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1. 发明授权

US4540473A Copper plating bath having increased plating rate, and method 失效
标题翻译：具有提高电镀速率的镀铜浴和方法
公开(公告)号：US4540473A
公开(公告)日：1985-09-10
申请号：US554484
申请日：1983-11-22
申请人： Perminder S. Bindra , Allan P. David , Raymond T. Galasco , Charles E. Gasdik , David N. Light , Paul B. Pickar
发明人： Perminder S. Bindra , Allan P. David , Raymond T. Galasco , Charles E. Gasdik , David N. Light , Paul B. Pickar
IPC分类号： C25D3/38
CPC分类号： C25D3/38
摘要： A copper plating bath containing a sulfur-containing anion other than sulfate anion and/or a selenium-containing anion other than a selenate anion and/or a tellurium-containing anion other than a tellurate anion in an amount sufficient to increase the plating rate, and method for electroplating copper onto a substrate with the plating bath.
摘要翻译：含有除硫酸根阴离子以外的含硫阴离子和/或硒酸根阴离子以外的含硒阴离子和/或除了碲化阴离子以外的含碲阴离子的含量足以提高电镀率的镀铜浴，以及使用电镀液将铜电镀到基板上的方法。

2. 发明授权

US4479852A Method for determination of concentration of organic additive in plating bath 失效
标题翻译：电镀液中有机添加剂浓度测定方法
公开(公告)号：US4479852A
公开(公告)日：1984-10-30
申请号：US459930
申请日：1983-01-21
申请人： Perminder S. Bindra , Allan P. David , Raymond T. Galasco , David N. Light
发明人： Perminder S. Bindra , Allan P. David , Raymond T. Galasco , David N. Light
IPC分类号： G01N27/416 , G01N27/46
CPC分类号： G01N27/4161
摘要： The concentration of an organic additive in a plating bath is determined by providing a polished and constant current density preplated rotating disc cathode, a reference electrode and anode in an electrolytic copper plating bath, passing an electric current from the anode to the cathode and reference electrode; measuring the voltage difference between the cathode and reference electrode; and comparing the difference to values for known concentrations of the organic additive.
摘要翻译：电镀浴中有机添加剂的浓度通过在电解镀铜浴中提供抛光和恒定电流密度预定旋转圆盘阴极，参考电极和阳极，将电流从阳极传递到阴极和参比电极来确定 ; 测量阴极和参比电极之间的电压差; 并将该差异与已知浓度的有机添加剂的值进行比较。

3. 发明授权

US4910049A Conditioning a dielectric substrate for plating thereon 失效
标题翻译：调节用于电镀的电介质基板
公开(公告)号：US4910049A
公开(公告)日：1990-03-20
申请号：US941467
申请日：1986-12-15
申请人： Perminder S. Bindra , Donald F. Canaperi , Allan P. David , David N. Light
发明人： Perminder S. Bindra , Donald F. Canaperi , Allan P. David , David N. Light
IPC分类号： C23C18/18 , H05K3/18
CPC分类号： H05K3/181 , C23C18/1893
摘要： A dielectric substrate is conditioned for plating from an electroless metal plating bath by providing the surface or surfaces of the substrate that are to be plated with semiconductor material whereby the semiconductor material, in the case of n-type material, exhibits energy band where the valence band is equal to or higher than and, in the case of p-type material, exhibits energy band where the valence band is equal to or lower than the redox potential of the metallic ions in the electroless plating bath that are to be deposited as metal on the substrate.

4. 发明授权

US4457986A Use of underpotential deposited layers of metals on foreign metal substrates as catalysts for electrolytic cells 失效
标题翻译：在外来金属基底上使用不良金属沉积层作为电解槽的催化剂
公开(公告)号：US4457986A
公开(公告)日：1984-07-03
申请号：US454746
申请日：1982-12-30
申请人： Perminder S. Bindra , Allan P. David , David N. Light
发明人： Perminder S. Bindra , Allan P. David , David N. Light
IPC分类号： C25B11/04 , H01M4/88 , H01M4/90 , H01M4/92 , H01M8/08
CPC分类号： H01M4/90 , C25B11/0494 , H01M8/08
摘要： Fuel cell catalysts which are efficient, long-lived, and refurbishable in-situ include gold carrying a UPD deposit of another element. UPD Ag, Pt, Pd, Ir, Rh or Tl, Pb and Bi on Au crystallites are carried on and bonded to another substrate. The crystallites cause dissociative adsorption of the oxygen molecules so that four electrons are produced per molecule during the reduction reaction which is involved. In an alkaline electrolyte, the catalyst metals such as Pd, Ir, Ag, Rh and Pt show no tendency to poison the counter electrode (counter relative to the other electrode) since each of those metals is a good catalyst for both electrodes. Suitable fuels include methanol (CH.sub.3 OH), formaldehyde (HCHO), and formic acid (HCOOH).
摘要翻译：高效，长寿命和可再现的原料的燃料电池催化剂包括携带另一元素的UPD沉积物的金。 UPD Ag，Pt，Pd，Ir，Rh或Tl，Pb和Bi在Au微晶上承载并结合到另一个基底上。微晶引起氧分子的离解吸附，使得在涉及的还原反应期间每分子产生四个电子。在碱性电解液中，Pd，Ir，Ag，Rh，Pt等催化剂金属，因为这两种电极都是良好的催化剂，因此不会对对电极（相对于另一方的电极）造成中毒。合适的燃料包括甲醇（CH 3 OH），甲醛（HCHO）和甲酸（HCOOH）。

5. 发明授权

US5137461A Separable electrical connection technology 失效
标题翻译：可分离的电气连接技术
公开(公告)号：US5137461A
公开(公告)日：1992-08-11
申请号：US606007
申请日：1990-10-30
申请人： Perminder S. Bindra , Jerome J. Cuomo , Thomas P. Gall , Anthony P. Ingraham , Sung K. Kang , Jungihl Kim , Paul Lauro , David N. Light , Voya R. Markovich , Ekkehard F. Miersch , Jaynal A. Molla , Douglas O. Powell , John J. Ritsko , George J. Saxenmeyer, Jr. , Jack A. Varcoe , George F. Walker
发明人： Perminder S. Bindra , Jerome J. Cuomo , Thomas P. Gall , Anthony P. Ingraham , Sung K. Kang , Jungihl Kim , Paul Lauro , David N. Light , Voya R. Markovich , Ekkehard F. Miersch , Jaynal A. Molla , Douglas O. Powell , John J. Ritsko , George J. Saxenmeyer, Jr. , Jack A. Varcoe , George F. Walker
IPC分类号： H01R4/26 , H01R4/58 , H01R13/22 , H05K3/32
CPC分类号： H01R4/26 , H01L24/83 , H01L24/90 , H01L24/98 , H01R13/22 , H01R4/58 , H05K3/325 , H01L2224/13111 , H01L2224/29111 , H01L2224/2919 , H01L2224/48227 , H01L2224/8319 , H01L2224/838 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , Y10T29/49224
摘要： A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.
摘要翻译：提供一种用于电气设备的可分离和可重新连接的连接件，其适于小型化，其中容纳从平面部分一体地附接和突出的垂直交叉构件，以控制与相对的类似接触件配合时发生的横向位移损坏。通过提供一个或多个共形相对的接触，通过加强涂层和基底加强件以及可变形的涂层来容纳横向应力来避免位移损伤。接触是通过物理和化学过程制造的，包括溅射，正常和脉冲电镀以及化学气相沉积。完成的触点设置有增强刚性的周边固定材料。

6. 发明授权

US4490219A Method of manufacture employing electrochemically dispersed platinum catalysts deposited on a substrate 失效
标题翻译：使用沉积在基底上的电化学分散的铂催化剂的制造方法
公开(公告)号：US4490219A
公开(公告)日：1984-12-25
申请号：US433328
申请日：1982-10-07
申请人： Perminder S. Bindra , David N. Light
发明人： Perminder S. Bindra , David N. Light
IPC分类号： B01J23/40 , B01J23/50 , B01J37/02 , B01J37/34 , C25B11/04 , H01M4/86 , H01M4/92 , C25D5/00 , C25D5/18
CPC分类号： H01M4/926 , B01J23/40 , B01J23/50 , B01J37/348 , C25B11/0473 , H01M4/86 , H01M4/92 , H01M2300/0005 , H01M2300/0014 , Y10S204/09
摘要： A substrate such as carbon, graphite, or various semiconductors is coated with a "two-dimensional" thin film form of flat isolated crystallites of platinum, palladium or silver to form a catalyst useful in a fuel cell. The method of formation of the catalyst is to place the substrate in an electrolyte such as H.sub.2 PtCl.sub.6 about 1% and one molar sulfuric acid. The potentiostatic pulse plating method is employed. A high potential pulse of very short duration is followed by a low potential of substantial duration. The very high potential nucleates crystals at various randomly distributed nucleation sites such as imperfections in the surface of the substrate. The resulting catalyst has a large surface area of hexagonal crystals about 20 to 40 Angstroms in diameter.
摘要翻译：诸如碳，石墨或各种半导体的衬底用铂，钯或银的平坦分离微晶的“二维”薄膜形式涂覆以形成可用于燃料电池的催化剂。形成催化剂的方法是将基材置于电解质如H 2 PtCl 6约1％和1摩尔硫酸中。采用恒电位脉冲电镀法。持续时间非常短的高电位脉冲之后是相当长时间的低电位。非常高的电位使晶体在各种随机分布的成核位点成核，如底物表面的缺陷。得到的催化剂具有大约20至40埃的六方晶体的大的表面积。

7. 发明授权

US5185073A Method of fabricating nendritic materials 失效
标题翻译：制造树枝状材料的方法
公开(公告)号：US5185073A
公开(公告)日：1993-02-09
申请号：US692606
申请日：1991-04-29
申请人： Perminder S. Bindra , Jerome J. Cuomo , Thomas P. Gall , Anthony P. Ingraham , Sung K. Kang , Jungihl Kim , Paul Lauro , David N. Light , Voya R. Markovich , Ekkehard F. Miersch , Jaynal A. Molla , Douglas O. Powell , John J. Ritsko , George J. Saxenmeyer, Jr. , Jack A. Varcoe , George F. Walker
发明人： Perminder S. Bindra , Jerome J. Cuomo , Thomas P. Gall , Anthony P. Ingraham , Sung K. Kang , Jungihl Kim , Paul Lauro , David N. Light , Voya R. Markovich , Ekkehard F. Miersch , Jaynal A. Molla , Douglas O. Powell , John J. Ritsko , George J. Saxenmeyer, Jr. , Jack A. Varcoe , George F. Walker
IPC分类号： H01R4/26 , H01R4/58 , H01R13/22 , H05K3/32
CPC分类号： H01L24/83 , H01L24/90 , H01R13/22 , H01R4/26 , H01R4/58 , H05K3/325 , H01L2224/0401 , H01L2224/05557 , H01L2224/13111 , H01L2224/29111 , H01L2224/2919 , H01L2224/48227 , H01L2224/8319 , H01L2224/838 , H01L2224/85444 , H01L2224/85464 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/14
摘要： A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. Pulse electroplating of palladium provides a dendritic deposit of uniform height, uniform rounded points and less branching. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.
摘要翻译：提供一种用于电气设备的可分离和可重新连接的连接件，其适于小型化，其中容纳从平面部分一体地附接和突出的垂直交叉构件，以控制与相对的类似接触件配合时发生的横向位移损坏。通过提供一个或多个共形相对的接触，通过加强涂层和基底加强件以及可变形的涂层来容纳横向应力来避免位移损伤。接触是通过物理和化学过程制造的，包括溅射，正常和脉冲电镀以及化学气相沉积。钯的脉冲电镀提供均匀高度，均匀圆点和较少支化的树枝状沉积物。完成的触点设置有增强刚性的周边固定材料。

8. 发明授权

US5574630A Laminated electronic package including a power/ground assembly 失效
标题翻译：层压电子封装，包括电源/接地组件
公开(公告)号：US5574630A
公开(公告)日：1996-11-12
申请号：US438952
申请日：1995-05-11
申请人： John S. Kresge , David N. Light , Tien Y. Wu
发明人： John S. Kresge , David N. Light , Tien Y. Wu
IPC分类号： H01L23/32 , H01L23/498 , H01L23/50 , H01L23/538 , H05K1/14 , H05K3/42 , H05K3/46 , H05K7/14
CPC分类号： H01L23/50 , H01L23/49861 , H01L23/5384 , H05K1/0265 , H05K1/144 , H05K3/4602 , H05K3/4614 , H05K3/4688 , H01L2224/16225 , H01L2224/16235 , H01L2924/01078 , H01L2924/09701 , H01L2924/10253 , H05K2201/0352 , H05K2201/09309 , H05K2201/09536 , H05K2201/096 , H05K2203/061 , H05K3/429 , H05K3/4623 , H05K3/4641
摘要： A power/ground structure and associated circuit card or board are provided in which the coefficient of thermal expansion of the power/ground structure and associated circuit board are closely matched to each other. The circuit board or card is formed of organic electrically-insulating material having electrical circuitry thereon which carries an integrated circuit chip. The power/ground assembly is formed of alternating layers of organic insulating material and at least two layers of electrically-conducting material, typically copper, one of the layers of electrically-conducting material forming a power connection and another layer of the electrically-conducting material forming a ground plane. There is also at least one additional layer of a structural material having a relatively high Young's Modulus and a CTE of less than about 10 PPM/.degree.C. Invar or copper clad Invar are preferred materials for this structure. The electrically-conducting copper material and the Invar are selected in thickness and number such that, together with the electrically-insulating material, the composite CTE of the power/ground structure closely matches that of the circuit card or board.
摘要翻译：提供了电源/接地结构和相关电路卡或电路板，其中电源/接地结构和相关电路板的热膨胀系数彼此紧密匹配。电路板或卡由其上具有电路的有机电绝缘材料形成，其上承载集成电路芯片。电源/接地组件由有机绝缘材料的交替层和至少两层导电材料（通常为铜）形成，导电材料层之一形成电源连接，另一层导电材料形成地平面。还有至少一个附加层的结构材料具有相对高的杨氏模量和小于约10PPM /℃的CTE。殷钢或铜包层的殷钢是该结构的优选材料。选择导电铜材料和殷钢的厚度和数量，使得与电绝缘材料一起，电源/接地结构的复合CTE与电路卡或电路板的复合CTE密切相匹配。

9. 发明授权

US4725339A Method for monitoring metal ion concentrations in plating baths 失效
标题翻译：监测电镀液中金属离子浓度的方法
公开(公告)号：US4725339A
公开(公告)日：1988-02-16
申请号：US579733
申请日：1984-02-13
申请人： Perminder Bindra , Solomon L. Levine , David N. Light
发明人： Perminder Bindra , Solomon L. Levine , David N. Light
IPC分类号： C25D21/14 , G01N27/48 , G01N27/49
CPC分类号： G01N27/48 , G01N27/49
摘要： A rotating disk electrode system operates at constant speed in a solution whose metal ion concentration is held constant at multiple concentrations within a range of concentration. The current at the working electrode is recorded, while the potential at the working electrode is swept at a predetermined rate for each of the concentration values. The diffusion limiting current is determined for each of the concentration values. Then the rotating disk electrode system is operated continuously in a metal plating bath whose metal ion concentration can vary. A voltage applied to the working electrode produces a current at the electrode whose magnitude is compared to the values of the previous calibration to determine the current metal ion concentration. Alternatively, a rotating disk electrode system is operated over a range of speeds in a solution whose ion concentration is held constant over a range of concentration. Current at the working electrode is measured for a given electric potential applied to the working electrode. In this way, a calibration relationship between the current at the electrode and the range of metal ion concentrations is established which can be used with current measured in the plating bath under the same conditions as those that established the calibration curve to predict the concentration of the bath.
摘要翻译：旋转盘电极系统在浓度范围内以多种浓度保持金属离子浓度的溶液中，以恒定速度运转。记录工作电极处的电流，同时以每个浓度值以预定的速率扫描工作电极处的电位。确定每个浓度值的扩散限制电流。然后旋转盘电极系统在其金属离子浓度可以变化的金属电镀浴中连续操作。施加到工作电极的电压在电极处产生电流，其电流与先前校正值相比较，以确定当前的金属离子浓度。或者，旋转盘电极系统在离子浓度在浓度范围内保持恒定的溶液中的速度范围内操作。对施加到工作电极的给定电位测量工作电极处的电流。以这种方式，建立了电极电流与金属离子浓度范围之间的校准关系，可以在与建立校正曲线的条件相同的条件下在电镀液中测量的电流使用，以预测电极的浓度浴。

10. 发明授权

US5384690A Flex laminate package for a parallel processor 失效
标题翻译：用于并行处理器的Flex层压包装
公开(公告)号：US5384690A
公开(公告)日：1995-01-24
申请号：US97544
申请日：1993-07-27
申请人： Charles R. Davis , Thomas P. Duffy , Steven L. Hanakovic , Howard L. Heck , John T. Kolias , John S. Kresge , David N. Light , Ajit K. Trivedi
发明人： Charles R. Davis , Thomas P. Duffy , Steven L. Hanakovic , Howard L. Heck , John T. Kolias , John S. Kresge , David N. Light , Ajit K. Trivedi
IPC分类号： H01R4/26 , H01R4/58 , H01R12/61 , H01R13/66 , H05K1/00 , H05K1/03 , H05K1/14 , H05K3/00 , H05K3/32 , H05K3/46 , H01R23/68
CPC分类号： H05K3/4635 , H01R12/613 , H01R13/665 , H05K3/462 , H01R4/26 , H01R4/58 , H05K1/0373 , H05K1/0393 , H05K2201/015 , H05K2201/0154 , H05K2201/09109 , H05K2201/09536 , H05K2201/10159 , H05K3/328 , H05K3/4623 , H05K3/4641 , Y10S428/901 , Y10T29/49126 , Y10T29/49128 , Y10T29/49179 , Y10T428/24917
摘要： Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outwardly from a laminate of the circuitized, flexible substrates. Intercommunication is provided through a switch structure that is implemented in the laminate. The printed circuit cards are mounted on or connected to a plurality of circuitized flexible substrates, with one printed circuit card at each end of the circuitized flexible circuit. The circuitized flexible substrates connect the separate printed circuit boards and cards through the central laminate portion. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication. The planar circuitization, as data lines, address lines, and control lines of a logic chip or a memory chip are on the individual printed circuit boards and cards, which are connected through the circuitized flex, and communicate with other layers of flex through Z-axis circuitization (vias and through holes) in the laminate. Lamination of the individual subassemblies is accomplished with a low melting adhesive that is chemical compatible with (bondable to) the perfluorocarbon polymer between the subassemblies in the regions intended to be laminated, and, optionally, a high melting mask that is chemically incompatible with (not bondable to) the perfluorocarbon polymer between the subassemblies in the regions not intended to be laminated. The subassembly stack is heated to selectively effect adhesion and lamination in areas thereof intended to be laminated while avoiding lamination in areas not intended to be laminated.
摘要翻译：公开了一种并行处理器封装结构和用于制造该结构的方法。单独的逻辑和存储器元件在印刷电路卡上。这些印刷电路板和卡依次安装在或连接到从电路化的柔性基板的层叠体向外延伸的电路化柔性基板上。通过在层压板中实现的开关结构来提供互通。印刷电路卡安装在或连接到多个电路化的柔性基板上，在电路化柔性电路的每一端具有一个印刷电路卡。电路化的柔性基板通过中央层压体部分连接分开的印刷电路板和卡。该层压部分为处理器间，存储器间，处理器间/存储器元件以及处理器到存储器总线互连和通信提供XY平面和Z轴互连。作为逻辑芯片或存储器芯片的数据线，地址线和控制线的平面电路在通过电路化的柔性连接的各个印刷电路板和卡上，并且通过Z轴与其它柔性层通信，轴向电路（通孔和通孔）。各个子组件的层压是通过与要层压的区域中的子组件之间的全氟化碳聚合物化学相容（可粘合）化学相容的低熔点粘合剂，以及任选的与化学不相容的高熔点掩模可粘合到）在不想层压的区域中的子组件之间的全氟化碳聚合物。加热组件叠层以选择性地在要层压的区域中进行粘合和层压，同时避免在不想层压的区域中层压。

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