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1. 发明授权

US09827756B2 Separation apparatus, separation system, and separation method 有权
公开(公告)号：US09827756B2
公开(公告)日：2017-11-28
申请号：US14009850
申请日：2012-03-16
申请人： Osamu Hirakawa , Masaru Honda , Xavier Francois Brun , Charles Wayne Singleton, Jr.
发明人： Osamu Hirakawa , Masaru Honda , Xavier Francois Brun , Charles Wayne Singleton, Jr.
IPC分类号： B32B38/10 , H01L21/67 , H01L21/677 , B32B43/00
CPC分类号： B32B38/10 , B32B43/006 , B32B2457/14 , H01L21/67092 , H01L21/67109 , H01L21/6715 , H01L21/67748 , Y10T156/1137 , Y10T156/1153 , Y10T156/1189 , Y10T156/1911 , Y10T156/1939 , Y10T156/1972
摘要： A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate includes: a first holding unit that includes a heating mechanism heating the processing target substrate and holds the processing target substrate; a second holding unit that includes a heating mechanism heating the supporting substrate and holds the supporting substrate; a moving mechanism that relatively moves at least the first holding unit or the second holding unit in a horizontal direction; and a porous part that is annularly provided along an outer peripheral portion of the first holding unit and formed with a plurality of pores, and supplies an inert gas to the outer peripheral portion of the first holding unit holding the processing target substrate.

2. 发明授权

US09272431B2 Polarizing sheet removing tool and removing method 有权
标题翻译：偏光片去除工具和去除方法
公开(公告)号：US09272431B2
公开(公告)日：2016-03-01
申请号：US14637411
申请日：2015-03-04
申请人： Shenzhen China Star Optoelectronics Technology Co., LTD.
发明人： Yizhuang Zhuang , Jungmao Tsai , Shiueshih Liao , Songxian Wen , Mingfeng Deng
IPC分类号： B32B38/10 , B26D3/28 , G02F1/1335 , B26B27/00 , B26D7/08 , B32B43/00 , G02F1/13
CPC分类号： B26D3/28 , B26B27/00 , B26D7/08 , B32B38/10 , B32B43/006 , G02F1/1303 , G02F1/1309 , G02F1/133528 , G02F2202/28 , Y10S156/934 , Y10S156/937 , Y10T83/0443 , Y10T156/1111 , Y10T156/1126 , Y10T156/1132 , Y10T156/1168 , Y10T156/1184 , Y10T156/1189 , Y10T156/1928 , Y10T156/1933 , Y10T156/1961 , Y10T156/1967 , Y10T156/1972
摘要： A method is provided for removing a polarizing sheet with a tool that includes a handle including a main body forming therein a channel for receiving adhesive dissolving liquid, a piston device mounted inside the channel, and a guide tube mounted on the main body, and a blade mounted to the handle. The guide tube has an end in communication with the channel and an opposite end positioned on the blade to guide the adhesive dissolving liquid from the channel to the blade. The polarizing sheet is removed by lifting up a portion of the polarizing sheet and placing the blade against bonding adhesive between the polarizing sheet and a substrate to which the polarizing sheet is attached to allow the adhesive dissolving liquid to be guided by the guide tube toward the blade for subsequently flowing toward and dissolving bonding adhesive.
摘要翻译：提供了一种用于通过工具去除偏光片的方法，所述工具包括手柄，该手柄包括主体，其中形成有用于接收粘合剂溶解液的通道，安装在通道内的活塞装置和安装在主体上的引导管，刀片安装在手柄上。引导管具有与通道连通的端部和位于叶片上的相对端，以将粘合剂溶解液体从通道引导到叶片。通过提起偏振片的一部分并且将片材抵接在偏光片和附接有偏振片的基板之间的粘合剂来移除偏光片，以使粘合剂溶解液体被引导管朝向用于随后流动并溶解粘结粘合剂。

3. 发明授权

US09169034B2 Label application devices 有权
标题翻译：标签应用设备
公开(公告)号：US09169034B2
公开(公告)日：2015-10-27
申请号：US14321133
申请日：2014-07-01
申请人： Richard Jackson , Kevin Nobbs
发明人： Richard Jackson , Kevin Nobbs
IPC分类号： B65C9/40 , B65C9/00 , B65C9/46 , B65C9/26 , B41J3/407 , B65C9/18
CPC分类号： B65C9/40 , B41J3/4075 , B65C9/00 , B65C9/0006 , B65C9/1803 , B65C9/26 , B65C9/46 , B65C2009/408 , Y10T156/1168 , Y10T156/1179 , Y10T156/1189 , Y10T156/1195 , Y10T156/1705 , Y10T156/1707 , Y10T156/171 , Y10T156/19 , Y10T156/1978 , Y10T156/1983 , Y10T156/1994
摘要： Label application devices and methods of printing and applying labels are described herein. One label application device can comprise a feed component configured to deliver a sheet of label material to a position, a product identification component configured to identify a type of a product that is approaching the position, a printing component configured to print data onto the sheet of label material, the data based on the identified type of product, a stripping component configured to remove a liner portion of the sheet of label material from a label portion of the sheet, and an applicator component configured to apply the label portion to the product.
摘要翻译：本文描述了标签应用设备和打印和应用标签的方法。一个标签应用设备可以包括被配置为将标签材料片材递送到位置的馈送部件，被配置为识别接近该位置的产品的类型的产品识别部件，配置成将数据打印到片材上的打印部件标签材料，基于所识别的产品类型的数据，被配置为从片材的标签部分去除标签材料片的衬里部分的剥离部件以及被配置为将标签部分应用于产品的涂抹器部件。

4. 发明授权

US08991463B2 Film peeling apparatus and film peeling method using the same 有权
标题翻译：薄膜剥离装置及使用其的薄膜剥离方法
公开(公告)号：US08991463B2
公开(公告)日：2015-03-31
申请号：US13760228
申请日：2013-02-06
申请人： Il-Young Jeong , Gyoo-Wan Han , Jeong-Hun Woo
发明人： Il-Young Jeong , Gyoo-Wan Han , Jeong-Hun Woo
IPC分类号： B32B38/10 , B32B43/00 , B29C63/00
CPC分类号： B32B43/006 , B29C63/0013 , B32B2457/20 , Y10T156/11 , Y10T156/1132 , Y10T156/1174 , Y10T156/1179 , Y10T156/1189 , Y10T156/1944 , Y10T156/195 , Y10T156/1972 , Y10T156/1983
摘要： A film peeling apparatus includes a peeling pin that push-lifts a first end portion of a cut portion of a film toward a second end portion of the cut portion, a peeling roller that push-lifts the second end portion of the cut portion toward the first end portion of the cut portion by closely contacting the second end portion of the cut portion and rotating, and an absorbing unit that absorbs and removes the cut portion of the film push-lifted by the peeling pin and peeling roller.
摘要翻译：薄膜剥离装置包括剥离销，其将薄膜的切割部分的第一端部向切割部分的第二端部提升;剥离辊，其将切割部分的第二端部朝着通过紧密接触切割部分的第二端部并旋转，切割部分的第一端部和吸收单元，其吸收并移除由剥离销和剥离辊推动的膜的切割部分。

5. 发明授权

US08959872B2 Systems, methods, and components for the construction and disassembly of raised panel assemblies 有权
标题翻译：用于构建和拆卸凸起面板组件的系统，方法和组件
公开(公告)号：US08959872B2
公开(公告)日：2015-02-24
申请号：US13930442
申请日：2013-06-28
申请人： The Boeing Company
发明人： Stephen William Ayres , Ralph David Druckman , Paul Henry Allen , Scott Allen Ziemann , Michael C. Esposito
IPC分类号： E04B1/68 , E04F15/14 , B29D99/00 , B64C1/18
CPC分类号： B29D99/001 , B64C1/066 , B64C1/18 , E04F15/02435 , E04F21/0038 , E04F21/1652 , Y10T156/1189
摘要： Systems, methods, and components for the construction and disassembly of raised panel assemblies. These systems, methods, and components may include a flow-limiting structure that is configured to define at least one boundary of a channel that includes at least a portion of a gap between adjacent raised panels and is configured to receive a sealant material. The flow-limiting structure may limit a flow of the sealant material therepast, thereby decreasing an overall volume of sealant material needed for construction of the raised panel assembly and/or limiting undesired adhesion of the raised panels to other structures. These systems, methods, and components also may include an elongate disassembly aid that is configured to sever at least a portion of the sealant material from between adjacent raised panels upon removal from the raised panel assembly, such as to decrease a time needed for disassembly and/or repair of the raised panel assembly.
摘要翻译：用于构建和拆卸凸起面板组件的系统，方法和组件。这些系统，方法和组件可以包括限流结构，其被配置为限定通道的至少一个边界，该通道包括相邻凸起面板之间的间隙的至少一部分，并被配置为接收密封剂材料。流动限制结构可能限制密封剂材料的流动，从而减少用于构造凸起面板组件所需的密封剂材料的总体积和/或限制凸起面板对其它结构的不期望的粘附。这些系统，方法和组件还可以包括细长的拆卸辅助装置，其被配置为在从凸起的面板组件移除时从相邻的凸起面板之间切断至少一部分密封材料，以减少拆卸所需的时间， /或升高的面板组件的修理。

6. 发明授权

US08945344B2 Systems and methods of separating bonded wafers 有权
标题翻译：分离粘结晶片的系统和方法
公开(公告)号：US08945344B2
公开(公告)日：2015-02-03
申请号：US13554751
申请日：2012-07-20
申请人： Xin-Hua Huang , Ping-Yin Liu , Hung-Hua Lin , Yuan-Chih Hsieh , Lan-Lin Chao , Chia-Shiung Tsai
发明人： Xin-Hua Huang , Ping-Yin Liu , Hung-Hua Lin , Yuan-Chih Hsieh , Lan-Lin Chao , Chia-Shiung Tsai
IPC分类号： B32B38/10
CPC分类号： H01L21/67092 , Y10T156/11 , Y10T156/1132 , Y10T156/1153 , Y10T156/1189 , Y10T156/1911 , Y10T156/1944 , Y10T156/1972
摘要： Systems and methods of separating bonded wafers are disclosed. In one embodiment, a system for separating bonded wafers includes a support for the bonded wafers and means for applying a sheer force to the bonded wafers. The system also includes means for applying a vacuum to the bonded wafers.
摘要翻译：公开了分离键合晶片的系统和方法。在一个实施例中，用于分离接合的晶片的系统包括用于接合的晶片的支撑件和用于向结合的晶片施加纯粹的力的装置。该系统还包括用于向接合晶片施加真空的装置。

7. 发明授权

US08932432B2 Substrate separating apparatus, load lock apparatus, substrate bonding apparatus, substrate separating method, and manufacturing method of a semiconductor apparatus 有权
标题翻译：基板分离装置，装载锁定装置，基板接合装置，基板分离方法以及半导体装置的制造方法
公开(公告)号：US08932432B2
公开(公告)日：2015-01-13
申请号：US13594151
申请日：2012-08-24
申请人： Keiichi Tanaka , Masahiro Yoshihashi
发明人： Keiichi Tanaka , Masahiro Yoshihashi
IPC分类号： B32B38/10 , H01L21/67
CPC分类号： H01L21/67092 , H01L21/67748 , H01L21/68742 , Y10S156/932 , Y10S156/943 , Y10T156/11 , Y10T156/1132 , Y10T156/1168 , Y10T156/1179 , Y10T156/1189 , Y10T156/19 , Y10T156/1944 , Y10T156/1972 , Y10T156/1983
摘要： A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder.
摘要翻译：衬底分离方法包括：在预定位置保持夹在第一保持器和彼此相对的第二保持器之间的衬底; 并且当所述基板保持在所述预定位置时相对移动所述第一保持器和所述第二保持器。在保持基板时，通过对基板施加加压力或吸力将基板保持在预定位置。同样在保持基板的同时，基板可以保持与第一保持器和第二保持器中的一个保持接触。

8. 发明授权

US08919412B2 Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers 有权
标题翻译：临时粘合半导体晶片的热滑脱离装置
公开(公告)号：US08919412B2
公开(公告)日：2014-12-30
申请号：US12760973
申请日：2010-04-15
申请人： Gregory George , Hale Johnson , Patrick Gorun , Emmett Hughlett , James Hermanowski , Matthew Stiles
发明人： Gregory George , Hale Johnson , Patrick Gorun , Emmett Hughlett , James Hermanowski , Matthew Stiles
IPC分类号： B32B38/10 , H01L21/67 , B32B43/00 , H01L21/683 , B32B38/18
CPC分类号： H01L21/6835 , B32B38/1858 , B32B43/006 , B32B2309/105 , B32B2457/14 , H01L21/67092 , H01L21/67132 , H01L21/673 , H01L2221/68318 , H01L2221/68327 , Y10S156/93 , Y10S156/932 , Y10S156/941 , Y10S156/942 , Y10S156/943 , Y10T29/49817 , Y10T29/53274 , Y10T156/1132 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1189 , Y10T156/1911 , Y10T156/1917 , Y10T156/1944 , Y10T156/1972 , Y10T156/1978 , Y10T279/18 , Y10T279/21 , Y10T279/26 , Y10T279/29
摘要： A debonder apparatus for debonding two via an adhesive layer temporary bonded wafers includes a top chuck assembly, a bottom chuck assembly, a static gantry supporting the top chuck assembly, an X-axis carriage drive supporting the bottom chuck assembly, and an X-axis drive control. The top chuck assembly includes a heater and a wafer holder. The X-axis drive control drives horizontally the bottom chuck assembly from a loading zone to a process zone under the top chuck assembly and from the process zone back to the loading zone. A wafer pair comprising a carrier wafer bonded to a device wafer via an adhesive layer is placed upon the bottom chuck assembly at the loading zone oriented so that the unbonded surface of the device wafer is in contact with the bottom assembly and is carried by the X-axis carriage drive to the process zone under the top chuck assembly and the unbonded surface of the carrier wafer is placed in contact with the top chuck assembly. The X-axis drive control initiates horizontal motion of the X-axis carriage drive along the X-axis while heat is applied to the carrier wafer via the heater and while the carrier wafer is held by the top chuck assembly via the wafer holder and thereby causes the device wafer to separate and slide away from the carrier wafer.
摘要翻译：用于通过粘合剂层临时粘合的晶片脱粘两个的脱粘器装置包括顶部卡盘组件，底部卡盘组件，支撑顶部卡盘组件的静态机架，支撑底部卡盘组件的X轴托架驱动器和X轴驱动控制。顶部卡盘组件包括加热器和晶片保持器。 X轴驱动控制器将底部卡盘组件从装载区域水平驱动到顶部卡盘组件下方的过程区域，并从工艺区域向后加载到装载区域。包括通过粘合剂层结合到器件晶片的载体晶片的晶片对被放置在位于底部卡盘组件处的负载区域处，使得器件晶片的未结合表面与底部组件接触并且由X 驱动到顶部卡盘组件下面的处理区域，并且载体晶片的未结合表面被放置成与顶部卡盘组件接触。 X轴驱动控制器启动X轴托架驱动器沿X轴的水平运动，同时通过加热器将热量施加到载体晶片上，同时通过晶片保持器将托架晶片保持在顶卡盘组件上，从而使得器件晶片分离并从载体晶片滑离。

9. 发明申请

US20140216629A1 LABEL APPLICATION DEVICES 有权
公开(公告)号：US20140216629A1
公开(公告)日：2014-08-07
申请号：US13758748
申请日：2013-02-04
申请人： Richard Jackson , Kevin Nobbs
发明人： Richard Jackson , Kevin Nobbs
IPC分类号： B65C9/00 , B65C9/46
CPC分类号： B65C9/40 , B41J3/4075 , B65C9/00 , B65C9/0006 , B65C9/1803 , B65C9/26 , B65C9/46 , B65C2009/408 , Y10T156/1168 , Y10T156/1179 , Y10T156/1189 , Y10T156/1195 , Y10T156/1705 , Y10T156/1707 , Y10T156/171 , Y10T156/19 , Y10T156/1978 , Y10T156/1983 , Y10T156/1994
摘要： Label application devices and methods of printing and applying labels are described herein. One label application device can comprise a feed component configured to deliver a sheet of label material to a position, a product identification component configured to identify a type of a product that is approaching the position, a printing component configured to print data onto the sheet of label material, the data based on the identified type of product, a stripping component configured to remove a liner portion of the sheet of label material from a label portion of the sheet, and an applicator component configured to apply the label portion to the product.

10. 发明授权

US08771456B2 Method of manufacturing a semiconductor device and substrate separating apparatus 有权
标题翻译：半导体装置及基板分离装置的制造方法
公开(公告)号：US08771456B2
公开(公告)日：2014-07-08
申请号：US13790266
申请日：2013-03-08
申请人： Kabushiki Kaisha Toshiba
发明人： Noriko Shimizu , Shinya Takyu
IPC分类号： B29C65/52 , B29C65/54 , B29C63/48 , B32B37/12 , B32B37/26 , B32B38/10 , B32B43/00 , H01L21/67 , H01L21/683 , B29C65/02 , B29C65/48 , B29C65/00 , B32B7/06 , B32B38/00 , B32B38/18
CPC分类号： H01L21/67092 , B29C65/02 , B29C65/48 , B29C66/004 , B32B7/06 , B32B37/26 , B32B38/0004 , B32B38/10 , B32B38/185 , B32B43/006 , H01L21/02021 , H01L21/31133 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/1052 , Y10T156/1111 , Y10T156/1189 , Y10T156/1994
摘要： According to one embodiment, there is disclosed a method of manufacturing a semiconductor device forming a release layer on a region excluding a peripheral edge portion of a surface of a first substrate, bonding a second substrate to at least a region including the release layer of the surface of the first substrate via an adhesive layer, removing physically a peripheral edge portion of the second substrate in a manner that at least a surface of the adhesive layer right under the peripheral edge portion of the second substrate is exposed, the adhesive layer is caused to remain between the peripheral edge portion of the first substrate and the second substrate, and adhesion between the first and second substrates is maintained, and then dissolving the adhesive layer.
摘要翻译：根据一个实施方案，公开了一种制造半导体器件的方法，所述半导体器件在除了第一衬底的表面的周边部分之外的区域上形成剥离层，将第二衬底粘结到至少包括所述剥离层的剥离层的区域通过粘合剂层将第一基板的表面以物理上的方式去除第二基板的周边部分，使得至少在第二基板的周缘部分的正下方的粘合剂层的表面露出，从而引起粘合剂层保持在第一基板的周边部分和第二基板之间，并且保持第一和第二基板之间的粘合，然后溶解粘合剂层。

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