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    • 5. 发明授权
    • Apparatus for high throughput wafer bonding
    • 高通量晶片接合装置
    • US08425715B2
    • 2013-04-23
    • US13079446
    • 2011-04-04
    • Gregory George
    • Gregory George
    • B29C65/00B29C65/08B29C45/00B29C47/00B29C43/02B29C49/00B29C51/00B29C43/10B32B37/00B30B5/02B30B5/04B30B15/34H01L21/30H01L21/46H01L21/76B29D24/00B29D29/00B28B21/36A01J21/00A01J25/12A21C3/00A21C11/00A23G1/20A23G3/02A23P1/00B28B11/08B29C55/28
    • H01L21/6719H01L21/67092
    • An industrial-scale high throughput wafer bonding apparatus includes a wafer bonder chamber extending along a main axis and comprising a plurality of chamber zones, a plurality of heater/isolator plates, a guide rod system extending along the main axis, a pair of parallel track rods extending along the main axis, and first pressure means. The chamber zones are separated from each other and thermally isolated from each other by the heater/isolator plates. The heater/isolator plates are oriented perpendicular to the main axis, are movably supported and guided by the guide rod system and are configured to move along the direction of the main axis. Each of the chamber zones is dimensioned to accommodate an aligned wafer pair and the wafer pairs are configured to be supported by the parallel track rods. The first pressure means is configured to apply a first force perpendicular to a first end heater/isolator plate. The applied first force causes the heater/isolator plates to move toward each other along the main axis and thereby causes the collapse of each chamber zone volume and the application of bonding pressure onto the wafer pairs.
    • 一种工业规模的高通量晶片接合装置,包括沿着主轴延伸的晶片接合室,包括多个室区,多个加热器/隔离板,沿主轴延伸的导杆系统,一对平行轨道 杆沿着主轴线延伸,以及第一压力装置。 室区彼此分离并通过加热器/隔离板彼此热隔离。 加热器/隔离板垂直于主轴定向,由导杆系统可移动地支撑和引导,并被构造成沿着主轴线的方向移动。 每个室区的尺寸被设计成适应对准的晶片对,并且晶片对构造成由平行轨道杆支撑。 第一压力装置构造成施加垂直于第一端加热器/隔离板的第一力。 所施加的第一力使得加热器/隔离板沿着主轴线彼此移动,从而导致每个室区域体积的崩溃以及将结合压力施加到晶片对上。
    • 8. 发明申请
    • HORIZONTAL MOLDING METHOD AND APPARATUS OF INTERIOR MATERIAL OF VEHICLE
    • 水平模制方法和车辆内部材料的设备
    • US20110266721A1
    • 2011-11-03
    • US12994888
    • 2010-05-18
    • In Ho SongJi Hyun Cho
    • In Ho SongJi Hyun Cho
    • B29C45/14B28B21/36
    • B29C45/14262B29C2045/14286B29L2031/3005
    • The present invention relates to a horizontal molding method and apparatus of an interior material of a vehicle. The horizontal molding apparatus includes a preheating means for preheating a skin material; a transfer unit formed to be movable and including fixing units for vertically attaching or detaching the preheated skin material on or from the transfer unit; a first mold disposed perpendicularly to a ground surface and including suction units for vacuum-sucking and fixing edges of the skin material transferred by the transfer unit, a base member having an embossed pattern to be printed on the skin material, fixing members for sealing an internal space between the skin material and the base member by clamping the edges of the skin material, and vacuum holes for vacuum-sucking the skin material onto the base member; a second mold disposed in parallel with the first mold and on which a base material is injected; and a mold moving means for horizontally moving one of the first and second molds and combining or separating the first and second molds to or from each other. According to the present invention, a skin material and a base material may be integrally molded by using horizontally moving molds, the skin material expanded in a preheating or heating process may be prevented from sagging downward due to its weight, and the skin material may be completely sealed so as not to be folded or wrinkled.
    • 本发明涉及一种车辆内部材料的水平成型方法和装置。 水平成型设备包括用于预热皮肤材料的预热装置; 传送单元,其形成为可移动的并且包括用于将预热的表皮材料垂直地附接或从所述转印单元上拆下的固定单元; 第一模具垂直于地面设置,并且包括用于真空吸附和固定由转印单元转印的表皮材料的边缘的抽吸单元,具有要印刷在表皮材料上的压花图案的基底构件,用于密封的固定构件 通过夹紧皮肤材料的边缘在表皮材料和基底构件之间的内部空间,以及真空孔,用于将表皮材料真空吸附到基底构件上; 第二模具,其与所述第一模具平行地设置并且在其上注入基材; 以及用于水平移动第一和第二模具中的一个并且将第一模具和第二模具彼此组合或分离的模具移动装置。 根据本发明,可以通过使用水平移动的模具将表皮材料和基材整体模制,可以防止在预热或加热过程中膨胀的表皮材料由于其重量而向下下垂,并且表皮材料可以是 完全密封,以免折叠或起皱。