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1. 发明授权

US06522014B1 Fabrication of a metalized blind via 有权
标题翻译：金属化盲孔的制造
公开(公告)号：US06522014B1
公开(公告)日：2003-02-18
申请号：US09670968
申请日：2000-09-27
申请人： Frank D. Egitto , Elizabeth Foster , Raymond T. Galasco , David E. Houser , Mark L. Janecek , Thomas E. Kindl , Jeffrey A. Knight , Stephen W. MacQuarrie , Voya R. Markovich , Luis J. Matienzo , Amarjit S. Rai , David J. Russell , William T. Wike
发明人： Frank D. Egitto , Elizabeth Foster , Raymond T. Galasco , David E. Houser , Mark L. Janecek , Thomas E. Kindl , Jeffrey A. Knight , Stephen W. MacQuarrie , Voya R. Markovich , Luis J. Matienzo , Amarjit S. Rai , David J. Russell , William T. Wike
IPC分类号： H01L2348
CPC分类号： H01L21/486 , H01L23/49827 , H01L2224/16225 , H05K3/0032 , H05K3/0035 , H05K3/424 , H05K2201/0323 , H05K2203/1136
摘要： A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer comprises a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e.g., copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer. The laser drilling is accomplished using a laser radiation having a wavelength between about 180 nanometers and about 600 nanometers. The depression may have any cross-sectional shape and any spatial distribution of depths. As an example, the depression may include a blind via, then the blind via may have any cross-sectional shape, such as circular or non-circular, a rectangular channel, or a combination thereof.
摘要翻译：用于形成金属化盲孔的方法和结构。在金属层上形成电介质层，随后在电介质层中激光钻出凹陷，使得在凹陷的侧壁上形成包含碳的碳膜。如果激光钻孔不暴露金属层，则可以使用诸如反应离子蚀刻（RIE）的各向异性等离子体蚀刻来清洁和暴露金属层的表面。电介质层包括具有碳基聚合物材料的介电材料，例如永久性光致抗蚀剂，聚酰亚胺和先进的焊接掩模（ASM）。金属层包括金属材料，例如铜，铝和金。碳膜与金属层导电接触，并且碳膜具有足够的导电性，以允许直接在碳膜上电镀连续的金属层（例如铜），而不需要在电镀层下面的无电镀层。激光钻孔使用波长在约180纳米和约600纳米之间的激光辐射完成。凹陷可以具有任何横截面形状和深度的任何空间分布。作为示例，凹陷可以包括盲孔，则盲孔可以具有任何横截面形状，例如圆形或非圆形，矩形通道或其组合。

2. 发明授权

US06576549B2 Fabrication of a metalized blind via 失效
标题翻译：金属化盲孔的制造
公开(公告)号：US06576549B2
公开(公告)日：2003-06-10
申请号：US10282275
申请日：2002-10-28
申请人： Frank D. Egitto , Elizabeth Foster , Raymond T. Galasco , David E. Houser , Mark L. Janecek , Thomas E. Kindl , Jeffrey A. Knight , Stephen W. MacQuarrie , Voya R. Markovich , Luis J. Matienzo , Amarjit S. Rai , David J. Russell , William T. Wike
发明人： Frank D. Egitto , Elizabeth Foster , Raymond T. Galasco , David E. Houser , Mark L. Janecek , Thomas E. Kindl , Jeffrey A. Knight , Stephen W. MacQuarrie , Voya R. Markovich , Luis J. Matienzo , Amarjit S. Rai , David J. Russell , William T. Wike
IPC分类号： H01L2131
CPC分类号： H01L21/486 , H01L23/49827 , H01L2224/16225 , H05K3/0032 , H05K3/0035 , H05K3/424 , H05K2201/0323 , H05K2203/1136
摘要： A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer includes a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e.g., copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer. The laser drilling is accomplished using a laser radiation having a wavelength between about 180 nanometers and about 600 nanometers. The depression may have any cross-sectional shape and any spatial distribution of depths. As an example, the depression may include a blind via, a rectangular channel, or a combination thereof.
摘要翻译：用于形成金属化盲孔的方法和结构。在金属层上形成电介质层，随后在电介质层中激光钻出凹陷，使得在凹陷的侧壁上形成包含碳的碳膜。如果激光钻孔不暴露金属层，则可以使用诸如反应离子蚀刻（RIE）的各向异性等离子体蚀刻来清洁和暴露金属层的表面。电介质层包括具有碳基聚合物材料的电介质材料，例如永久性光致抗蚀剂，聚酰亚胺和高级阻焊剂（ASM）。金属层包括金属材料，例如铜，铝和金。碳膜与金属层导电接触，并且碳膜具有足够的导电性，以允许直接在碳膜上电镀连续的金属层（例如铜），而不需要在电镀层下面的无电镀层。激光钻孔使用波长在约180纳米和约600纳米之间的激光辐射完成。凹陷可以具有任何横截面形状和深度的任何空间分布。作为示例，凹陷可以包括盲孔，矩形通道或其组合。

3. 发明授权

US06232559B1 Multi-layer printed circuit board registration 失效
标题翻译：多层印刷电路板注册
公开(公告)号：US06232559B1
公开(公告)日：2001-05-15
申请号：US09002606
申请日：1998-01-05
申请人： Mark L. Janecek
发明人： Mark L. Janecek
IPC分类号： H05K103
CPC分类号： H05K3/4638 , H05K1/0269 , H05K3/0008 , H05K3/0052 , H05K2201/09781 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： A Method for detecting misalignment of layers of a multi-layer circuit board. A Plurality of layers of electrically insulating material are formed. At least one artwork feature is formed on a surface of at least one of the layers of electrically insulating material in the vicinity of at least One edge of the at least one layer of electrically insulating material. At least one reference point is formed on the at least one layer of electrically insulating material. The layers of electrically insulating material are joined together. The at least one artwork feature is exposed by removing a portion of the at least one layer of electrically insulating material. A location of the at least one artwork feature relative to the at least one reference point is visually determined, thereby detecting misalignment of the layers of electrically insulating material.
摘要翻译：一种用于检测多层电路板的层的未对准的方法。形成多层电绝缘材料。在至少一层电绝缘材料的至少一个边缘附近的至少一个电绝缘材料层的表面上形成至少一个艺术品特征。在至少一层电绝缘材料上形成至少一个参考点。电绝缘材料层连接在一起。通过去除至少一层电绝缘材料的一部分来暴露至少一个艺术品特征。视觉确定相对于至少一个参考点的至少一幅艺术作品特征的位置，从而检测电绝缘材料层的未对准。

4. 发明授权

US06662441B2 Method for making multi-layer printed circuit board registration 失效
标题翻译：多层印刷电路板注册方法
公开(公告)号：US06662441B2
公开(公告)日：2003-12-16
申请号：US09818459
申请日：2001-03-27
申请人： Mark L. Janecek
发明人： Mark L. Janecek
IPC分类号： H05K302
CPC分类号： H05K3/4638 , H05K1/0269 , H05K3/0008 , H05K3/0052 , H05K2201/09781 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： A method for detecting misalignment of layers of a multi-layer circuit board. A plurality of layers of electrically insulating material are formed. At least one artwork feature is formed on a surface of at least one of the layers of electrically insulating material in the vicinity of at least one edge of the at least one layer of electrically insulating material. At least one reference point is formed on the at least one layer of electrically insulating material. The layers of electrically insulating material are joined together. The at least one artwork feature is exposed by removing a portion of the at least one layer of electrically insulating material. A location of the at least one artwork feature relative to the at least one reference point is visually determined, thereby detecting misalignment of the layers of electrically insulating material.
摘要翻译：一种用于检测多层电路板的层的未对准的方法。形成多层电绝缘材料。在至少一层电绝缘材料的至少一个边缘附近的至少一层电绝缘材料的表面上形成至少一个图案特征。在至少一层电绝缘材料上形成至少一个参考点。电绝缘材料层连接在一起。通过去除至少一层电绝缘材料的一部分来暴露至少一个艺术品特征。视觉确定相对于至少一个参考点的至少一个艺术作品特征的位置，从而检测电绝缘材料层的未对准。

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