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1. 发明授权

US12129144B2 Solar panel cutting unit 有权
公开(公告)号：US12129144B2
公开(公告)日：2024-10-29
申请号：US17783353
申请日：2021-09-16
申请人： WON KWANG S&T CO., LTD.
发明人： Sang Hun Lee , Jun Kee Kim , Tae Eun Lee , Cheong Min Noh
IPC分类号： B32B43/00 , B09B3/00 , B29B17/02 , B65H41/00
CPC分类号： B65H41/00 , B09B3/00 , B29B17/02 , B32B43/006 , Y10S156/922 , Y10S156/937 , Y10T156/1153 , Y10T156/1174 , Y10T156/1184 , Y10T156/1911 , Y10T156/195 , Y10T156/1956 , Y10T156/1967
摘要： A solar panel cutting unit may include a frame, a transport roller unit provided at the frame to transport, in a first direction, a solar panel having a glass plate, an adhesive layer, a solar cell layer, and a backsheet layer stacked sequentially, a heating unit to heat the solar panel, a pair of pressurization roller units to pressurize and transport the solar panel, a trimmer unit that moves in a second direction perpendicular to the first direction and removes the backsheet layer, the solar cell layer, and the adhesive layer, a peeling unit that inserts a blade into the adhesive layer of the solar panel passing by the trimmer unit and removes a flexible film to which the solar cell layer and the backsheet layer is adhered, and a collection roller that collects the flexible film peeled by the peeling unit.

2. 发明申请

US20180229487A1 EQUIPMENT SYSTEM USING ORGANIC SILICONE RESIN PHOTOCONVERTER TO BOND-PACKAGE LED BY TANDEM ROLLING 审中-公开
公开(公告)号：US20180229487A1
公开(公告)日：2018-08-16
申请号：US15750317
申请日：2015-12-18
申请人： Jiangsu Cherrity Optronics Co., Ltd
发明人： Jinhua He
IPC分类号： B32B37/00 , H01L33/00 , B32B37/08 , B32B37/20 , B32B38/00
CPC分类号： B32B37/0053 , B32B37/08 , B32B37/203 , B32B38/0004 , B32B38/10 , B32B43/006 , B32B2457/00 , H01L33/00 , H01L33/48 , H01L33/56 , H01L2933/005 , Y10T156/1153 , Y10T156/1158 , Y10T156/1174 , Y10T156/1911 , Y10T156/1917 , Y10T156/195 , Y10T156/1956
摘要： An equipment system for bond-packaging an LED using an organic silicone resin photoconverter by tandem rolling includes a protective film removing apparatus used for removing a protective film on one side of a photoconversion sheet with protective films on both sides and a roll-bonding apparatus for packaging a flip chip LED array by using the photoconversion sheet containing a protective film on a single side, to form LED package elements. The protective film removing apparatus includes a photoconversion sheet freezing part (2-1, 2-2), a traction part for pulling and removing a protective film on a single side of the frozen photoconversion sheet, and a photoconversion sheet rewarming part (4-1, 4-2) that are sequentially connected and disposed. The roll-bonding apparatus includes two single-wheeled rollers (5-1, 5-2) whose rolling surfaces are both smooth surfaces. The present invention has a significant advantage of bond-packaging an LED by using a continuous rolling process, and can satisfy a requirement of a process for bond-package an LED using an organic silicone resin photoconverter, thereby improving the production efficiency and yield of LED packages in industrialized batch production.

3. 发明授权

US09975321B2 Film peeling device 有权
公开(公告)号：US09975321B2
公开(公告)日：2018-05-22
申请号：US15467133
申请日：2017-03-23
申请人： HITACHI PLANT MECHANICS CO., LTD.
发明人： Toshiaki Ayabe , Kazuo Takahashi , Shigenori Takesue
IPC分类号： B32B38/10 , B32B43/00 , H01L21/67 , H01L21/683
CPC分类号： B32B43/006 , B32B38/10 , H01L21/67132 , H01L21/6836 , H01L2221/6834 , Y10T156/1168 , Y10T156/1174 , Y10T156/195 , Y10T156/1956 , Y10T156/1978
摘要： A film peeling device preventing deformation or other defect of substrates occurring in the process of conveying films adhered up to the substrate leading ends while peeling from the substrate, protecting the substrate from damage, and avoiding deterioration of the substrate quality. The constitution is composed of a substrate holding mechanism for holding the leading end of a substrate by linear contact, an adhering and peeling mechanism for peeling films by an adhesive force from the substrate held by the substrate holding mechanism, a film holding tool for gripping individually the leading ends of the films adhered to the substrate both sides being wound and lifted by the adhering and peeling mechanism, a film conveying unit drive mechanism for conveying the film holding tool gripping the films in the substrate opposite direction conveying direction, and a recovery container accommodating the films being gripped and conveyed by the film holding tool.

4. 发明授权

US09962914B2 Method for transferring a large-area graphene sheet 有权
公开(公告)号：US09962914B2
公开(公告)日：2018-05-08
申请号：US15002440
申请日：2016-01-21
申请人： King Abdulaziz University
发明人： Farag Saeed Marshoud Al-Hazmi , Ahmed Abdullah Salem Al-Ghamdi , Waleed Elsayed Mahmoud Elsayed
IPC分类号： B32B37/00 , B32B15/04 , B32B18/00 , H01J37/34 , B82Y30/00 , B82Y40/00
CPC分类号： B32B37/025 , B32B15/04 , B32B18/00 , B32B2311/12 , B32B2313/04 , B82Y30/00 , B82Y40/00 , C04B2237/363 , H01J37/3426 , Y10T156/17 , Y10T156/1705 , Y10T156/1956 , Y10T428/30
摘要： A method of transferring a graphene sheet comprising one or more layers of graphene formed on a metal film, such as a copper film, coating a surface of a metal or alloy substrate onto a target substrate. The method includes fixedly contacting the graphene sheet with a contacting surface of the target substrate by applying substantially uniform pressure and heat on a layered assembly. The layered assembly comprises the metal or alloy substrate, the graphene sheet, and the target substrate. At least one layer of graphene of the graphene sheet formed on the copper film coating the surface of the metal or alloy substrate is transferred onto the contacting surface of the target substrate by the substantially uniform pressure and heat, and the at least one layer of graphene forms a graphene film on the contacting surface of the target substrate.

5. 发明授权

US09937701B2 Removing unit and removing method 有权
公开(公告)号：US09937701B2
公开(公告)日：2018-04-10
申请号：US15229104
申请日：2016-08-04
申请人： Oki Data Corporation
发明人： Masanori Minato
IPC分类号： B32B38/10 , B32B43/00 , B32B37/00 , G09F3/00 , B26D7/18 , B26D3/08 , G09F3/02 , B31D1/02 , B26F1/38
CPC分类号： B32B43/006 , B26D3/08 , B26D7/18 , B26F1/38 , B31D1/02 , B31D1/021 , B31D1/026 , B32B37/0053 , B32B38/10 , G09F3/00 , G09F2003/0225 , G09F2003/0226 , G09F2003/0227 , Y10T156/1174 , Y10T156/1195 , Y10T156/195 , Y10T156/1956 , Y10T156/1994
摘要： Provided is a removing unit that includes: a first conveying roller, a second conveying roller, a third conveying roller, and a take-up roller. The first conveying roller conveys a stack including first and second base members which are removably stacked with respect to each other. The second conveying roller conveys the second base member from which the first base member has been removed. The third conveying roller conveys the first base member which has been removed from the second base member, along a surface of the first conveying roller. The take-up roller takes up the first base member which has been conveyed by the third conveying roller. The second conveying roller is provided upstream from a first tangent in a conveying direction of the first base member. The third conveying roller is provided to overlap the first tangent or provided downstream from the first tangent, in the conveying direction.

6. 发明申请

US20170326865A1 FILM PEELING DEVICE 有权
公开(公告)号：US20170326865A1
公开(公告)日：2017-11-16
申请号：US15467133
申请日：2017-03-23
申请人： HITACHI PLANT MECHANICS CO., LTD.
发明人： Toshiaki AYABE , Kazuo TAKAHASHI , Shigenori TAKESUE
IPC分类号： B32B43/00 , B32B38/10 , H01L21/67 , H01L21/683
CPC分类号： B32B43/006 , B32B38/10 , H01L21/67132 , H01L21/6836 , H01L2221/6834 , Y10T156/1168 , Y10T156/1174 , Y10T156/195 , Y10T156/1956 , Y10T156/1978
摘要： A film peeling device preventing deformation or other defect of substrates occurring in the process of conveying films adhered up to the substrate leading ends while peeling from the substrate, protecting the substrate from damage, and avoiding deterioration of the substrate quality. The constitution is composed of a substrate holding mechanism for holding the leading end of a substrate by linear contact, an adhering and peeling mechanism for peeling films by an adhesive force from the substrate held by the substrate holding mechanism, a film holding tool for gripping individually the leading ends of the films adhered to the substrate both sides being wound and lifted by the adhering and peeling mechanism, a film conveying unit drive mechanism for conveying the film holding tool gripping the films in the substrate opposite direction conveying direction, and a recovery container accommodating the films being gripped and conveyed by the film holding tool.

7. 发明授权

US09567127B2 Label separator and label printer incorporating the label separator 有权
标题翻译：标签分离器和标签打印机包含标签分离器
公开(公告)号：US09567127B2
公开(公告)日：2017-02-14
申请号：US14555744
申请日：2014-11-28
申请人： OKI DATA CORPORATION
发明人： Daichi Sato
IPC分类号： B32B38/10 , B65C9/18 , B65C9/00 , B65C9/46 , B65H20/02 , B65H29/12 , B41J17/18 , B41J17/00 , B65H16/00
CPC分类号： B65C9/1865 , B32B38/10 , B41J17/00 , B41J17/18 , B65C9/0006 , B65C9/46 , B65H16/005 , B65H20/02 , B65H29/12 , Y10T156/1174 , Y10T156/1195 , Y10T156/195 , Y10T156/1956 , Y10T156/1978 , Y10T156/1994
摘要： A medium transporting apparatus is used for transporting a label web including a carrier web and labels adhered thereto. A platen roller transports the label web in a transport path. A pressure roller is disposed downstream of the separating member with respect to the transport path, and causes the carrier web to be kinked. The pressure roller urges the carrier web against the platen roller. A support member is mounted on a cover and rotatably supports the pressure roller. The cover is pivoted between an open position and a closed. Immediately after the cover has moved to the closed position, the pressure roller contacts the platen roller and then slides by a predetermined amount on the circumferential surface of the platen roller in a direction away from the separating member. Thus, the carrier web sandwiched between the pressure and platen rollers becomes taut.
摘要翻译：介质输送装置用于输送包括载体网和附着在其上的标签的标签幅材。压纸滚筒将传送路径中的标签卷筒输送。压力辊相对于传送路径设置在分离构件的下游，并且导致载体网被扭结。压辊将承载卷筒推压在压纸辊上。支撑构件安装在盖上并可旋转地支撑压力辊。盖子在打开位置和关闭位置之间枢转。在盖已经移动到关闭位置之后，压力辊立即接触压纸辊，然后沿着远离分离件的方向在压纸辊的圆周表面上滑动预定的量。因此，夹在压力辊和压辊之间的载体网络变紧。

8. 发明授权

US09215910B2 Sole cover dispenser device 有权
标题翻译：单层盖分配器
公开(公告)号：US09215910B2
公开(公告)日：2015-12-22
申请号：US13970864
申请日：2013-08-20
申请人： Baljinder Singh Dhillon
发明人： Baljinder Singh Dhillon
IPC分类号： B32B38/10 , A43D11/00 , A43D999/00 , A43B3/16 , B32B43/00
CPC分类号： A43D11/003 , A43B3/163 , A43D999/00 , B32B38/10 , B32B43/006 , Y10T156/11 , Y10T156/1174 , Y10T156/19 , Y10T156/195 , Y10T156/1956
摘要： The present invention describes a dispenser of protective covers for the sole of a shoe. The sole covers are disposed on a sheet that is placed within the dispenser. The dispenser comprises a series of roller supports that are adapted to position the sheet of solve covers onto an exposed platform. A user steps the exposed platform in order to apply the cover to the user's footwear and remove the sole cover from the sheet. The top of the sole cover includes an adhesive that enables the cover to adhere to the sole of the user's shoe, thereby enabling a user to walk around the house while reducing the likelihood that the user would spread dirt therein.
摘要翻译：本发明描述了用于鞋底的防护罩的分配器。底盖设置在放置在分配器内的片材上。分配器包括一系列辊支撑件，其适于将解决盖板放置在暴露的平台上。用户步骤暴露的平台以便将盖子应用于用户的鞋类，并从该片材上移除鞋底盖。鞋底的顶部包括使盖能够粘附到使用者鞋的鞋底上的粘合剂，从而使得使用者能够在房屋周围走动，同时减少使用者在其中散布污物的可能性。

9. 发明授权

US08424583B2 Tape removal apparatus and process for use with an automated composite tape laying machine 有权
标题翻译：胶带去除装置和与自动化复合胶带铺设机一起使用的方法
公开(公告)号：US08424583B2
公开(公告)日：2013-04-23
申请号：US13251812
申请日：2011-10-03
申请人： Peter D. McCowin
发明人： Peter D. McCowin
IPC分类号： B32B38/10
CPC分类号： B29C70/386 , B29C70/545 , B29K2063/00 , B29K2077/10 , B29K2105/246 , B29K2709/02 , B29K2709/08 , Y10T156/1168 , Y10T156/1174 , Y10T156/1179 , Y10T156/1195 , Y10T156/19 , Y10T156/195 , Y10T156/1956 , Y10T156/1978 , Y10T156/1983 , Y10T156/1994
摘要： Apparatus are provided for attaching to a composite tape lamination machine in order to remove composite scrap tape material from a backing paper. When a moveable member is in one position composite non-scrap tape material on a backing paper is directed along a path to avoid a removing member and keep composite non-scrap tape material on a backing paper. When the moveable member is in another position composite scrap tape material on a backing paper is directed along a different path to contact the removing member and remove composite scrap tape material from a backing paper. Composite scrap tape material may be disposed in a scrap disposal member. Backing paper having attached composite non-scrap tape material and not having attached composite scrap tape material may be spooled using a spool roller.
摘要翻译：提供了用于附接到复合胶带层压机的设备，以便从背纸去除复合废料带材料。当可移动构件处于一个位置时，背衬纸上的复合非废料带材料沿着路径被引导以避免移除构件并将复合非废料带材料保持在背衬纸上。当可移动构件处于另一位置时，背衬纸上的复合废料带材料沿着不同的路径被引导以接触去除构件并从背衬纸上去除复合废料带材料。复合废料带材料可以设置在废料处理部件中。具有附着的复合非废料带材料并且不具有附接的复合废料带材料的背衬纸可以使用卷轴卷绕。

10. 发明授权

US08171977B2 Sheet peeling apparatus and peeling method 有权
标题翻译：薄片剥离装置和剥离方法
公开(公告)号：US08171977B2
公开(公告)日：2012-05-08
申请号：US13062409
申请日：2009-08-27
申请人： Kenji Kobayashi
发明人： Kenji Kobayashi
IPC分类号： B32B38/10
CPC分类号： H01L21/67132 , Y10S156/93 , Y10S156/941 , Y10T156/1168 , Y10T156/1174 , Y10T156/15 , Y10T156/195 , Y10T156/1956 , Y10T156/1978
摘要： A sheet peeling apparatus 10 comprises: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a feeding means 12 for feeding out a peeling tape T; a sticking means 14 for sticking the peeling tape T to the adhesive sheet S; a holding means 15 for holding a tip side in a feeding direction of the peeling tape T; and a peeling means 16 for imparting a peeling force to the adhesive sheet S. The peeling means 16 includes a peeling roller 44, and the peeling roller 44 abuts against an adhesive agent layer side of the peeling tape T stuck on the adhesive sheet S, and peeling off the adhesive sheet S in a state in which a turned-back portion c is formed by turning back a peeled end side of the adhesive sheet S.
摘要翻译：片材剥离装置10包括：用于支撑粘贴有粘合片S的半导体晶片W的支撑装置11; 用于输送剥离带T的进给装置12; 用于将剥离带T粘贴到粘合片S上的粘贴装置14; 保持装置15，其用于在剥离带T的进给方向上保持前端侧; 以及用于对粘合片S施加剥离力的剥离装置16.剥离装置16包括剥离辊44，剥离辊44与粘附在粘合片S上的剥离带T的粘合剂层侧抵接，并且通过转回粘合片S的剥离端侧而形成折回部c的状态下剥离粘合片S.

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