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1. 发明授权

US08764026B2 Device for centering wafers 有权
标题翻译：晶圆定心装置
公开(公告)号：US08764026B2
公开(公告)日：2014-07-01
申请号：US12761044
申请日：2010-04-15
申请人： Gregory George , Hale Johnson , Dennis Patricio
发明人： Gregory George , Hale Johnson , Dennis Patricio
IPC分类号： B23B31/18
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： A device for centering circular wafers includes a support chuck for supporting a circular wafer to be centered upon its top surface, left, right and middle centering linkage rods and a cam plate synchronizing the rectilinear motion of the left, right and middle centering linkage rods. The left centering linkage rod includes a first rotating arm at a first end and rectilinear motion of the left centering linkage rod translates into rotational motion of the first rotating arm. The right centering linkage rod comprises a second rotating arm at a first end, and rectilinear motion of the right centering linkage rod translates into rotational motion of the second rotating arm. The first and second rotating arms are rotatable around an axis perpendicular to the top surface of the support chuck and comprise a curved edge surface configured to roll against the curved edge of the circular wafer. The middle centering linkage rod includes a third alignment arm at a first end. The third alignment arm is placed in contact with the curved edge of the circular wafer and linear motion of the middle centering linkage rod in the Y-direction pushes the third alignment arm and the circular wafer toward or away from the center of the support chuck. The cam plate includes first and second linear cam profiles. The first cam profile provides rectilinear motion for the middle centering linkage rod and the second linear cam profile provides rectilinear motion for the left and right centering linkage rods.
摘要翻译：用于定心圆形晶片的装置包括支撑卡盘，用于将圆形晶片支撑在其顶部中心定位的中心，左右中心对中连杆和中心对中连杆的直线运动同步的凸轮板。左对中连杆包括在第一端处的第一旋转臂，并且左对中连杆的直线运动转换成第一旋转臂的旋转运动。右对中连杆包括在第一端的第二旋转臂，右对中连杆的直线运动转换为第二旋转臂的旋转运动。第一和第二旋转臂可绕垂直于支撑卡盘的顶表面的轴线旋转，并且包括弯曲的边缘表面，该弯曲边缘表面被配置成相对于圆形晶片的弯曲边缘滚动。中间定心连杆在第一端包括第三对准臂。第三对准臂被放置成与圆形晶片的弯曲边缘接触，并且Y中心定中心连杆的线性运动将第三对准臂和圆形晶片推向或远离支撑卡盘的中心。凸轮板包括第一和第二直线凸轮轮廓。第一凸轮轮廓为中间定心联动杆提供直线运动，第二直线凸轮轮廓为左右对中连杆提供直线运动。

2. 发明授权

US08919412B2 Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers 有权
标题翻译：临时粘合半导体晶片的热滑脱离装置
公开(公告)号：US08919412B2
公开(公告)日：2014-12-30
申请号：US12760973
申请日：2010-04-15
申请人： Gregory George , Hale Johnson , Patrick Gorun , Emmett Hughlett , James Hermanowski , Matthew Stiles
发明人： Gregory George , Hale Johnson , Patrick Gorun , Emmett Hughlett , James Hermanowski , Matthew Stiles
IPC分类号： B32B38/10 , H01L21/67 , B32B43/00 , H01L21/683 , B32B38/18
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly. The X-axis drive control initiates horizontal motion of the X-axis carriage drive along the X-axis while heat is applied to the carrier wafer via the heater and while the carrier wafer is held by the top chuck assembly via the wafer holder and thereby causes the device wafer to separate and slide away from the carrier wafer.
摘要翻译：用于通过粘合剂层临时粘合的晶片脱粘两个的脱粘器装置包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴驱动控制。顶部卡盘组件包括加热器和晶片保持器。 X轴驱动控制器将底部卡盘组件从装载区域水平驱动到顶部卡盘组件下方的过程区域，并从工艺区域向后加载到装载区域。包括通过粘合剂层结合到器件晶片的载体晶片的晶片对被放置在位于底部卡盘组件处的负载区域处，使得器件晶片的未结合表面与底部组件接触并且由X 驱动到顶部卡盘组件下面的处理区域，并且载体晶片的未结合表面被放置成与顶部卡盘组件接触。 X轴驱动控制器启动X轴托架驱动器沿X轴的水平运动，同时通过加热器将热量施加到载体晶片上，同时通过晶片保持器将托架晶片保持在顶卡盘组件上，从而使得器件晶片分离并从载体晶片滑离。

3. 发明授权

US08267143B2 Apparatus for mechanically debonding temporary bonded semiconductor wafers 有权
标题翻译：用于机械剥离临时粘合的半导体晶片的装置
公开(公告)号：US08267143B2
公开(公告)日：2012-09-18
申请号：US12761014
申请日：2010-04-15
申请人： Gregory George , Hale Johnson , Patrick Gorun , James Hermanowski , Matthew Stiles
发明人： Gregory George , Hale Johnson , Patrick Gorun , James Hermanowski , Matthew Stiles
IPC分类号： B32B38/10
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： An apparatus for debonding two temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge arranged adjacent to a first edge of the chuck and connected to a hinge. The flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor moves the contact roller vertical to the plane of the chuck top surface.
摘要翻译：用于剥离两个临时粘合晶片的装置包括卡盘组件，柔性板组件和接触辊。卡盘组件包括卡盘和第一晶片保持器，以保持晶片与卡盘的顶表面接触。柔性板组件包括柔性板和第二晶片保持器，第二晶片保持器被构造成保持与柔性板的第一表面接触的晶片。柔性板包括与卡盘的第一边缘相邻并且连接到铰链的第一边缘。柔性板被构造成围绕铰链摆动并且被放置在卡盘的顶表面之上。接触辊被布置成与卡盘的与其第一边缘径向相对的第二边缘相邻。脱粘驱动电机使接触辊垂直于卡盘顶面的平面移动。

4. 发明授权

US08147630B2 Method and apparatus for wafer bonding with enhanced wafer mating 有权
标题翻译：具有增强的晶片配合的晶片接合的方法和装置
公开(公告)号：US08147630B2
公开(公告)日：2012-04-03
申请号：US12618846
申请日：2009-11-16
申请人： Gregory George
发明人： Gregory George
IPC分类号： B32B41/00
CPC分类号： H01L21/67092 , H01L21/187 , Y10T29/49131
摘要： An improved wafer-to-wafer bonding method includes aligning an upper and a lower wafer and initiating a bond at a single point by applying pressure to a single point of the upper wafer via the flow of pressurized gas through a port terminating at the single point. The bond-front propagates radially across the aligned oppositely oriented wafer surfaces at a set radial velocity rate bringing the two wafer surfaces into full atomic contact by controlling the gas pressure and/or controlling the velocity of the motion of the lower wafer up toward the upper wafer.
摘要翻译：改进的晶片到晶片接合方法包括：通过将加压气体流通过终止于单个点的端口向上部晶片的单个点施加压力，使上部和下部晶片对准并且在单个点处引发结合。键合前端以设定的径向速度径向跨越对准的相对定向的晶片表面传播，从而通过控制气体压力和/或控制下部晶片的运动速度向上移动，使两个晶片表面进入完全原子接触晶圆。

5. 发明授权

US08139219B2 Apparatus and method for semiconductor wafer alignment 有权
标题翻译：用于半导体晶圆对准的装置和方法
公开(公告)号：US08139219B2
公开(公告)日：2012-03-20
申请号：US12416779
申请日：2009-04-01
申请人： Gregory George
发明人： Gregory George
IPC分类号： G01B11/00
CPC分类号： H01L21/681 , H01L21/67092 , H01L23/544 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for aligning semiconductor wafers includes equipment for positioning a first surface of a first semiconductor wafer directly opposite to a first surface of a second semiconductor wafer and equipment for aligning a first structure on the first semiconductor wafer with a second structure on the first surface of the second semiconductor wafer. The aligning equipment comprises at least one movable alignment device configured to be moved during alignment and to be inserted between the first surface of the first semiconductor wafer and the first surface of the second semiconductor wafer. The positioning equipment are vibrationally and mechanically isolated from the alignment device motion.
摘要翻译：用于对准半导体晶片的装置包括用于定位与第二半导体晶片的第一表面直接相对的第一半导体晶片的第一表面的设备和用于将第一半导体晶片上的第一结构与第二半导体晶片的第一表面上的第一结构对准的设备第二半导体晶片。对准设备包括至少一个可移动对准装置，其构造成在对准期间移动并且被插入在第一半导体晶片的第一表面和第二半导体晶片的第一表面之间。定位设备与对准装置的运动振动和机械隔离。

6. 发明授权

US09159595B2 Thin wafer carrier 有权
标题翻译：薄晶片载体
公开(公告)号：US09159595B2
公开(公告)日：2015-10-13
申请号：US13022215
申请日：2011-02-07
申请人： Daniel T. Hurley , Gregory George
发明人： Daniel T. Hurley , Gregory George
IPC分类号： H01L21/683 , B23B31/30 , H01L21/67 , B23Q3/08
CPC分类号： H01L21/67092 , B23B31/307 , B23Q3/088 , H01L21/67144 , H01L21/6835 , H01L21/6836 , H01L21/6838 , H01L2221/6834 , H01L2221/68381 , Y10T279/11
摘要： An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface via vacuum from the vacuum reservoir drawn through the through-openings.
摘要翻译：用于承载和保持具有低于100微米厚度的半导体晶片的改进的晶片载体装置包括可移动的晶片卡盘，其具有封闭的真空容器和被配置为支撑晶片的顶表面。顶表面具有从顶表面延伸到真空储存器的一个或多个通孔，并且晶片通过真空从穿过通孔的真空容器被保持在顶表面上。

7. 发明授权

US08425715B2 Apparatus for high throughput wafer bonding 有权
标题翻译：高通量晶片接合装置
公开(公告)号：US08425715B2
公开(公告)日：2013-04-23
申请号：US13079446
申请日：2011-04-04
申请人： Gregory George
发明人： Gregory George
IPC分类号： B29C65/00 , B29C65/08 , B29C45/00 , B29C47/00 , B29C43/02 , B29C49/00 , B29C51/00 , B29C43/10 , B32B37/00 , B30B5/02 , B30B5/04 , B30B15/34 , H01L21/30 , H01L21/46 , H01L21/76 , B29D24/00 , B29D29/00 , B28B21/36 , A01J21/00 , A01J25/12 , A21C3/00 , A21C11/00 , A23G1/20 , A23G3/02 , A23P1/00 , B28B11/08 , B29C55/28
CPC分类号： H01L21/6719 , H01L21/67092
摘要： An industrial-scale high throughput wafer bonding apparatus includes a wafer bonder chamber extending along a main axis and comprising a plurality of chamber zones, a plurality of heater/isolator plates, a guide rod system extending along the main axis, a pair of parallel track rods extending along the main axis, and first pressure means. The chamber zones are separated from each other and thermally isolated from each other by the heater/isolator plates. The heater/isolator plates are oriented perpendicular to the main axis, are movably supported and guided by the guide rod system and are configured to move along the direction of the main axis. Each of the chamber zones is dimensioned to accommodate an aligned wafer pair and the wafer pairs are configured to be supported by the parallel track rods. The first pressure means is configured to apply a first force perpendicular to a first end heater/isolator plate. The applied first force causes the heater/isolator plates to move toward each other along the main axis and thereby causes the collapse of each chamber zone volume and the application of bonding pressure onto the wafer pairs.
摘要翻译：一种工业规模的高通量晶片接合装置，包括沿着主轴延伸的晶片接合室，包括多个室区，多个加热器/隔离板，沿主轴延伸的导杆系统，一对平行轨道杆沿着主轴线延伸，以及第一压力装置。室区彼此分离并通过加热器/隔离板彼此热隔离。加热器/隔离板垂直于主轴定向，由导杆系统可移动地支撑和引导，并被构造成沿着主轴线的方向移动。每个室区的尺寸被设计成适应对准的晶片对，并且晶片对构造成由平行轨道杆支撑。第一压力装置构造成施加垂直于第一端加热器/隔离板的第一力。所施加的第一力使得加热器/隔离板沿着主轴线彼此移动，从而导致每个室区域体积的崩溃以及将结合压力施加到晶片对上。

8. 发明授权

US08366873B2 Debonding equipment and methods for debonding temporary bonded wafers 有权
标题翻译：剥离临时粘结晶片的脱粘设备和方法
公开(公告)号：US08366873B2
公开(公告)日：2013-02-05
申请号：US13085159
申请日：2011-04-12
申请人： Gregory George
发明人： Gregory George
IPC分类号： B32B38/10
CPC分类号： B32B43/006 , B32B38/1858 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , Y10T156/1126 , Y10T156/1132 , Y10T156/1168 , Y10T156/1174 , Y10T156/1944 , Y10T156/1956 , Y10T156/1978
摘要： A debonder apparatus includes a chuck assembly, a flex plate assembly, a contact roller and a resistance roller. The chuck assembly includes a chuck and a first wafer holder holding a first wafer of a bonded wafer pair in contact with the chuck. The flex plate assembly includes a flex plate and a second wafer holder holding a second wafer of the bonded wafer pair in contact with the flex plate. The flex plate is placed above the chuck. The contact roller is arranged adjacent to a first edge of the chuck and pushes and lifts up a first edge of the flex plate, while the resistance roller traverses horizontally over the flex plate and applies a downward force upon the flex plate and thereby the bonded wafer pair delaminates along a release layer and the first and second wafers are separated from each other.
摘要翻译：脱粘器装置包括卡盘组件，挠性板组件，接触辊和电阻辊。卡盘组件包括卡盘和保持与卡盘接触的接合晶片对的第一晶片的第一晶片保持架。柔性板组件包括柔性板和保持接合晶片对的第二晶片与柔性板接触的第二晶片保持架。柔性板放置在卡盘的上方。接触辊被布置成与卡盘的第一边缘相邻并且将柔性板的第一边缘推起并提升，同时阻力辊横向于柔性板上的水平方向并且向上施加向下的力到柔性板上，从而将接合的晶片沿分离层分层，并且第一和第二晶片彼此分离。

9. 发明授权

US07948034B2 Apparatus and method for semiconductor bonding 有权
标题翻译：用于半导体结合的装置和方法
公开(公告)号：US07948034B2
公开(公告)日：2011-05-24
申请号：US11766531
申请日：2007-06-21
申请人： Gregory George , Etienne Hancock , Robert Campbell
发明人： Gregory George , Etienne Hancock , Robert Campbell
IPC分类号： H01L27/12
CPC分类号： H01L21/67092 , H01L21/187
摘要： An apparatus for bonding semiconductor structures includes equipment for positioning a first surface of a first semiconductor structure directly opposite and in contact with a first surface of a second semiconductor structure and equipment for forming a bond interface area between the first surfaces of the first and second semiconductor structures by pressing the first and second semiconductor structures together with a force column configured to apply uniform pressure to the entire bond interface area between the first surfaces.
摘要翻译：一种用于接合半导体结构的装置包括用于定位与第二半导体结构的第一表面直接相对并接触的第一半导体结构的第一表面的设备和用于在第一和第二半导体的第一表面之间形成接合界面区域的设备通过将第一和第二半导体结构与被配置为对第一表面之间的整个结合界面区域施加均匀压力的力列一起按压第一和第二半导体结构的结构。

10. 发明授权

US09064686B2 Method and apparatus for temporary bonding of ultra thin wafers 有权
标题翻译：用于临时粘合超薄晶片的方法和装置
公开(公告)号：US09064686B2
公开(公告)日：2015-06-23
申请号：US13790684
申请日：2013-03-08
申请人： Gregory George , Stefan Lutter
发明人： Gregory George , Stefan Lutter
IPC分类号： H01L21/00 , H01L21/02 , H01L21/20 , H01L21/67 , H01L21/683
CPC分类号： B32B37/0046 , B32B37/1284 , B32B37/18 , B32B2307/202 , B32B2457/14 , H01L21/0201 , H01L21/2007 , H01L21/67092 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/17
摘要： A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with the cured first adhesive layer faces down. Next, inserting the second wafer into the bonder module and placing the second wafer upon a lower chuck assembly so that the second adhesive layer faces up and is opposite to the first adhesive layer. Next, moving the lower chuck assembly upwards and bringing the second adhesive layer in contact with the cured first adhesive layer, and then curing the second adhesive layer.
摘要翻译：临时粘合第一和第二晶片的方法包括：在第一晶片的第一表面上施加第一粘合剂层，然后固化第一粘合剂层。接下来，将第二粘合剂层施加到第二晶片的第一表面上。接下来，将第一晶片插入粘合剂模块中，并通过上卡盘组件保持第一晶片，使得其第一表面与固化的第一粘合剂层面朝下。接下来，将第二晶片插入到接合器模块中，并将第二晶片放置在下卡盘组件上，使得第二粘合剂层面向上并与第一粘合剂层相对。接下来，向下移动下卡盘组件并使第二粘合剂层与固化的第一粘合剂层接触，然后固化第二粘合剂层。

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