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1. 发明授权

US07097884B2 Stability of ion beam generated alignment layers by surface modification 失效
公开(公告)号：US07097884B2
公开(公告)日：2006-08-29
申请号：US10606523
申请日：2003-06-26
申请人： Alessandro C. Callegari , Praveen Chaudhari , Fuad E. Doany , James P. Doyle , Eileen A. Galligan , James H. Glownia , Gareth G. Hougham , James A. Lacey , Shui-Chih Lien , Minhua Lu , Alan E. Rosenbluth , Kei-Hsiung Yang
发明人： Alessandro C. Callegari , Praveen Chaudhari , Fuad E. Doany , James P. Doyle , Eileen A. Galligan , James H. Glownia , Gareth G. Hougham , James A. Lacey , Shui-Chih Lien , Minhua Lu , Alan E. Rosenbluth , Kei-Hsiung Yang
IPC分类号： C23C14/02 , C23C14/14 , C23C14/48 , C23C14/58 , G02F1/1337
CPC分类号： G02F1/13378
摘要： A method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions, and reactive gas is introduced to the ion beam to saturate dangling bonds on the surface. Another method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions and quenched with a reactive component to saturate dangling bonds on the surface.

2. 发明授权

US06665033B2 Method for forming alignment layer by ion beam surface modification 有权
标题翻译：通过离子束表面改性形成取向层的方法
公开(公告)号：US06665033B2
公开(公告)日：2003-12-16
申请号：US09726951
申请日：2000-11-30
申请人： Alessandro C. Callegari , Praveen Chaudhari , Fuad E. Doany , James P. Doyle , Eileen A. Galligan , James H. Glownia , Gareth G. Hougham , James A. Lacey , Shui-Chih Lien , Minhua Lu , Alan E. Rosenbluth , Kei-Hsiung Yang
发明人： Alessandro C. Callegari , Praveen Chaudhari , Fuad E. Doany , James P. Doyle , Eileen A. Galligan , James H. Glownia , Gareth G. Hougham , James A. Lacey , Shui-Chih Lien , Minhua Lu , Alan E. Rosenbluth , Kei-Hsiung Yang
IPC分类号： G02F11337
CPC分类号： G02F1/13378
摘要： A method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions, and reactive gas is introduced to the ion beam to saturate dangling bonds on the surface. Another method for preparing an alignment layer surface provides a surface on the alignment layer. The surface is bombarded with ions and quenched with a reactive component to saturate dangling bonds on the surface.
摘要翻译：制备取向层表面的方法提供了取向层上的表面。用离子轰击表面，并将反应性气体引入离子束以饱和表面上的悬挂键。制备取向层表面的另一种方法提供了取向层上的表面。表面被离子轰击并用反应性组分淬火以使表面上的悬挂键饱和。

3. 发明授权

US06179679B2 Method and system for curing ultra violet curable sealant that is shadowed by metallization 有权
标题翻译：用于固化由金属化阴影的紫外线可固化密封剂的方法和系统
公开(公告)号：US06179679B2
公开(公告)日：2001-01-30
申请号：US09425701
申请日：1999-10-22
申请人： Robert J. von Gutfeld , James H. Glownia , Gareth G. Hougham
发明人： Robert J. von Gutfeld , James H. Glownia , Gareth G. Hougham
IPC分类号： G02F11339
CPC分类号： G02F1/1339
摘要： The invention is a method for curing a sealant used to affix two substrates to one another. The sealant requires curing by heat or uv photons. To overcome the shadowing caused by metal patterns, the uv light in the form of laser light is delivered at slant angles without losing light due to strong reflections caused by shallow angles of incidence. Several embodiments are described including a modulation technique for a providing scanned uv beam. Another method utilizes a sufficiently strong pulsed stationary or moving laser beam that can heat the regions of a metallized pattern to provide thermal energy for curing the sealant while providing uv photons through open regions of the metal pattern to access the sealant so as to afford a photolytic cure of a hybrid sealant.
摘要翻译：本发明是用于固化用于将两个基板彼此粘合的密封剂的方法。密封剂需要通过热或紫外光子固化。为了克服由金属图案引起的阴影，由于由较小的入射角引起的强烈的反射，激光形式的紫外光以倾斜的角度传送而不会损失光。描述了包括用于提供扫描的紫外线束的调制技术的几个实施例。另一种方法使用足够强的脉冲静止或移动的激光束，其可以加热金属化图案的区域以提供用于固化密封剂的热能，同时通过金属图案的开放区域提供紫外光子以进入密封剂，以提供光解固化混合密封剂。

4. 发明授权

US07274426B2 Method of sealing two substrates with a non-epoxy or epoxy-acrylate sealant using laser radiation 有权
标题翻译：使用激光辐射用非环氧或环氧丙烯酸酯密封剂密封两个基板的方法
公开(公告)号：US07274426B2
公开(公告)日：2007-09-25
申请号：US11335252
申请日：2006-01-18
申请人： Robert J. von Gutfeld , James H. Glownia , Gareth G. Hougham
发明人： Robert J. von Gutfeld , James H. Glownia , Gareth G. Hougham
IPC分类号： G02F1/1339 , G02F1/13
CPC分类号： G02F1/1341 , G02F1/1339 , G02F2202/023
摘要： A method of joining two panels during the manufacturing of a LCD display employing the ODF (One Drop Fill) assembly technique. Using this method, the liquid crystal is deposited on one of the substrate's interior to the glue seal. The glue seal is pre-deposited near the peripheral edge of the substrates. The two substrates are then brought in contact with one another. The glue seal must be cured rapidly in order to seal the entire periphery while avoiding contamination between the glue seal, in the liquid state and the liquid crystal. The present invention teaches the use of a non-epoxy glue sealant, which is cured using photoinitiators. Experimental research has discovered the use of photons that are derived from laser beams and the control thereof. This allows for a faster, lower temperature cure.
摘要翻译：在使用ODF（一滴填充）组装技术的LCD显示器的制造期间连接两个面板的方法。使用这种方法，将液晶沉积在基板的一个内部到胶封上。粘合密封件预先沉积在基底的周缘附近。然后将两个基板彼此接触。必须快速固化胶水密封，以便密封整个周边，同时避免在液体状态下的胶水密封与液晶之间的污染。本发明教导了使用光引发剂固化的非环氧胶粘剂。实验研究发现使用衍射自激光束的光子及其控制。这允许更快，更低温度的固化。

5. 发明授权

US07006193B2 Method of sealing two substrates with a non-epoxy or epoxy-acrylate sealant using laser radiation 有权
公开(公告)号：US07006193B2
公开(公告)日：2006-02-28
申请号：US09917087
申请日：2001-07-27
申请人： Robert J. von Gutfeld , James H. Glownia , Gareth G. Hougham
发明人： Robert J. von Gutfeld , James H. Glownia , Gareth G. Hougham
IPC分类号： G02F1/1339
CPC分类号： G02F1/1341 , G02F1/1339 , G02F2202/023
摘要： A method of joining two panels during the manufacturing of a LCD display employing the ODF (One Drop Fill) assembly technique. Using this method, the liquid crystal is deposited on one of the substrate's interior to the glue seal. The glue seal is pre-deposited near the peripheral edge of the substrates. The two substrates are then brought in contact with one another. The glue seal must be cured rapidly in order to seal the entire periphery while avoiding contamination between the glue seal, in the liquid state and the liquid crystal. The present invention teaches the use of a non-epoxy glue sealant, which is cured using photoinitiators. Experimental research has discovered the use of photons that are derived from laser beams and the control thereof. This allows for a faster, lower temperature cure.

6. 发明申请

US20140242524A1 TWO MASK PROCESS FOR ELECTROPLATING METAL EMPLOYING A NEGATIVE ELECTROPHORETIC PHOTORESIST 有权
标题翻译：用于电镀金属的两个掩模工艺使用负极电泳光电
公开(公告)号：US20140242524A1
公开(公告)日：2014-08-28
申请号：US13584326
申请日：2012-08-13
申请人： Gareth G. Hougham , Gerard McVicker , Anna Pratt
发明人： Gareth G. Hougham , Gerard McVicker , Anna Pratt
IPC分类号： G03F7/20 , G03F7/40
CPC分类号： C25D17/12 , C25D1/003 , C25D5/022 , C25D13/00 , G03F7/0037 , G03F7/2022 , G03F7/203 , Y10T428/24562
摘要： A negative electrophoretic photoresist is applied over a plurality of protruding disposable template portions on a substrate. A silo structure is placed on planar portions of the negative electrophoretic photoresist that laterally surround the plurality of protruding disposable template portions. The negative electrophoretic photoresist is lithographically exposed employing the silo structure and a first lithographic mask, which includes a transparent substrate with isolated opaque patterns thereupon. After removal of the silo structure, the negative electrophoretic photoresist is lithographically exposed employing a second lithographic mask, which includes a pattern of transparent areas overlying the planar portions of the negative electrophoretic photoresist less the areas for bases of metal structure to be subsequently formed by electroplating. The negative electrophoretic photoresist is developed to form cavities therein, and metal structures are formed by electroplating within the cavities. The negative electrophoretic photoresist and the plurality of protruding disposable template portions can be subsequently removed.
摘要翻译：将负电泳光致抗蚀剂施加在基板上的多个突出的一次性模板部分上。筒状结构放置在横向包围多个突出的一次性模板部分的负电泳光致抗蚀剂的平面部分上。负电泳光致抗蚀剂利用筒仓结构和第一平版印刷掩模进行光刻曝光，第一光刻掩模包括具有分离的不透明图案的透明基板。在除去筒仓结构之后，使用第二光刻掩模将负电泳光致抗蚀剂光刻曝光，其包括覆盖负电泳光致抗蚀剂的平面部分的透明区域的图案，以减少随后通过电镀形成的金属结构基底的区域。负电泳光致抗蚀剂被开发以在其中形成空腔，并且通过在腔内电镀形成金属结构。负电泳光致抗蚀剂和多个突出的一次性模板部分可以随后被去除。

7. 发明授权

US08278745B2 Through board stacking of multiple LGA-connected components 有权
标题翻译：通过板堆叠多个LGA连接的组件
公开(公告)号：US08278745B2
公开(公告)日：2012-10-02
申请号：US12543104
申请日：2009-08-18
申请人： Paul W. Coteus , Shawn A. Hall , Gareth G. Hougham , Alphonso P. Lanzetta , Rick A. Rand
发明人： Paul W. Coteus , Shawn A. Hall , Gareth G. Hougham , Alphonso P. Lanzetta , Rick A. Rand
IPC分类号： H01L23/52
CPC分类号： H05K3/325 , H05K2201/0314 , H05K2201/10545 , H05K2201/10719 , H05K2201/2018
摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
摘要翻译：提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。

8. 发明授权

US08191245B2 Method of forming a land grid array (LGA) interposer 有权
标题翻译：形成平面阵列（LGA）插入器的方法
公开(公告)号：US08191245B2
公开(公告)日：2012-06-05
申请号：US12116317
申请日：2008-05-07
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R9/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
摘要翻译：包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机还提供了一种制造焊盘栅格阵列中介层结构的方法。

9. 发明授权

US07832094B2 Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries 有权
标题翻译：可操作地组合多个部件以形成利用金属弹性体半环和其它多个接触点几何形状的焊盘握柄阵列插入件（LGA）结构的方法
公开(公告)号：US07832094B2
公开(公告)日：2010-11-16
申请号：US12047694
申请日：2008-03-13
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R12/00 , H01K3/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A method of operatively combining a plurality of components to form a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.
摘要翻译：一种可操作地组合多个部件以形成包括电绝缘载体平面的平台栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器的方法。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机

10. 发明授权

US07823283B2 Method of forming a land grid array interposer 有权
标题翻译：形成焊盘网格阵列插入件的方法
公开(公告)号：US07823283B2
公开(公告)日：2010-11-02
申请号：US12032316
申请日：2008-02-15
申请人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
发明人： Gareth G. Hougham , Brian S. Beaman , Evan G. Colgan , Paul W. Coteus , Stefano S. Oggioni , Enrique Vargas
IPC分类号： H01R43/00
CPC分类号： H01R12/714 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01R12/52 , H05K3/326 , H05K3/4007 , H05K7/1061 , H05K2201/0133 , H05K2201/0367 , H05K2201/09481 , H05K2201/09745 , H05K2201/10378 , H05K2201/10734 , Y10T29/49002 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49151 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222 , H01L2924/00
摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.
摘要翻译：包括电绝缘载体平面的平面栅格阵列（LGA）插入器结构以及安装在所述载体平面的第一表面上的至少一个插入器。插入件在横截面中具有半环形结构，并由介电弹性体材料构成。多个导电元件围绕至少一个半环形插入器的表面布置并且从其最上端向内和向下自由地延伸至与位于电绝缘载体的相对侧上的至少一个部件的电接触飞机还提供了一种制造焊盘栅格阵列中介层结构的方法。

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