦合。外壳树脂覆盖电容器元件，并将阳极和阴极端子暴露在安装表面上。在至少一个阳极和阴极端子的安装表面侧设置至少一个凹部，其具有投影到安装表面上的较大面积。

5. 发明授权

US07059908B2 Electrical connector having a shield 失效
标题翻译：具有屏蔽的电连接器
公开(公告)号：US07059908B2
公开(公告)日：2006-06-13
申请号：US11196423
申请日：2005-08-04
申请人： Hideto Yamaguchi
发明人： Hideto Yamaguchi
IPC分类号： H01R13/648
CPC分类号： H01R13/6583 , H01R13/6594
摘要： A shielding member (30) of the receptacle connector (A) has a fully shielding structure that surrounds the connector fitting section (2), and the shielding member (80) of the plug connector (B) has a fully shielding structure that surrounds the connector fitting section (54).
摘要翻译：插座连接器（A）的屏蔽部件（30）具有围绕连接器嵌合部（2）的全屏蔽结构，插头连接器（B）的屏蔽部件（80）具有全屏蔽结构，连接器配合部（54）。

6. 发明授权

US06711531B1 Temperature control simulation method and apparatus 失效
标题翻译：温度控制仿真方法及装置
公开(公告)号：US06711531B1
公开(公告)日：2004-03-23
申请号：US09369926
申请日：1999-08-09
申请人： Kazuo Tanaka , Hideto Yamaguchi , Kenzo Urabe
发明人： Kazuo Tanaka , Hideto Yamaguchi , Kenzo Urabe
IPC分类号： G06G748
CPC分类号： G06G7/66
摘要： A temperature control simulation method and apparatus for forming a temperature system simulation model on a computer, provide substantially the same response or simulation characteristics as a temperature change in an actual furnace, whereby a temperature control algorithm can be developed and the method or manner of manipulating the temperature control can be learned without using an actual furnace. A transfer function is determined which represents a relationship between a heater input and a temperature output. A temperature control simulation for a heating furnace is executed using the transfer function of a heating furnace as a transfer function that a temperature system simulation device uses.
摘要翻译：用于在计算机上形成温度系统模拟模型的温度控制模拟方法和装置提供与实际炉中的温度变化基本相同的响应或模拟特性，由此可以开发温度控制算法，以及操作的方法或方式可以在不使用实际炉的情况下学习温度控制。确定表示加热器输入和温度输出之间的关系的传递函数。使用加热炉的传递函数作为温度系统模拟装置使用的传递函数来执行加热炉的温度控制模拟。

7. 发明授权

US06496749B1 Semiconductor producing apparatus and temperature control method therefor 有权
标题翻译：半导体制造装置及其温度控制方法
公开(公告)号：US06496749B1
公开(公告)日：2002-12-17
申请号：US09413467
申请日：1999-10-06
申请人： Hideto Yamaguchi , Kazuo Tanaka , Kenzo Urabe
发明人： Hideto Yamaguchi , Kazuo Tanaka , Kenzo Urabe
IPC分类号： G06F1900
CPC分类号： H01L21/67248
摘要： A semiconductor producing apparatus is capable of quickly and accurately changing a controlled variable to a target value to thereby make the controlled variable quickly follow the target value. Moreover, the controlled variable and target value can be adjusted automatically, thus improving the productivity of a process. The semiconductor producing apparatus includes a PID adjustment section to which a target value and a detected control value are inputted through an adder, a pattern generation section having an approximate function for calculating a pattern output and making it possible to change the pattern output in accordance wit parameter values of the approximate function, and a switcher for switching between an output including at least an output of the pattern generation section and an output of the PID adjustment section to thereby generate an output.
摘要翻译：半导体制造装置能够快速，准确地将受控变量变更为目标值，从而使受控变量快速地追随目标值。此外，控制变量和目标值可以自动调整，从而提高过程的生产率。半导体制造装置包括通过加法器输入目标值和检测到的控制值的PID调整部，具有用于计算图案输出的近似函数的图案生成部，并且能够根据机智改变图案输出近似功能的参数值，以及用于在至少包括模式生成部的输出的输出与PID调整部的输出之间切换的切换器，从而生成输出。

8. 发明申请

US20090105867A1 Temperature control method, method of obtaining a temperature correction value, method of manufacturing a semiconductor device and substrate treatment apparatus 有权
标题翻译：温度控制方法，获得温度校正值的方法，制造半导体器件的方法和衬底处理设备
公开(公告)号：US20090105867A1
公开(公告)日：2009-04-23
申请号：US12232007
申请日：2008-09-09
申请人： Hideto Yamaguchi
发明人： Hideto Yamaguchi
IPC分类号： H01L21/02 , G05D23/00 , G05D23/19
CPC分类号： H01L21/67248 , C23C16/46 , G05D23/1931 , G05D23/22 , H01L21/67109
摘要： In a temperature control method in which a target temperature is given in a thermal treatment furnace and plural heaters are controlled according to the target temperature, the correlation of the each heater and plural profile temperature sensors provided in the thermal treatment furnace is determined, a virtual temperature is calculated on the basis of the detection temperature of each profile temperature sensor and a weighting factor calculated from the correlation, and the each heater is controlled so that the virtual temperature is coincident with the target temperature.
摘要翻译：在热处理炉中给出目标温度并根据目标温度控制多个加热器的温度控制方法中，确定设置在热处理炉中的每个加热器和多个轮廓温度传感器的相关性，虚拟基于每个轮廓温度传感器的检测温度和从相关性计算的加权因子来计算温度，并且控制每个加热器，使得虚拟温度与目标温度一致。

9. 发明授权

US06671509B1 Mobile communication unit and mobile communication system 有权
标题翻译：移动通信单元和移动通信系统
公开(公告)号：US06671509B1
公开(公告)日：2003-12-30
申请号：US09339835
申请日：1999-06-25
申请人： Masaki Tanaka , Kenzo Urabe , Seigo Miyoshi , Yoshikuni Itoh , Hideto Yamaguchi
发明人： Masaki Tanaka , Kenzo Urabe , Seigo Miyoshi , Yoshikuni Itoh , Hideto Yamaguchi
IPC分类号： H04Q732
CPC分类号： H04W8/245 , H04W8/183
摘要： A mobile station (mobile communication unit) receives system software from a base station via an antenna and a transmitter/receiver, and stores the received system software in a memory. A digital signal processor in the mobile station then performs communication processing according to the system software stored in the memory. By transmitting various system software from the base station, the single mobile station can easily be adapted to different communication principles. The base station also receives system software from a center via a public exchange network, and stores the received system software in a memory. A digital signal processor in the base station then performs communication processing according to the system software stored in the memory.
摘要翻译：移动站（移动通信单元）经由天线和发射机/接收机从基站接收系统软件，并将接收到的系统软件存储在存储器中。然后，移动站中的数字信号处理器根据存储在存储器中的系统软件执行通信处理。通过从基站发送各种系统软件，单个移动台可以容易地适应不同的通信原理。基站还通过公共交换网从中心接收系统软件，并将接收到的系统软件存储在存储器中。然后，基站中的数字信号处理器根据存储在存储器中的系统软件执行通信处理。

10. 发明申请

US20120094010A1 SUBSTRATE PROCESSING APPARATUS, TEMPERATURE CONTROLLING METHOD OF SUBSTRATE PROCESSING APPARATUS, AND HEATING METHOD OF SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：基板加工装置，基板加工装置的温度控制方法和基板加工装置的加热方法
公开(公告)号：US20120094010A1
公开(公告)日：2012-04-19
申请号：US13192784
申请日：2011-07-28
申请人： Shinobu SUGIURA , Masaaki UENO , Kazuo TANAKA , Masashi SUGISHITA , Hideto YAMAGUCHI , Kenji SHIRAKO
发明人： Shinobu SUGIURA , Masaaki UENO , Kazuo TANAKA , Masashi SUGISHITA , Hideto YAMAGUCHI , Kenji SHIRAKO
IPC分类号： C23C16/52 , B05C11/00
CPC分类号： H01L21/67248 , C23C14/541 , C23C16/4584 , C23C16/52 , G05D23/1931 , G05D23/22 , H01L21/67109
摘要： Provided is a substrate processing apparatus capable of suppressing inferiority when heat treatment is controlled using a temperature sensor. The substrate processing apparatus includes a heating means configured to heat a process chamber wherein a substrate is accommodated; a first temperature detection means configured to detect a temperature about the substrate using a first thermocouple; a second temperature detection means configured to detect a temperature about the heating means using a second thermocouple; a control unit configured to control the heating means based on the temperature detected by the first temperature detection means and the temperature detected by the second temperature detection means; and a control switching means configured to control the control unit based on the temperatures detected by the first temperature detection means and the second temperature detection means such that the control unit is switched between a first control mode and a second control mode, wherein a heat resistance of the first thermocouple is greater than that of the second thermocouple, and a temperature detection performance of the second thermocouple is higher than that of the first thermocouple
摘要翻译：提供一种当使用温度传感器控制热处理时能够抑制劣化的基板处理装置。基板处理装置包括加热装置，其构造成加热容纳基板的处理室; 第一温度检测装置，被配置为使用第一热电偶检测关于所述基板的温度; 第二温度检测装置，被配置为使用第二热电偶检测关于加热装置的温度; 控制单元，被配置为基于由第一温度检测装置检测的温度和由第二温度检测装置检测的温度来控制加热装置; 以及控制切换装置，被配置为基于由第一温度检测装置和第二温度检测装置检测到的温度来控制控制单元，使得控制单元在第一控制模式和第二控制模式之间切换，其中耐热性的第一热电偶的温度检测性能比第一热电偶的温度检测性能高

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