专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06648485B1 Highly collimating tapered light guide for uniform illumination of flat panel displays 有权
标题翻译：高准直锥形光导，用于平板显示器的均匀照明
公开(公告)号：US06648485B1
公开(公告)日：2003-11-18
申请号：US09711041
申请日：2000-11-13
申请人： Evan G. Colgan , Fuad E. Doany , Akiko Nishikai , Rama N. Singh , Masaru Suzuki , Yoichi Taira
发明人： Evan G. Colgan , Fuad E. Doany , Akiko Nishikai , Rama N. Singh , Masaru Suzuki , Yoichi Taira
IPC分类号： F21V704
CPC分类号： G02B6/0016 , G02B6/0031 , G02B6/0046
摘要： A light guide system has a light guide having a first end portion opposite a second end portion. The light guide provides a first surface and a second surface between the first and second end portions, and the second surface is inclined relative to the first surface. A light source is disposed along the first end portion on a first axis. A light redistribution device is disposed on an entrance of the light guide for receiving light from the light source and redistributing a portion of the light perpendicular to the first axis to provide a uniform light distribution from the first surface.
摘要翻译：导光系统具有导光体，该导光体具有与第二端部相对的第一端部。光导件在第一和第二端部之间提供第一表面和第二表面，并且第二表面相对于第一表面倾斜。光源沿着第一端部设置在第一轴上。光再分配装置设置在光导的入口处，用于接收来自光源的光并且重新分配垂直于第一轴的光的一部分以提供从第一表面均匀的光分布。

2. 发明授权

US5597222A Optical relay lens system for projection displays 失效
标题翻译：用于投影显示的光学中继透镜系统
公开(公告)号：US5597222A
公开(公告)日：1997-01-28
申请号：US373696
申请日：1995-01-17
申请人： Fuad E. Doany , Rama N. Singh
发明人： Fuad E. Doany , Rama N. Singh
IPC分类号： G02B13/00 , G03B21/14
CPC分类号： H04N9/3152 , G02B13/0095 , H04N9/3105
摘要： A projection display which includes reflective light valves such as liquid crystal spatial light modulators, and a 1.times. optical relay lens system. The 1.times. optical relay lens system eliminates the requirement for a projection lens having a large retrofocus distance. Projection displays based upon reflective liquid crystal light valves (spatial light modulators) require dichroic beam splitters necessary for color separation and a polarizing beam splitter necessary for light valve operation positioned between the light valves and the projection lens. The 1.times. optical relay lens produces a relayed intermediate image of the light valves, and incorporates therein the dichroic beam splitters and the polarizing beam splitter. The 1.times. optical relay lens produces an intermediate image which is projected by the projection lens at a given magnification with minimal working distance, which results in relatively less residual lateral color and an inexpensive projection lens.
摘要翻译：包括诸如液晶空间光调制器的反射光阀和1x光学中继透镜系统的投影显示器。 1x光学中继透镜系统消除了对具有大的后向聚焦距离的投影透镜的要求。基于反射型液晶光阀（空间光调制器）的投影显示器需要用于分色所需的二向色分束器和位于光阀和投影透镜之间的光阀操作所需的偏振分束器。 1x光学中继透镜产生光阀的中继中间图像，并且其中包括二向色分束器和偏振分束器。 1x光学中继透镜产生中间图像，该中间图像由投影透镜以给定的放大倍率投影，工作距离最小，这导致相对较少的剩余侧面颜色和便宜的投影透镜。

3. 发明授权

US07097884B2 Stability of ion beam generated alignment layers by surface modification 失效
公开(公告)号：US07097884B2
公开(公告)日：2006-08-29
申请号：US10606523
申请日：2003-06-26
申请人： Alessandro C. Callegari , Praveen Chaudhari , Fuad E. Doany , James P. Doyle , Eileen A. Galligan , James H. Glownia , Gareth G. Hougham , James A. Lacey , Shui-Chih Lien , Minhua Lu , Alan E. Rosenbluth , Kei-Hsiung Yang
发明人： Alessandro C. Callegari , Praveen Chaudhari , Fuad E. Doany , James P. Doyle , Eileen A. Galligan , James H. Glownia , Gareth G. Hougham , James A. Lacey , Shui-Chih Lien , Minhua Lu , Alan E. Rosenbluth , Kei-Hsiung Yang
IPC分类号： C23C14/02 , C23C14/14 , C23C14/48 , C23C14/58 , G02F1/1337
CPC分类号： G02F1/13378
摘要： A method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions, and reactive gas is introduced to the ion beam to saturate dangling bonds on the surface. Another method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions and quenched with a reactive component to saturate dangling bonds on the surface.

4. 发明授权

US5433631A Flex circuit card elastomeric cable connector assembly 失效
公开(公告)号：US5433631A
公开(公告)日：1995-07-18
申请号：US268907
申请日：1994-06-29
申请人： Brian S. Beaman , Fuad E. Doany , Thomas J. Dudek , Alphonso P. Lanzetta , Da-Yuan Shih , William J. Tkazyik , George F. Walker
发明人： Brian S. Beaman , Fuad E. Doany , Thomas J. Dudek , Alphonso P. Lanzetta , Da-Yuan Shih , William J. Tkazyik , George F. Walker
IPC分类号： H01R12/71 , H01R12/79 , H01R24/00 , H01R9/09
CPC分类号： H01R12/714 , H01R12/79
摘要： A flex circuit card with an elastomeric cable connector assembly is provided for transmitting high speed signals between two or more printed circuit boards in a high performance computer system. The flex circuit card connects a cable assembly to a printed circuit board. A conductor trace in the flex circuit card extends into an elastomeric end and terminates with a ball shaped contact which is angled to wipe against mating pads on the printed circuit card for making electrical contact. The cable assembly uses multiple wires attached to a plurality of elastomeric connectors. At least one elastomeric connector is attached to each end of the cable assembly and each elastomeric connector has a plurality of contacts which are used to mate with a plurality of pads on the surface of the printed circuit board. The elastomeric connector described in the present invention provides a high density, cable-to-board interconnection that is perpendicular to the surface of the printed circuit board.

5. 发明授权

US5258236A Multi-layer thin film structure and parallel processing method for fabricating same 失效
标题翻译：多层薄膜结构及其制造方法
公开(公告)号：US5258236A
公开(公告)日：1993-11-02
申请号：US695368
申请日：1991-05-03
申请人： Gnanalingam Arjavalingam , Alina Deutsch , Fuad E. Doany , Bruce K. Furman , Donald J. Hunt , Chandrasekhar Narayan , Modest M. Oprysko , Sampath Purushothaman , Vincent Ranieri , Stephen Renick , Jane M. Shaw , Janusz S. Wilczynski , David F. Witman
发明人： Gnanalingam Arjavalingam , Alina Deutsch , Fuad E. Doany , Bruce K. Furman , Donald J. Hunt , Chandrasekhar Narayan , Modest M. Oprysko , Sampath Purushothaman , Vincent Ranieri , Stephen Renick , Jane M. Shaw , Janusz S. Wilczynski , David F. Witman
IPC分类号： B23K26/00 , B32B37/00 , H01L21/68 , H01L23/12 , H01L23/15 , H05K3/00 , H05K3/46 , B32B15/04 , H01L29/12
CPC分类号： H01L21/6835 , H01L2221/68345 , H01L2221/68359 , H05K3/0011 , H05K3/46 , Y10T156/1158 , Y10T428/12528 , Y10T428/12549 , Y10T428/12569 , Y10T428/12611
摘要： A method and apparatus for releasing a workpiece from a substrate including providing a substrate which is transparent to a predetermined wavelength of electromagnetic radiation; forming, on the substrate, a separation layer which degrades in response to the predetermined radiation; providing the workpiece on the separation layer; and directing the predetermined radiation at the separation layer through the transparent substrate so as to degrade the separation layer and to separate the workpiece from the substrate.
摘要翻译：一种用于从衬底释放工件的方法和装置，包括提供对预定波长的电磁辐射是透明的衬底; 在衬底上形成响应于预定辐射而降解的分离层; 在分离层上提供工件; 并且通过透明基板将分离层处的预定辐射引导，以使分离层退化并将工件与基板分离。

6. 发明申请

US20120159782A1 OPTICAL ALIGNMENT MODULE UTILIZING TRANSPARENT RETICLE TO FACILITATE TOOL CALIBRATION DURING HIGH TEMPERATURE PROCESS 失效
标题翻译：光学对准模块在高温过程中利用透明工具进行工具校准
公开(公告)号：US20120159782A1
公开(公告)日：2012-06-28
申请号：US13410853
申请日：2012-03-02
申请人： Fuad E. Doany , Andrew D. Perez , Niranjana Ruiz , Lavanya Turlapati
发明人： Fuad E. Doany , Andrew D. Perez , Niranjana Ruiz , Lavanya Turlapati
IPC分类号： H05K3/30
CPC分类号： H05K3/303 , H05K3/3436 , H05K2201/10734 , H05K2203/166 , Y02P70/613 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53087 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187
摘要： An apparatus and method for aligning one or more components while attaching the component to a substrate. The component is positioned over the substrate. An alignment tool is attachable to the component. The alignment tool includes a tool alignment element, an optical tool, and a substrate alignment element attached to the substrate. The tool alignment element aligns with the substrate alignment element such that the components are positioned at specified locations on the substrate for attachment to the substrate. Further, in the method according to the disclosure, the tool alignment element aligns with the substrate alignment element to position one or more components at a specified location on the substrate.
摘要翻译：一种用于在将组件附着到基底上时对准一个或多个部件的装置和方法。组件位于衬底上。对齐工具可附接到组件。对准工具包括工具对准元件，光学工具和附着到基板的衬底对准元件。刀具对准元件与衬底对准元件对齐，使得元件被定位在衬底上的特定位置以附着于衬底。此外，在根据本公开的方法中，工具对准元件与衬底对准元件对准以将一个或多个部件定位在衬底上的指定位置。

7. 发明授权

US07560794B2 DUV laser annealing and stabilization of SiCOH films 失效
标题翻译： DUV激光退火和SiCOH膜的稳定化
公开(公告)号：US07560794B2
公开(公告)日：2009-07-14
申请号：US11693409
申请日：2007-03-29
申请人： Alessandro C. Callegari , Stephen A. Cohen , Fuad E. Doany
发明人： Alessandro C. Callegari , Stephen A. Cohen , Fuad E. Doany
IPC分类号： H01L29/00
CPC分类号： H01L21/76801 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02274 , H01L21/02348 , H01L21/02354 , H01L21/268 , H01L21/3122 , H01L21/31633 , H01L21/76825 , H01L21/76829 , H01L21/76832 , H01L21/76834 , H01L21/76835 , Y10T428/249978
摘要： A method of fabricating a dielectric film comprising atoms of Si, C, O and H (hereinafter SiCOH) that has improved insulating properties as compared with prior art dielectric films, including prior art SiCOH dielectric films that are not subjected to the inventive deep ultra-violet (DUV) is disclosed. The improved properties include reduced current leakage which is achieved without adversely affecting (increasing) the dielectric constant of the SiCOH dielectric film. In accordance with the present invention, a SiCOH dielectric film exhibiting reduced current leakage and improved reliability is obtained by subjecting an as deposited SiCOH dielectric film to a DUV laser anneal. The DUV laser anneal step of the present invention likely removes the weakly bonded C from the film, thus improving leakage current.
摘要翻译：与现有技术的电介质膜相比，包括具有改进的绝缘性能的Si，C，O和H原子（以下称为SiCOH）的电介质膜的制造方法，包括不经受本发明的深超极化的现有技术的SiCOH介电膜，紫色（DUV）。改进的性能包括减少的电流泄漏，其不会不利地影响（增加）SiCOH介电膜的介电常数。根据本发明，通过使沉积的SiCOH电介质膜进行DUV激光退火，获得了表现出减小的电流泄漏和改进的可靠性的SiCOH电介质膜。本发明的DUV激光退火工序可能从膜中除去弱结合的C，从而提高漏电流。

8. 发明授权

US5569501A Diamond-like carbon films from a hydrocarbon helium plasma 失效
标题翻译：来自烃氦等离子体的类金刚石碳膜
公开(公告)号：US5569501A
公开(公告)日：1996-10-29
申请号：US483685
申请日：1995-06-07
申请人： Fredric D. Bailey , Douglas A. Buchanan , Alessandro C. Callegari , Howard M. Clearfield , Fuad E. Doany , Donis G. Flagello , Harold J. Hovel , Douglas C. Latulipe, Jr. , Naftali E. Lustig , Andrew T. S. Pomerene , Sampath Purushothaman , Christopher M. Scherpereel , David E. Seeger , Jane M. Shaw
发明人： Fredric D. Bailey , Douglas A. Buchanan , Alessandro C. Callegari , Howard M. Clearfield , Fuad E. Doany , Donis G. Flagello , Harold J. Hovel , Douglas C. Latulipe, Jr. , Naftali E. Lustig , Andrew T. S. Pomerene , Sampath Purushothaman , Christopher M. Scherpereel , David E. Seeger , Jane M. Shaw
IPC分类号： G03F1/08 , C01B31/06 , C08J7/06 , C23C8/26 , C23C8/50 , C23C16/26 , C23C16/27 , C23C16/50 , C30B29/04 , G02B1/10 , G11B5/255 , H01L21/31 , H01L21/314 , B05D3/06 , H05H1/24
CPC分类号： C23C16/26 , G02B1/105 , G11B5/255 , Y10S427/104 , Y10S427/106 , Y10T428/30
摘要： The present invention relates to an improved method of depositing a diamond-like carbon film onto a substrate by low temperature plasma-enhanced chemical vapor deposition (PECVD) from a hydrocarbon/helium plasma. More specifically, the diamond-like carbon films of the present invention are deposited onto the substrate by employing acetylene which is heavily diluted with helium as the plasma gas. The films formed using the process of the present invention are characterized as being amorphous and having dielectric strengths comparable to those normally observed for diamond films. More importantly, however is that the films produced herein are thermally stable, optically transparent, absorbent in the ultraviolet range and hard thus making them extremely desirable for a wide variety of applications.
摘要翻译：本发明涉及通过来自烃/氦等离子体的低温等离子体增强化学气相沉积（PECVD）将金刚石状碳膜沉积到衬底上的改进方法。更具体地说，本发明的类金刚石碳膜通过采用以氦作为等离子体气体大量稀释的乙炔沉积在基板上。使用本发明的方法形成的膜的特征在于是无定形的并且具有与通常对于金刚石膜观察到的那些相当的介电强度。然而，更重要的是，本文制造的膜是热稳定的，光学透明的，在紫外范围内是吸收性的并且是硬的，因此使得它们对于各种各样的应用是非常需要的。

9. 发明授权

US5534094A Method for fabricating multi-layer thin film structure having a separation layer 失效
标题翻译：具有分离层的多层薄膜结构的制造方法
公开(公告)号：US5534094A
公开(公告)日：1996-07-09
申请号：US314789
申请日：1994-09-29
申请人： Gnanalingam Arjavalingam , Alina Deutsch , Fuad E. Doany , Bruce K. Furman , Donald J. Hunt , Chandrasekhar Narayan , Modest M. Oprysko , Sampath Purushothaman , Vincent Ranieri , Stephen Renick , Jane M. Shaw , Janusz S. Wilczynski , David F. Witman
发明人： Gnanalingam Arjavalingam , Alina Deutsch , Fuad E. Doany , Bruce K. Furman , Donald J. Hunt , Chandrasekhar Narayan , Modest M. Oprysko , Sampath Purushothaman , Vincent Ranieri , Stephen Renick , Jane M. Shaw , Janusz S. Wilczynski , David F. Witman
IPC分类号： B23K26/00 , B32B37/00 , H01L21/68 , H01L23/12 , H01L23/15 , H05K3/00 , H05K3/46 , B32B31/28
CPC分类号： H01L21/6835 , H01L2221/68345 , H01L2221/68359 , H05K3/0011 , H05K3/46 , Y10T156/1158 , Y10T428/12528 , Y10T428/12549 , Y10T428/12569 , Y10T428/12611
摘要： A method and apparatus for releasing a workpiece from a substrate including providing a substrate which is transparent to a predetermined wavelength of electromagnetic radiation; forming, on the substrate, a separation layer which degrades in response to the predetermined radiation; providing the workpiece on the separation layer; and directing the predetermined radiation at the separation layer through the transparent substrate so as to degrade the separation layer and to separate the workpiece from the substrate.
摘要翻译：一种用于从衬底释放工件的方法和装置，包括提供对预定波长的电磁辐射是透明的衬底; 在衬底上形成响应于预定辐射而降解的分离层; 在分离层上提供工件; 并且通过透明基板将分离层处的预定辐射引导，以使分离层退化并将工件与基板分离。

10. 发明授权

US5531022A Method of forming a three dimensional high performance interconnection package 失效
公开(公告)号：US5531022A
公开(公告)日：1996-07-02
申请号：US300620
申请日：1994-09-02
申请人： Brain S. Beaman , Fuad E. Doany , Keith E. Fogel , James L. Hedrick, Jr. , Paul A. Lauro , Maurice H. Norcott , John J. Ritsko , Leathen Shi , Da-Yuan Shih , George F. Walker
发明人： Brain S. Beaman , Fuad E. Doany , Keith E. Fogel , James L. Hedrick, Jr. , Paul A. Lauro , Maurice H. Norcott , John J. Ritsko , Leathen Shi , Da-Yuan Shih , George F. Walker
IPC分类号： H01L23/52 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/18 , H05K3/40 , H01R9/09
CPC分类号： G01R1/07371 , G01R1/07307 , G01R1/07314 , G01R1/07342 , G01R3/00 , G01R31/2886 , H01L23/49827 , H01L23/5384 , H01L25/0652 , G01R1/06711 , G01R1/0675 , G01R1/07378 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/78301 , H01L2224/85205 , H01L2224/85214 , H01L24/45 , H01L24/48 , H01L2924/00013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/1627 , H01L2924/19107 , H01L2924/3011 , Y10S29/029 , Y10T29/49004 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49158 , Y10T29/49162 , Y10T29/49192 , Y10T29/53174
摘要： The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection means electrically interconnecting each assembly. The electrical interconnection means is formed from an elastomeric interposer. The elastomeric interposer is formed from an elastomeric material having a plurality of electrical conductors extending therethrough, either in a clustered or un-clustered arrangement. The electrical interconnection means is fabricated having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection means is disposed over the array of electronic devices so that the electrical interconnection means is between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection means between adjacent assemblies. The substrate or each assembly is formed from a thermally conductive material such as diamond. A heat dissipation means is thermally connected to the edges of the substrate to extract heat generated within the structure. Methods for fabricating the electrical interconnection means as a stand alone elastomeric sheet are described. The ends of the plurality of conductors in the electrical interconnection means are fabricated so that upon compression between adjacent assemblies there is a wiping action between the conductor ends and contact locations on the adjacent assemblies to form a good electrical contact therewith.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式