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    • 7. 发明授权
    • Removal of metal skin from a copper-Invar-copper laminate
    • 从铜Inv铜层压板去除金属表皮
    • US06228246B1
    • 2001-05-08
    • US09347581
    • 1999-07-01
    • Madhav DattaRaymond T. GalascoLawrence P. LehmanRoy H. MagnusonRobin A. SuskoRobert D. Topa
    • Madhav DattaRaymond T. GalascoLawrence P. LehmanRoy H. MagnusonRobin A. SuskoRobert D. Topa
    • C25F300
    • H05K3/44C25F3/00H05K3/07H05K2201/0338H05K2201/0347H05K2203/0285H05K2203/0361
    • A method of removing a metal skin from a through-hole surface of a copper-Invar-copper (CIC) laminate without causing differential etchback of the laminate. The metal skin includes debris deposited on the through-hole surface as the through hole is being formed by laser or mechanical drilling of a substrate that includes the laminate as an inner plane. Removing the metal skin combines electrochemical polishing (ECP) with ultrasonics. ECP dissolves the metal skin in an acid solution, while ultrasonics agitates and circulates the acid solution to sweep the metal skin out of the through hole. ECP is activated when a pulse power supply is turned on and generates a periodic voltage pulse from a pulse power supply whose positive terminal is coupled to the laminate and whose negative terminal is coupled to a conductive cathode. After the metal skin is removed, the laminate is differentially etched such that the copper is etched at a faster rate than the Invar. To prevent the differential etching, a copper layer is formed on a surface of the substrate with an electrical resistance R1 between the copper layer and the positive terminal of the pulse power supply. Additionally, an electrical resistance R2 is formed between the laminate and the positive terminal of the pulse power supply. Adjustment of R1 and R2 controls the relative etch rates of the copper and the Invar.
    • 从铜 - 堇青铜(CIC)层压板的通孔表面去除金属表皮而不会引起层压板的不均匀回蚀的方法。 金属皮肤包括沉积在通孔表面上的碎屑,因为通孔是通过激光或机械钻孔形成的,所述基底包括层压体作为内平面。 去除金属皮肤结合电化学抛光(ECP)与超声波。 ECP将金属皮肤溶解在酸性溶液中,同时超声波搅拌并循环酸溶液以将金属皮肤从通孔中扫出。 当脉冲电源接通时,ECP被激活,并从脉冲电源产生周期性的电压脉冲,该脉冲电源的正极端子耦合到层压板并且其负极端子连接到导电阴极。 在去除金属表皮之后,层压体被差异蚀刻,使得以比Invar更快的速度蚀刻铜。 为了防止差分蚀刻,在衬底的表面上在铜层和脉冲电源的正端之间具有电阻R1形成铜层。 此外,在层压体和脉冲电源的正极端之间形成电阻R2。 R1和R2的调整控制铜和殷钢的相对蚀刻速率。
    • 8. 发明授权
    • Copper plated invar with acid preclean
    • 镀铜搪瓷与酸预清洗
    • US06935018B2
    • 2005-08-30
    • US10281450
    • 2002-10-25
    • Raymond T. GalascoBonnie S. McClureCraig W. Richards
    • Raymond T. GalascoBonnie S. McClureCraig W. Richards
    • H05K1/05H05K3/44H01R43/00
    • H05K1/05H05K1/056H05K3/445H05K2201/0347Y10T29/49117Y10T29/49126Y10T29/4913
    • A method for forming a copper-Invar-copper (CIC) laminate having an intermetallic layer of negligible thickness, and a structure associated with the CIC laminate. Starting with a block of Invar, the method includes a cleaning step followed by an electroplating step. The cleaning step electrochemically cleans the block of Invar with an acid solution while applying a negative voltage bias to the block of Invar. The electroplating step electroplates copper on the block of Invar, resulting in the block of Invar being sandwiched between two layers of copper, such that an intermetallic layer of zero or negligible thickness is disposed between the block of Invar and each layer of copper. Each layer of copper has a uniform thickness. If the starting block of Invar contains a through hole, then the electroplating step will plate a ring of copper on the through hole wall. The ring of copper makes a seamless connection with the two layers of copper, because the ring of copper and the two layers of copper each have the same grain structure.
    • 一种用于形成具有可忽略的厚度的金属间化合物的铜 - 阴模铜(CIC)层压体的方法和与CIC层压体相关联的结构。 从一块Invar开始,该方法包括一个清洁步骤,然后是电镀步骤。 清洁步骤用酸溶液电化学地清洗Invar块,同时对Invar的块施加负电压偏压。 电镀步骤将铜镀在Invar块上,导致Invar块被夹在两层铜之间,使得在Invar块和每层铜之间设置零或可忽略的厚度的金属间层。 铜层每层厚度均匀。 如果Invar的起始块包含一个通孔,则电镀步骤将在通孔壁上镀一个铜环。 由于铜环和两层铜都具有相同的晶粒结构,铜环与两层铜无缝连接。