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1. 发明授权

US06958272B2 Pocket implant for complementary bit disturb improvement and charging improvement of SONOS memory cell 有权
标题翻译：袖珍种植体用于SONOS存储器单元的互补位干扰改进和充电改进
公开(公告)号：US06958272B2
公开(公告)日：2005-10-25
申请号：US10755740
申请日：2004-01-12
申请人： Emmanuil H. Lingunis , Nga-Ching Alan Wong , Sameer Haddad , Mark W. Randolph , Mark T. Ramsbey , Ashot Melik-Martirosian , Edward F. Runnion , Yi He
发明人： Emmanuil H. Lingunis , Nga-Ching Alan Wong , Sameer Haddad , Mark W. Randolph , Mark T. Ramsbey , Ashot Melik-Martirosian , Edward F. Runnion , Yi He
IPC分类号： H01L21/265 , H01L21/336 , H01L21/8234 , H01L21/8246 , H01L27/115 , H01L29/10 , H01L29/792
CPC分类号： H01L27/11568 , H01L21/26586 , H01L27/115 , H01L29/1083 , H01L29/66833 , Y10S438/959
摘要： A technique for forming at least part of an array of a dual bit memory core is disclosed. Initially, a portion of a charge trapping dielectric layer is formed over a substrate and a resist is formed over the portion of the charge trapping dielectric layer. The resist is patterned and a pocket implant is performed at an angle to establish pocket implants within the substrate. A bitline implant is then performed to establish buried bitlines within the substrate. The patterned resist is then removed and the remainder of the charge trapping dielectric layer is formed. A wordline material is formed over the remainder of the charge trapping dielectric layer and patterned to form wordlines that overlie the bitlines. The pocket implants serve to mitigate, among other things, complementary bit disturb (CBD) that can result from semiconductor scaling. As such, semiconductor devices can be made smaller and increased packing densities can be achieved by virtue of the inventive concepts set forth herein.
摘要翻译：公开了一种用于形成双位存储器核心的阵列的至少一部分的技术。最初，电荷俘获电介质层的一部分形成在衬底上，并且在电荷俘获电介质层的部分上形成抗蚀剂。抗蚀剂被图案化，并且以一定角度执行凹穴注入以在衬底内建立口袋植入物。然后执行位线注入以在衬底内建立掩埋位线。然后去除图案化的抗蚀剂，并形成剩余的电荷捕获介电层。在剩余的电荷俘获电介质层中形成字线材料，并且被图案化以形成覆盖在位线上的字线。口袋种植体用于缓解由半导体尺度缩小引起的互补位干扰（CBD）。因此，可以使半导体器件更小，并且可以通过本文所阐述的发明概念来实现增加的封装密度。

2. 发明申请

US20050153508A1 Pocket implant for complementary bit disturb improvement and charging improvement of SONOS memory cell 有权
公开(公告)号：US20050153508A1
公开(公告)日：2005-07-14
申请号：US10755740
申请日：2004-01-12
申请人： Emmanuil Lingunis , Nga-Ching Wong , Sameer Haddad , Mark Randolph , Mark Ramsbey , Ashot Melik-Martirosian , Edward Runnion , Yi He
发明人： Emmanuil Lingunis , Nga-Ching Wong , Sameer Haddad , Mark Randolph , Mark Ramsbey , Ashot Melik-Martirosian , Edward Runnion , Yi He
IPC分类号： H01L21/265 , H01L21/336 , H01L21/8234 , H01L21/8246 , H01L27/115 , H01L29/10 , H01L29/792
CPC分类号： H01L27/11568 , H01L21/26586 , H01L27/115 , H01L29/1083 , H01L29/66833 , Y10S438/959
摘要： A technique for forming at least part of an array of a dual bit memory core is disclosed. Initially, a portion of a charge trapping dielectric layer is formed over a substrate and a resist is formed over the portion of the charge trapping dielectric layer. The resist is patterned and a pocket implant is performed at an angle to establish pocket implants within the substrate. A bitline implant is then performed to establish buried bitlines within the substrate. The patterned resist is then removed and the remainder of the charge trapping dielectric layer is formed. A wordline material is formed over the remainder of the charge trapping dielectric layer and patterned to form wordlines that overlie the bitlines. The pocket implants serve to mitigate, among other things, complementary bit disturb (CBD) that can result from semiconductor scaling. As such, semiconductor devices can be made smaller and increased packing densities can be achieved by virtue of the inventive concepts set forth herein.

3. 发明授权

US06906959B2 Method and system for erasing a nitride memory device 有权
标题翻译：擦除氮化物存储器件的方法和系统
公开(公告)号：US06906959B2
公开(公告)日：2005-06-14
申请号：US10306252
申请日：2002-11-27
申请人： Mark W. Randolph , Chi Chang , Yi He , Wei Zheng , Edward F. Runnion , Zhizheng Liu
发明人： Mark W. Randolph , Chi Chang , Yi He , Wei Zheng , Edward F. Runnion , Zhizheng Liu
IPC分类号： G11C16/04 , G11C16/14 , H01L21/336 , H01L29/792
CPC分类号： H01L29/66833 , G11C16/0475 , G11C16/14 , H01L29/7923
摘要： The present invention is a method and system for erasing a nitride memory device. In one embodiment of the present invention, an isolated P-well is formed in a semiconductor substrate. A plurality of N-type impurity concentrations are formed in the isolated P-well and a nitride memory cell is fabricated between two of the N-type impurity concentrations. Finally, an electrical contact is coupled to the isolated P-well.
摘要翻译：本发明是一种擦除氮化物存储器件的方法和系统。在本发明的一个实施例中，在半导体衬底中形成隔离的P阱。在分离的P阱中形成多个N型杂质浓度，并且在两种N型杂质浓度之间制造氮化物存储单元。最后，电接点耦合到隔离的P阱。

4. 发明授权

US06788583B2 Pre-charge method for reading a non-volatile memory cell 失效
标题翻译：用于读取非易失性存储单元的预充电方法
公开(公告)号：US06788583B2
公开(公告)日：2004-09-07
申请号：US10307749
申请日：2002-12-02
申请人： Yi He , Edward F. Runnion , Zhizheng Liu , Mark W. Randolph , Darlene G. Hamilton , Pauling Chen , Binh Le
发明人： Yi He , Edward F. Runnion , Zhizheng Liu , Mark W. Randolph , Darlene G. Hamilton , Pauling Chen , Binh Le
IPC分类号： G11C1606
CPC分类号： G11C7/12 , G11C16/0475 , G11C16/24
摘要： A method of detecting a charge stored on a charge storage region of a first dual bit dielectric memory cell within an array of dual bit dielectric memory cells comprises grounding a first bit line that forms a source junction with a channel region of the first memory cell. A high voltage is applied to a gate of the first memory cell and to a second bit line that is the next bit line to the right of the first bit line and separated from the first bit line only by the channel region. A third bit line, that is the next bit line to the right of the second bit line, is isolated such that its potential is effected only by its junctions with the a second channel region and a third channel region on opposing sides of the third bit line. A high voltage is applied to a pre-charge bit line that is to the right of the third bit line and current flow is detected at the second bit line to determine the programmed status of a source bit of the memory cell.
摘要翻译：一种检测存储在双位介质存储器单元阵列内的第一双位介质存储单元的电荷存储区域上的电荷的方法包括使与第一存储单元的沟道区形成源极结的第一位线接地。高电压被施加到第一存储单元的栅极和第二位线，第二位线是第一位线右侧的下一个位线，并且仅与通道区域从第一位线分离。位于第二位线右侧的下一个位线的第三位线是隔离的，使得其电位仅由其与第二通道区域的结和仅在第三位的相对侧上的第三通道区域线。将高电压施加到位于第三位线右侧的预充电位线，并且在第二位线处检测电流以确定存储器单元的源位的编程状态。

5. 发明授权

US07626869B2 Multi-phase wordline erasing for flash memory 有权
标题翻译：闪存多相字线擦除
公开(公告)号：US07626869B2
公开(公告)日：2009-12-01
申请号：US11745327
申请日：2007-05-07
申请人： Xuguang Wang , Yi He , Zhizheng Liu , Sung-Yong Chung , Darlene G. Hamilton , Ashot Melik-Martirosian , Gulzar Kathawala , Ming Sang Kwan , Mark Randolph , Timothy Thurgate
发明人： Xuguang Wang , Yi He , Zhizheng Liu , Sung-Yong Chung , Darlene G. Hamilton , Ashot Melik-Martirosian , Gulzar Kathawala , Ming Sang Kwan , Mark Randolph , Timothy Thurgate
IPC分类号： G11C11/34
CPC分类号： G11C16/16
摘要： Erasing wordlines at the same time can cause undesirable results because some wordlines are affected by electromagnetic waves of other wordlines. However, other wordlines are not affected because they are next to contacts. Therefore, it can be beneficial to erase wordlines in a multi-phase sequence that allows for erasing wordlines without an impact from other wordlines.
摘要翻译：同时删除字线可能会导致不良结果，因为某些字线受到其他字线的电磁波的影响。然而，其他字线不受影响，因为它们在联系人旁边。因此，删除允许擦除字线而不受其他字线影响的多相序列中的字线可能是有益的。

6. 发明授权

US07561457B2 Select transistor using buried bit line from core 有权
标题翻译：选择晶体管使用埋入位线从核心
公开(公告)号：US07561457B2
公开(公告)日：2009-07-14
申请号：US11465701
申请日：2006-08-18
申请人： Mark Randolph , Zhizheng Liu , Ashot Melik-Martirosian , Yi He , Shankar Sinha
发明人： Mark Randolph , Zhizheng Liu , Ashot Melik-Martirosian , Yi He , Shankar Sinha
IPC分类号： G11C17/00
CPC分类号： G11C5/063 , H01L27/0207 , H01L27/105 , H01L27/11519 , H01L27/11526 , H01L27/11531
摘要： A semiconductor device includes a core memory array and a periphery area. The core memory array area includes a group of memory cells. The periphery area includes a group of select transistors. The select transistors are formed at substantially the same pitch as the memory cells in the core memory array and with substantially the same channel length.
摘要翻译：半导体器件包括核心存储器阵列和周边区域。核心存储器阵列区域包括一组存储器单元。外围区域包括一组选择晶体管。选择晶体管以与芯存储器阵列中的存储器单元基本相同的间距形成并具有基本上相同的沟道长度。

7. 发明申请

US20080279014A1 MULTI-PHASE WORDLINE ERASING FOR FLASH MEMORY 有权
标题翻译：闪存存储器的多相WORDLINE擦除
公开(公告)号：US20080279014A1
公开(公告)日：2008-11-13
申请号：US11745327
申请日：2007-05-07
申请人： Xuguang Wang , Yi He , Zhizheng Liu , Sung-Yong Chung , Darlene G. Hamilton , Ashot Melik-Martirosian , Gulzar Kathawala , Ming Sang Kwan , Mark Randolph , Timothy Thurgate
发明人： Xuguang Wang , Yi He , Zhizheng Liu , Sung-Yong Chung , Darlene G. Hamilton , Ashot Melik-Martirosian , Gulzar Kathawala , Ming Sang Kwan , Mark Randolph , Timothy Thurgate
IPC分类号： G11C11/34
CPC分类号： G11C16/16
摘要： Erasing wordlines at the same time can cause undesirable results because some wordlines are affected by electromagnetic waves of other wordlines. However, other wordlines are not affected because they are next to contacts. Therefore, it can be beneficial to erase wordlines in a multi-phase sequence that allows for erasing wordlines without an impact from other wordlines.
摘要翻译：同时删除字线可能会导致不良结果，因为某些字线受到其他字线的电磁波的影响。然而，其他字线不受影响，因为它们在联系人旁边。因此，删除允许擦除字线而不受其他字线影响的多相序列中的字线可能是有益的。

8. 发明授权

US07170796B1 Methods and systems for reducing the threshold voltage distribution following a memory cell erase 有权
标题翻译：减少存储单元擦除后阈值电压分布的方法和系统
公开(公告)号：US07170796B1
公开(公告)日：2007-01-30
申请号：US11193391
申请日：2005-08-01
申请人： Yi He , Gwyn Jones , Edward F. Runnion , Mark Randolph
发明人： Yi He , Gwyn Jones , Edward F. Runnion , Mark Randolph
IPC分类号： G11C11/34
CPC分类号： G11C16/14 , G11C16/3468 , G11C16/3472 , G11C16/3477
摘要： A method is provided for erasing a memory device including a number of memory cells, the memory cells including a substrate, a control gate, a charge storage element, a source region and a drain region. The method includes erasing a group of memory cells to lower a maximum threshold voltage of the group of memory cells below a first predetermined level. The group of memory cells is soft-programmed to raise a minimum threshold voltage of the group of memory cells above a second predetermined level. The group of memory cells is erased, following soft-programming, resulting in a reduced threshold voltage distribution associated with the group of memory cells.
摘要翻译：提供了一种用于擦除包括多个存储单元的存储器件的方法，所述存储器单元包括衬底，控制栅极，电荷存储元件，源极区域和漏极区域。该方法包括擦除一组存储器单元以将存储器单元组的最大阈值电压降低到低于第一预定水平。存储器单元组被软编程以将存储器单元组的最小阈值电压提高到高于第二预定水平。在软编程之后，存储单元组被擦除，导致与该组存储器单元相关联的阈值电压分布降低。

9. 发明授权

US07157335B1 Using thin undoped TEOS with BPTEOS ILD or BPTEOS ILD alone to improve charge loss and contact resistance in multi bit memory devices 有权
标题翻译：单独使用BPTEOS ILD或BPTEOS ILD的薄的未掺杂TEOS来改善多位存储器件中的电荷损耗和接触电阻
公开(公告)号：US07157335B1
公开(公告)日：2007-01-02
申请号：US10917562
申请日：2004-08-13
申请人： Ning Cheng , Minh Van Ngo , Hirokazu Tokuno , Lu You , Angela T. Hui , Yi He , Brian Mooney , Jean Yei-Mei Yang , Mark T. Ramsbey
发明人： Ning Cheng , Minh Van Ngo , Hirokazu Tokuno , Lu You , Angela T. Hui , Yi He , Brian Mooney , Jean Yei-Mei Yang , Mark T. Ramsbey
IPC分类号： H01L21/336
CPC分类号： H01L27/115 , H01L27/11568
摘要： The present invention facilitates dual bit memory devices and operation of dual bit memory device by providing systems and methods that employ a relatively thin undoped TEOS liner during fabrication, instead of a relatively thick TEOS layer that is conventionally used. Employment of the relatively thin liner facilitates dual bit memory device operation by mitigating charge loss and contact resistance while providing protection against unwanted dopant diffusion. The present invention includes utilizing a relatively thin undoped TEOS liner that is formed on wordlines and portions of a charge trapping dielectric layer. The relatively thin undoped TEOS liner is formed with a thickness of less than about 400 Angstroms so that contact resistance and charge loss are improved and yet providing suitable protection for operation of the device. Additionally, the present invention includes foregoing with an undoped TEOS liner altogether.
摘要翻译：本发明通过提供在制造期间使用相对薄的未掺杂TEOS衬垫的系统和方法而不是通常使用的相对较厚的TEOS层来便于双位存储器件和双位存储器件的操作。使用相对薄的衬垫通过减轻电荷损失和接触电阻而提供双位存储器件操作，同时提供防止不期望的掺杂剂扩散的保护。本发明包括利用形成在字线和电荷捕获电介质层的部分上的相对薄的未掺杂的TEOS衬垫。相对薄的未掺杂的TEOS衬垫形成有小于约400埃的厚度，使得接触电阻和电荷损失得到改善，并且为器件的操作提供适当的保护。此外，本发明包括前述的未掺杂的TEOS衬垫。

10. 发明授权

US06436768B1 Source drain implant during ONO formation for improved isolation of SONOS devices 有权
标题翻译：在ONO形成期间的源极漏极注入，以改善SONOS器件的隔离
公开(公告)号：US06436768B1
公开(公告)日：2002-08-20
申请号：US09893279
申请日：2001-06-27
申请人： Jean Yee-Mei Yang , Mark T. Ramsbey , Emmanuil Manos Lingunis , Yider Wu , Tazrien Kamal , Yi He , Edward Hsia , Hidehiko Shiraiwa
发明人： Jean Yee-Mei Yang , Mark T. Ramsbey , Emmanuil Manos Lingunis , Yider Wu , Tazrien Kamal , Yi He , Edward Hsia , Hidehiko Shiraiwa
IPC分类号： H01L21336
CPC分类号： H01L21/2652 , H01L21/2658 , H01L27/11568 , H01L29/66833
摘要： One aspect of the present invention relates to a method of forming a SONOS type non-volatile semiconductor memory device, involving forming a first layer of a charge trapping dielectric on a semiconductor substrate; forming a second layer of the charge trapping dielectric over the first layer of the charge trapping dielectric on the semiconductor substrate; optionally at least partially forming a third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate; optionally removing the third layer of the charge trapping dielectric; forming a source/drain mask over the charge trapping dielectric; implanting a source/drain implant through the charge trapping dielectric into the semiconductor substrate; optionally removing the third layer of the charge trapping dielectric; and one of forming the third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate, reforming the third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate, or forming additional material over the third layer of the charge trapping dielectric.
摘要翻译：本发明的一个方面涉及一种形成SONOS型非易失性半导体存储器件的方法，包括在半导体衬底上形成电荷俘获电介质的第一层; 在所述半导体衬底上的所述电荷俘获电介质的所述第一层上形成所述电荷俘获电介质的第二层; 可选地至少部分地在所述半导体衬底上的所述电荷俘获电介质的所述第二层上形成所述电荷俘获电介质的第三层; 任选地去除电荷俘获电介质的第三层; 在电荷俘获电介质上形成源极/漏极掩模; 将源极/漏极注入物通过电荷俘获电介质注入到半导体衬底中; 任选地去除电荷俘获电介质的第三层; 以及在半导体衬底上的电荷俘获电介质的第二层上形成电荷俘获电介质的第三层之一，在半导体衬底上的电荷俘获电介质的第二层上重整第三层电荷俘获电介质，或在电荷俘获电介质的第三层上形成附加材料。

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