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    • 9. 发明授权
    • Sheet peeling apparatus and peeling method
    • 薄片剥离装置和剥离方法
    • US08171977B2
    • 2012-05-08
    • US13062409
    • 2009-08-27
    • Kenji Kobayashi
    • Kenji Kobayashi
    • B32B38/10
    • H01L21/67132Y10S156/93Y10S156/941Y10T156/1168Y10T156/1174Y10T156/15Y10T156/195Y10T156/1956Y10T156/1978
    • A sheet peeling apparatus 10 comprises: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a feeding means 12 for feeding out a peeling tape T; a sticking means 14 for sticking the peeling tape T to the adhesive sheet S; a holding means 15 for holding a tip side in a feeding direction of the peeling tape T; and a peeling means 16 for imparting a peeling force to the adhesive sheet S. The peeling means 16 includes a peeling roller 44, and the peeling roller 44 abuts against an adhesive agent layer side of the peeling tape T stuck on the adhesive sheet S, and peeling off the adhesive sheet S in a state in which a turned-back portion c is formed by turning back a peeled end side of the adhesive sheet S.
    • 片材剥离装置10包括:用于支撑粘贴有粘合片S的半导体晶片W的支撑装置11; 用于输送剥离带T的进给装置12; 用于将剥离带T粘贴到粘合片S上的粘贴装置14; 保持装置15,其用于在剥离带T的进给方向上保持前端侧; 以及用于对粘合片S施加剥离力的剥离装置16.剥离装置16包括剥离辊44,剥离辊44与粘附在粘合片S上的剥离带T的粘合剂层侧抵接, 并且通过转回粘合片S的剥离端侧而形成折回部c的状态下剥离粘合片S.