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1. 发明授权

US08919412B2 Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers 有权
标题翻译：临时粘合半导体晶片的热滑脱离装置
公开(公告)号：US08919412B2
公开(公告)日：2014-12-30
申请号：US12760973
申请日：2010-04-15
申请人： Gregory George , Hale Johnson , Patrick Gorun , Emmett Hughlett , James Hermanowski , Matthew Stiles
发明人： Gregory George , Hale Johnson , Patrick Gorun , Emmett Hughlett , James Hermanowski , Matthew Stiles
IPC分类号： B32B38/10 , H01L21/67 , B32B43/00 , H01L21/683 , B32B38/18
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly. The X-axis drive control initiates horizontal motion of the X-axis carriage drive along the X-axis while heat is applied to the carrier wafer via the heater and while the carrier wafer is held by the top chuck assembly via the wafer holder and thereby causes the device wafer to separate and slide away from the carrier wafer.
摘要翻译：用于通过粘合剂层临时粘合的晶片脱粘两个的脱粘器装置包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴驱动控制。顶部卡盘组件包括加热器和晶片保持器。 X轴驱动控制器将底部卡盘组件从装载区域水平驱动到顶部卡盘组件下方的过程区域，并从工艺区域向后加载到装载区域。包括通过粘合剂层结合到器件晶片的载体晶片的晶片对被放置在位于底部卡盘组件处的负载区域处，使得器件晶片的未结合表面与底部组件接触并且由X 驱动到顶部卡盘组件下面的处理区域，并且载体晶片的未结合表面被放置成与顶部卡盘组件接触。 X轴驱动控制器启动X轴托架驱动器沿X轴的水平运动，同时通过加热器将热量施加到载体晶片上，同时通过晶片保持器将托架晶片保持在顶卡盘组件上，从而使得器件晶片分离并从载体晶片滑离。

2. 发明授权

US08267143B2 Apparatus for mechanically debonding temporary bonded semiconductor wafers 有权
标题翻译：用于机械剥离临时粘合的半导体晶片的装置
公开(公告)号：US08267143B2
公开(公告)日：2012-09-18
申请号：US12761014
申请日：2010-04-15
申请人： Gregory George , Hale Johnson , Patrick Gorun , James Hermanowski , Matthew Stiles
发明人： Gregory George , Hale Johnson , Patrick Gorun , James Hermanowski , Matthew Stiles
IPC分类号： B32B38/10
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： An apparatus for debonding two temporary bonded wafers includes a chuck assembly, a flex plate assembly and a contact roller. The chuck assembly includes a chuck and a first wafer holder to hold wafers in contact with the top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold wafers in contact with a first surface of the flex plate. The flex plate comprises a first edge arranged adjacent to a first edge of the chuck and connected to a hinge. The flex plate is configured to swing around the hinge and to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a second edge of the chuck, which is diametrically opposite to its first edge. A debond drive motor moves the contact roller vertical to the plane of the chuck top surface.
摘要翻译：用于剥离两个临时粘合晶片的装置包括卡盘组件，柔性板组件和接触辊。卡盘组件包括卡盘和第一晶片保持器，以保持晶片与卡盘的顶表面接触。柔性板组件包括柔性板和第二晶片保持器，第二晶片保持器被构造成保持与柔性板的第一表面接触的晶片。柔性板包括与卡盘的第一边缘相邻并且连接到铰链的第一边缘。柔性板被构造成围绕铰链摆动并且被放置在卡盘的顶表面之上。接触辊被布置成与卡盘的与其第一边缘径向相对的第二边缘相邻。脱粘驱动电机使接触辊垂直于卡盘顶面的平面移动。

3. 发明授权

US08181688B2 Apparatus for temporary wafer bonding and debonding 失效
标题翻译：用于临时晶圆键合和剥离的装置
公开(公告)号：US08181688B2
公开(公告)日：2012-05-22
申请号：US12760640
申请日：2010-04-15
申请人： Hale Johnson , Patrick Gorun , Emmett Hughlett , James Hermanowski , Matthew Stiles , Michael Kuhnle
发明人： Hale Johnson , Patrick Gorun , Emmett Hughlett , James Hermanowski , Matthew Stiles , Michael Kuhnle
IPC分类号： B32B38/10
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.
摘要翻译：用于临时晶片键合的改进的装置包括临时键合器簇和解粘束簇。临时粘合剂簇包括执行电子晶片接合工艺的临时粘合剂模块，包括粘合剂层粘合，粘合剂层与剥离层粘合的组合以及UV光可固化粘合剂层与激光吸收剥离层粘合的组合。脱粘聚集体包括热敏剥离器，机械剥离器和辐射剥离器。

4. 发明授权

US08764026B2 Device for centering wafers 有权
标题翻译：晶圆定心装置
公开(公告)号：US08764026B2
公开(公告)日：2014-07-01
申请号：US12761044
申请日：2010-04-15
申请人： Gregory George , Hale Johnson , Dennis Patricio
发明人： Gregory George , Hale Johnson , Dennis Patricio
IPC分类号： B23B31/18
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： A device for centering circular wafers includes a support chuck for supporting a circular wafer to be centered upon its top surface, left, right and middle centering linkage rods and a cam plate synchronizing the rectilinear motion of the left, right and middle centering linkage rods. The left centering linkage rod includes a first rotating arm at a first end and rectilinear motion of the left centering linkage rod translates into rotational motion of the first rotating arm. The right centering linkage rod comprises a second rotating arm at a first end, and rectilinear motion of the right centering linkage rod translates into rotational motion of the second rotating arm. The first and second rotating arms are rotatable around an axis perpendicular to the top surface of the support chuck and comprise a curved edge surface configured to roll against the curved edge of the circular wafer. The middle centering linkage rod includes a third alignment arm at a first end. The third alignment arm is placed in contact with the curved edge of the circular wafer and linear motion of the middle centering linkage rod in the Y-direction pushes the third alignment arm and the circular wafer toward or away from the center of the support chuck. The cam plate includes first and second linear cam profiles. The first cam profile provides rectilinear motion for the middle centering linkage rod and the second linear cam profile provides rectilinear motion for the left and right centering linkage rods.
摘要翻译：用于定心圆形晶片的装置包括支撑卡盘，用于将圆形晶片支撑在其顶部中心定位的中心，左右中心对中连杆和中心对中连杆的直线运动同步的凸轮板。左对中连杆包括在第一端处的第一旋转臂，并且左对中连杆的直线运动转换成第一旋转臂的旋转运动。右对中连杆包括在第一端的第二旋转臂，右对中连杆的直线运动转换为第二旋转臂的旋转运动。第一和第二旋转臂可绕垂直于支撑卡盘的顶表面的轴线旋转，并且包括弯曲的边缘表面，该弯曲边缘表面被配置成相对于圆形晶片的弯曲边缘滚动。中间定心连杆在第一端包括第三对准臂。第三对准臂被放置成与圆形晶片的弯曲边缘接触，并且Y中心定中心连杆的线性运动将第三对准臂和圆形晶片推向或远离支撑卡盘的中心。凸轮板包括第一和第二直线凸轮轮廓。第一凸轮轮廓为中间定心联动杆提供直线运动，第二直线凸轮轮廓为左右对中连杆提供直线运动。

5. 发明申请

US20080188072A1 APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER BUMPING VIA INJECTION MOLDED SOLDER 失效
标题翻译：通过注塑成型焊机制造半导体波形的装置和方法
公开(公告)号：US20080188072A1
公开(公告)日：2008-08-07
申请号：US12025686
申请日：2008-02-04
申请人： Hale Johnson , G. Gerard Gormley , Emmett Hughlett
发明人： Hale Johnson , G. Gerard Gormley , Emmett Hughlett
IPC分类号： H01L21/44 , C23C14/00
CPC分类号： H05K3/3478 , B23K3/0623 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/131 , H01L2224/13116 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H05K2203/0113 , H05K2203/0338 , H01L2924/0105 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/0555 , H01L2224/0556
摘要： An improved apparatus for semiconductor wafer bumping utilizes the injection molded solder process and is designed for high volume manufacturing. The apparatus includes equipment for filling patterned mold cavities on a mold structure with solder, equipment for positioning and aligning a patterned surface of a semiconductor structure directly opposite to the solder filled patterned mold cavities of the mold structure, a fixture tool for holding and transferring the aligned mold and semiconductor structures together, and equipment for receiving the fixture tool and transferring the solder from the aligned patterned mold cavities to the aligned patterned semiconductor first surface. The solder transfer equipment include a wafer heater stack configured to heat the semiconductor structure and a mold heater stack configured to heat the mold structure to a process temperature slightly above the solder's melting point. The fixture tool with the aligned mold and semiconductor structures is inserted between the wafer heater stack and the mold heater stack. A deposition chamber is formed between the wafer heater stack and the mold heater stack by sealing the wafer heater stack and the mold heater stack against the frame.
摘要翻译：用于半导体晶片凸块的改进的设备利用注射成型焊接工艺，并且被设计用于大批量制造。该装置包括用于在具有焊料的模具结构上填充图案化模腔的设备，用于定位和对准与模具结构的焊料填充的图案化模腔直接相对的半导体结构的图案化表面的设备，用于保持和转移对准的模具和半导体结构在一起，以及用于接收夹具工具并将焊料从对准的图案化模腔转移到对准的图案化半导体第一表面的设备。焊接传输设备包括被配置为加热半导体结构的晶片加热器堆叠和构造成将模具结构加热到略高于焊料熔点的工艺温度的模具加热器堆叠。具有对准的模具和半导体结构的固定工具插入在晶片加热器堆叠和模具加热器堆叠之间。通过将晶片加热器堆叠和模具加热器堆叠密封在框架上，在晶片加热器堆叠和模具加热器堆叠之间形成沉积室。

6. 发明授权

US07790596B2 Apparatus and method for semiconductor wafer bumping via injection molded solder 有权
标题翻译：通过注射成型焊料的半导体晶片凸块的装置和方法
公开(公告)号：US07790596B2
公开(公告)日：2010-09-07
申请号：US12025845
申请日：2008-02-05
申请人： Hale Johnson , Wilhelm Lapointe
发明人： Hale Johnson , Wilhelm Lapointe
IPC分类号： H01L21/00
CPC分类号： H05K3/3478 , B23K3/0623 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/131 , H01L2224/13116 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H05K2203/0113 , H05K2203/0338 , H01L2924/0105 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/0555 , H01L2224/0556
摘要： An improved apparatus for positioning and aligning a patterned surface of a semiconductor structure directly opposite to solder filled patterned mold cavities of a mold structure includes a pattern based alignment too including means for identifying a mold training pattern image and a semiconductor training pattern image on a training mold structure and a training semiconductor structure, respectively, means for training the alignment tool with the training pattern images, means for storing the alignment tool trained position, means for identifying a mold pattern image and a semiconductor pattern image on the mold structure and the semiconductor structure matching the mold training pattern image and the semiconductor training pattern image, respectively, and means for aligning the identified mold pattern image with the semiconductor pattern image.
摘要翻译：用于定位和对准与模具结构的焊料填充的图案化模腔直接相对的半导体结构的图案化表面的改进的装置包括基于图案的对准，其也包括用于在培训上识别模具训练图案图像和半导体训练图案图像的装置模具结构和训练半导体结构，分别用于训练对准工具与训练图案图像的装置，用于存储校准工具训练位置的装置，用于在模具结构和半导体上识别模具图案图像和半导体图案图像的装置分别与模具训练图案图像和半导体训练图案图像匹配的结构以及用于将所识别的模具图案与半导体图案图像对准的装置。

7. 发明授权

US07732320B2 Apparatus and method for semiconductor wafer bumping via injection molded solder 失效
标题翻译：通过注射成型焊料的半导体晶片凸块的装置和方法
公开(公告)号：US07732320B2
公开(公告)日：2010-06-08
申请号：US12025686
申请日：2008-02-04
申请人： Hale Johnson , G. Gerard Gormley , Emmett Hughlett
发明人： Hale Johnson , G. Gerard Gormley , Emmett Hughlett
IPC分类号： H01L21/44
CPC分类号： H05K3/3478 , B23K3/0623 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/131 , H01L2224/13116 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H05K2203/0113 , H05K2203/0338 , H01L2924/0105 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/0555 , H01L2224/0556
摘要： An improved apparatus for semiconductor wafer bumping utilizes the injection molded solder process and is designed for high volume manufacturing. The apparatus includes equipment for filling patterned mold cavities on a mold structure with solder, equipment for positioning and aligning a patterned surface of a semiconductor structure directly opposite to the solder filled patterned mold cavities of the mold structure, a fixture tool for holding and transferring the aligned mold and semiconductor structures together, and equipment for receiving the fixture tool and transferring the solder from the aligned patterned mold cavities to the aligned patterned semiconductor first surface. The solder transfer equipment include a wafer heater stack configured to heat the semiconductor structure and a mold heater stack configured to heat the mold structure to a process temperature slightly above the solder's melting point. The fixture tool with the aligned mold and semiconductor structures is inserted between the wafer heater stack and the mold heater stack. A deposition chamber is formed between the wafer heater stack and the mold heater stack by sealing the wafer heater stack and the mold heater stack against the frame.
摘要翻译：用于半导体晶片凸块的改进的设备利用注射成型焊接工艺，并且被设计用于大批量制造。该装置包括用于在具有焊料的模具结构上填充图案化模腔的设备，用于定位和对准与模具结构的焊料填充的图案化模腔直接相对的半导体结构的图案化表面的设备，用于保持和转移对准的模具和半导体结构在一起，以及用于接收夹具工具并将焊料从对准的图案化模腔转移到对准的图案化半导体第一表面的设备。焊接传输设备包括被配置为加热半导体结构的晶片加热器堆叠和构造成将模具结构加热到略高于焊料熔点的工艺温度的模具加热器堆叠。具有对准的模具和半导体结构的固定工具插入在晶片加热器堆叠和模具加热器堆叠之间。通过将晶片加热器堆叠和模具加热器堆叠密封在框架上，在晶片加热器堆叠和模具加热器堆叠之间形成沉积室。

8. 发明授权

US08088684B2 Apparatus and method for semiconductor wafer bumping via injection molded solder 有权
标题翻译：通过注射成型焊料的半导体晶片凸块的装置和方法
公开(公告)号：US08088684B2
公开(公告)日：2012-01-03
申请号：US12025644
申请日：2008-02-04
申请人： Hale Johnson , G. Gerard Gormley
发明人： Hale Johnson , G. Gerard Gormley
IPC分类号： H01L21/44
CPC分类号： H05K3/3478 , B23K3/0623 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/131 , H01L2224/13116 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H05K2203/0113 , H05K2203/0338 , H01L2924/0105 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/0555 , H01L2224/0556
摘要： An improved apparatus and a method for semiconductor wafer bumping, that utilizes the injection molded solder process. The apparatus is designed for high volume manufacturing and includes equipment for filling patterned mold cavities formed on a first surface of a mold structure with solder, equipment for positioning and aligning a patterned first surface of a semiconductor structure directly opposite to the solder filled patterned mold cavities of the mold structure, a fixture tool for holding and transferring the aligned mold and semiconductor structures together, and equipment for receiving the fixture tool and transferring the solder from the aligned patterned mold cavities to the aligned patterned semiconductor first surface. The fixture tool includes a frame having a central aperture dimensioned to support a substrate and one or more clamp/spacer assemblies arranged symmetrically around the frame. Each clamp/spacer assembly includes a clamp configured to clamp the aligned mold and semiconductor structures together and a spacer configured to be inserted between the semiconductor structure and the mold structure.
摘要翻译：一种用于半导体晶片凸块的改进的装置和方法，其利用注射模制的焊接工艺。该设备被设计用于大批量制造，并且包括用于填充形成在具有焊料的模具结构的第一表面上的图案化模腔的设备，用于定位和对准与填充有焊料的图案化模腔直接相对的半导体结构的图案化第一表面的设备模具结构的固定工具，用于将对准的模具和半导体结构保持和传送在一起的固定工具，以及用于接收固定工具并将焊料从对准的图案化模腔转移到对准的图案化半导体第一表面的设备。固定工具包括具有中心孔的框架，该中心孔的尺寸被设计成支撑衬底以及围绕框架对称地布置的一个或多个夹具/间隔件组件。每个夹具/间隔件组件包括被配置为将对准的模具和半导体结构夹持在一起的夹具和构造成插入在半导体结构和模具结构之间的间隔件。

9. 发明申请

US20080188069A1 APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER BUMPING VIA INJECTION MOLDED SOLDER 有权
标题翻译：通过注塑成型焊机制造半导体波形的装置和方法
公开(公告)号：US20080188069A1
公开(公告)日：2008-08-07
申请号：US12025644
申请日：2008-02-04
申请人： Hale Johnson , G. Gerard Gormley
发明人： Hale Johnson , G. Gerard Gormley
IPC分类号： H01L21/44 , B05C5/00
CPC分类号： H05K3/3478 , B23K3/0623 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/11003 , H01L2224/131 , H01L2224/13116 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H05K2203/0113 , H05K2203/0338 , H01L2924/0105 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/0555 , H01L2224/0556
摘要： An improved apparatus and a method for semiconductor wafer bumping, that utilizes the injection molded solder process. The apparatus is designed for high volume manufacturing and includes equipment for filling patterned mold cavities formed on a first surface of a mold structure with solder, equipment for positioning and aligning a patterned first surface of a semiconductor structure directly opposite to the solder filled patterned mold cavities of the mold structure, a fixture tool for holding and transferring the aligned mold and semiconductor structures together, and equipment for receiving the fixture tool and transferring the solder from the aligned patterned mold cavities to the aligned patterned semiconductor first surface. The fixture tool includes a frame having a central aperture dimensioned to support a substrate and one or more clamp/spacer assemblies arranged symmetrically around the frame. Each clamp/spacer assembly includes a clamp configured to clamp the aligned mold and semiconductor structures together and a spacer configured to be inserted between the semiconductor structure and the mold structure.
摘要翻译：一种用于半导体晶片凸块的改进的装置和方法，其利用注射模制的焊接工艺。该设备被设计用于大批量制造，并且包括用于填充形成在具有焊料的模具结构的第一表面上的图案化模腔的设备，用于定位和对准与填充有焊料的图案化模腔直接相对的半导体结构的图案化第一表面的设备模具结构的固定工具，用于将对准的模具和半导体结构保持和传送在一起的固定工具，以及用于接收固定工具并将焊料从对准的图案化模腔转移到对准的图案化半导体第一表面的设备。固定工具包括具有中心孔的框架，该中心孔的尺寸被设计成支撑衬底以及围绕框架对称地布置的一个或多个夹具/间隔件组件。每个夹具/间隔件组件包括被配置为将对准的模具和半导体结构夹持在一起的夹具和构造成插入在半导体结构和模具结构之间的间隔件。

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