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1. 发明授权

US06436768B1 Source drain implant during ONO formation for improved isolation of SONOS devices 有权
标题翻译：在ONO形成期间的源极漏极注入，以改善SONOS器件的隔离
公开(公告)号：US06436768B1
公开(公告)日：2002-08-20
申请号：US09893279
申请日：2001-06-27
申请人： Jean Yee-Mei Yang , Mark T. Ramsbey , Emmanuil Manos Lingunis , Yider Wu , Tazrien Kamal , Yi He , Edward Hsia , Hidehiko Shiraiwa
发明人： Jean Yee-Mei Yang , Mark T. Ramsbey , Emmanuil Manos Lingunis , Yider Wu , Tazrien Kamal , Yi He , Edward Hsia , Hidehiko Shiraiwa
IPC分类号： H01L21336
CPC分类号： H01L21/2652 , H01L21/2658 , H01L27/11568 , H01L29/66833
摘要： One aspect of the present invention relates to a method of forming a SONOS type non-volatile semiconductor memory device, involving forming a first layer of a charge trapping dielectric on a semiconductor substrate; forming a second layer of the charge trapping dielectric over the first layer of the charge trapping dielectric on the semiconductor substrate; optionally at least partially forming a third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate; optionally removing the third layer of the charge trapping dielectric; forming a source/drain mask over the charge trapping dielectric; implanting a source/drain implant through the charge trapping dielectric into the semiconductor substrate; optionally removing the third layer of the charge trapping dielectric; and one of forming the third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate, reforming the third layer of the charge trapping dielectric over the second layer of the charge trapping dielectric on the semiconductor substrate, or forming additional material over the third layer of the charge trapping dielectric.
摘要翻译：本发明的一个方面涉及一种形成SONOS型非易失性半导体存储器件的方法，包括在半导体衬底上形成电荷俘获电介质的第一层; 在所述半导体衬底上的所述电荷俘获电介质的所述第一层上形成所述电荷俘获电介质的第二层; 可选地至少部分地在所述半导体衬底上的所述电荷俘获电介质的所述第二层上形成所述电荷俘获电介质的第三层; 任选地去除电荷俘获电介质的第三层; 在电荷俘获电介质上形成源极/漏极掩模; 将源极/漏极注入物通过电荷俘获电介质注入到半导体衬底中; 任选地去除电荷俘获电介质的第三层; 以及在半导体衬底上的电荷俘获电介质的第二层上形成电荷俘获电介质的第三层之一，在半导体衬底上的电荷俘获电介质的第二层上重整第三层电荷俘获电介质，或在电荷俘获电介质的第三层上形成附加材料。

2. 发明授权

US06707078B1 Dummy wordline for erase and bitline leakage 有权
标题翻译：用于擦除和位线泄漏的虚拟字线
公开(公告)号：US06707078B1
公开(公告)日：2004-03-16
申请号：US10230729
申请日：2002-08-29
申请人： Hidehiko Shiraiwa , Yider Wu , Jean Yee-Mei Yang , Mark T. Ramsbey , Darlene G. Hamilton
发明人： Hidehiko Shiraiwa , Yider Wu , Jean Yee-Mei Yang , Mark T. Ramsbey , Darlene G. Hamilton
IPC分类号： H01L2968
CPC分类号： H01L27/11568 , G11C16/0466 , H01L27/115
摘要： One aspect of the present invention relates to a SONOS type non-volatile semiconductor memory device having improved erase speed, the device containing bitlines extending in a first direction; wordlines extending in a second direction, the wordlines comprising functioning wordlines and at least one dummy wordline, wherein the dummy wordline is positioned near at least one of a bitline contact and an edge of the core region, and the dummy wordline is treated so as not to cycle between on and off states. Another aspect of the present invention relates to a method of making a SONOS type non-volatile semiconductor memory device having improved erase speed, involving forming a plurality of bitlines extending in a first direction in the core region; forming a plurality of functioning wordlines extending in a second direction in the core region; forming at least one dummy wordline between the functioning wordlines and the periphery region or between the functioning wordlines and a bitline contact and treating the device so that the dummy wordline does not cycle between on and off states.
摘要翻译：本发明的一个方面涉及一种具有改进的擦除速度的SONOS型非易失性半导体存储器件，该器件含有沿第一方向延伸的位线; 所述字线在第二方向上延伸，所述字线包括功能字线和至少一个伪字线，其中所述伪字线位于所述芯区域的位线接触和边缘中的至少一个附近，并且所述伪字线被处理为不在开关状态之间循环。本发明的另一方面涉及一种制造具有改进的擦除速度的SONOS型非易失性半导体存储器件的方法，包括形成在芯区域中沿第一方向延伸的多个位线; 形成在所述芯区域中沿第二方向延伸的多个功能字线; 在功能字线和外围区域之间或在功能字线和位线接触之间形成至少一个伪字线，并对器件进行处理，使得伪字线不会在导通和关断状态之间循环。

3. 发明授权

US06706595B2 Hard mask process for memory device without bitline shorts 有权
标题翻译：内存设备的硬掩模处理，无位线短路
公开(公告)号：US06706595B2
公开(公告)日：2004-03-16
申请号：US10100485
申请日：2002-03-14
申请人： Jean Y. Yang , Mark T. Ramsbey , Hidehiko Shiraiwa , Yider Wu , Emmanuil Lingunis , Tazrien Kamal
发明人： Jean Y. Yang , Mark T. Ramsbey , Hidehiko Shiraiwa , Yider Wu , Emmanuil Lingunis , Tazrien Kamal
IPC分类号： H01L21336
CPC分类号： H01L27/11568 , H01L27/115
摘要： A manufacturing method for a MirrorBit® Flash memory includes providing a semiconductor substrate and depositing a charge-trapping dielectric layer. First and second bitlines are implanted and a wordline layer is deposited. A hard mask layer is deposited over the wordline layer. The hard mask is of a material formulated for removal without damaging the charge-trapping dielectric layer. A photoresist is deposited over the wordline layer and used to form a hard mask. The photoresist is removed. The wordline layer is processed using the hard mask to form a wordline and the hard mask is removed. A salicide is grown without short-circuiting the first and second bitlines.
摘要翻译：用于MirrorBit（闪存）闪存的制造方法包括提供半导体衬底和沉积电荷俘获电介质层。植入第一和第二位线，并存放字线层。硬掩模层沉积在字线层上。硬掩模是配制用于去除而不损坏电荷捕获介电层的材料。光刻胶沉积在字线层上并用于形成硬掩模。去除光致抗蚀剂。使用硬掩模处理字线层以形成字线，并且去除硬掩模。生长自杀剂不会使第一和第二位线短路。

4. 发明授权

US06720133B1 Memory manufacturing process using disposable ARC for wordline formation 失效
标题翻译：使用一次性ARC进行字线形成的存储器制造过程
公开(公告)号：US06720133B1
公开(公告)日：2004-04-13
申请号：US10126280
申请日：2002-04-19
申请人： Mark T. Ramsbey , Kouros Ghandehari , Tazrien Kamal , Jean Y. Yang , Emmanuil Lingunis , Hidehiko Shiraiwa
发明人： Mark T. Ramsbey , Kouros Ghandehari , Tazrien Kamal , Jean Y. Yang , Emmanuil Lingunis , Hidehiko Shiraiwa
IPC分类号： G03F700
CPC分类号： H01L27/11568 , H01L27/115 , Y10S430/151
摘要： A method of manufacturing an integrated circuit includes a semiconductor substrate having bitlines under a charge-trapping material over a core region and a gate insulator material over a periphery region. A wordline-gate material, a hard mask, and a first photoresist are deposited and patterned over the core region while covering the periphery region. After removing the first photoresist, wordlines are formed from the wordline-gate material in the core region. An anti-reflective coating and a second photoresist are deposited and patterned over the periphery region and covering the core region. The anti-reflective coating is removable without damaging the charge-trapping material. After removing the second photoresist and the anti-reflective coating, gates are formed from the wordline-gate material in the periphery region and the integrated circuit completed.
摘要翻译：集成电路的制造方法包括在芯区域上的电荷捕获材料下方具有位线的半导体衬底和在周边区域上的栅极绝缘体材料。在覆盖周边区域的同时，在芯区域上沉积并图案化字线栅极材料，硬掩模和第一光致抗蚀剂。在去除第一光致抗蚀剂之后，从芯区域中的字线栅极材料形成字线。在外围区域上沉积并图案化抗反射涂层和第二光致抗蚀剂并覆盖芯区域。防反射涂层是可去除的，而不会损坏电荷捕获材料。在去除第二光致抗蚀剂和抗反射涂层之后，栅极由周边区域中的字线栅极材料形成，并且集成电路完成。

5. 发明授权

US06912163B2 Memory device having high work function gate and method of erasing same 有权
标题翻译：具有高功函数门的存储器件及其擦除方法
公开(公告)号：US06912163B2
公开(公告)日：2005-06-28
申请号：US10658506
申请日：2003-09-09
申请人： Wei Zheng , Yun Wu , Hidehiko Shiraiwa , Mark T. Ramsbey , Tazrien Kamal
发明人： Wei Zheng , Yun Wu , Hidehiko Shiraiwa , Mark T. Ramsbey , Tazrien Kamal
IPC分类号： H01L29/788 , H01L29/792 , G11C16/04
CPC分类号： H01L29/7923 , H01L29/7887
摘要： A charge trapping dielectric memory device. The memory device includes a gate electrode disposed over a dielectric stack that includes a dielectric charge trapping layer. The gate electrode has a work function of about 4.6 eV to about 5.2 eV.
摘要翻译：电荷俘获介质存储器件。存储器件包括设置在包括介电电荷捕获层的电介质叠层上的栅电极。栅电极具有约4.6eV至约5.2eV的功函数。

6. 发明授权

US08673716B2 Memory manufacturing process with bitline isolation 有权
标题翻译：内存制造过程采用位线隔离
公开(公告)号：US08673716B2
公开(公告)日：2014-03-18
申请号：US10118732
申请日：2002-04-08
申请人： Mark T. Ramsbey , Tazrien Kamal , Jean Y. Yang , Emmanuil Lingunis , Hidehiko Shiraiwa , Yu Sun
发明人： Mark T. Ramsbey , Tazrien Kamal , Jean Y. Yang , Emmanuil Lingunis , Hidehiko Shiraiwa , Yu Sun
IPC分类号： H01L21/8247
CPC分类号： H01L27/11568 , H01L27/105 , H01L27/11573
摘要： A method of manufacturing an integrated circuit is provided with a semiconductor substrate having a core region and a periphery region. A charge-trapping dielectric layer is deposited in the core region, and a gate dielectric layer is deposited in the periphery region. Bitlines are formed in the semiconductor substrate in the core region and not in the periphery region. A wordline-gate layer is formed and implanted with dopant in the core region and not in the periphery region. A wordline and gate are formed. Source/drain junctions are implanted with dopant in the semiconductor substrate around the gate, and the gate is implanted with a gate doping implantation in the periphery region and not in the core region.
摘要翻译：集成电路的制造方法具有具有芯区域和周边区域的半导体基板。在芯区域中沉积电荷捕获电介质层，并且在周边区域中沉积栅极电介质层。位线在芯区域中的半导体衬底中而不是在周边区域中形成。在芯区域而不是周边区域中形成并注入掺杂剂的字线栅层。形成了一条字和门。源极/漏极结在栅极周围的半导体衬底中注入掺杂剂，栅极注入栅极掺杂注入在外围区域而不在核心区域。

7. 发明授权

US06884681B1 Method of manufacturing a semiconductor memory with deuterated materials 有权
标题翻译：用氘代材料制造半导体存储器的方法
公开(公告)号：US06884681B1
公开(公告)日：2005-04-26
申请号：US10672093
申请日：2003-09-26
申请人： Tazrien Kamal , Arvind Halliyal , Minh Van Ngo , Mark T. Ramsbey , Jean Y. Yang , Hidehiko Shiraiwa , Rinji Sugino
发明人： Tazrien Kamal , Arvind Halliyal , Minh Van Ngo , Mark T. Ramsbey , Jean Y. Yang , Hidehiko Shiraiwa , Rinji Sugino
IPC分类号： H01L21/336 , H01L21/8246
CPC分类号： H01L27/11568 , H01L29/66833
摘要： A method for manufacturing a MirrorBit® Flash memory includes providing a semiconductor substrate and successively depositing a first insulating layer, a charge-trapping layer, and a second insulating layer. First and second bitlines are implanted and wordlines are formed before completing the memory. Spacers are formed between the wordlines and an inter-layer dielectric layer is formed over the wordlines. One or more of the second insulating layer, wordlines, spacers, and inter-layer dielectric layers are deuterated, replacing hydrogen bonds with deuterium, thus improving data retention and substantially reducing charge loss.
摘要翻译：一种用于制造MirrorBit（闪存）闪存的方法包括：提供半导体衬底，并依次沉积第一绝缘层，电荷俘获层和第二绝缘层。植入第一和第二位线，并在完成内存之前形成字线。在字线之间形成间隔，并且在字线之间形成层间电介质层。第二绝缘层，字线，间隔层和层间电介质层中的一个或多个被氘化，用氘替代氢键，从而改善数据保留并显着降低电荷损失。

8. 发明授权

US06479348B1 Method of making memory wordline hard mask extension 有权
标题翻译：制作内存字线硬掩模扩展的方法
公开(公告)号：US06479348B1
公开(公告)日：2002-11-12
申请号：US10109516
申请日：2002-08-27
申请人： Tazrien Kamal , Minh Van Ngo , Mark T. Ramsbey , Jeffrey Shields , Jean Y. Yang , Emmanuil Lingunis , Hidehiko Shiraiwa , Angela T. Hui
发明人： Tazrien Kamal , Minh Van Ngo , Mark T. Ramsbey , Jeffrey Shields , Jean Y. Yang , Emmanuil Lingunis , Hidehiko Shiraiwa , Angela T. Hui
IPC分类号： H01L218247
CPC分类号： H01L27/11568 , H01L27/115
摘要： A manufacturing method is provided for an integrated circuit memory with closely spaced wordlines formed by using hard mask extensions. A charge-trapping dielectric material is deposited over a semiconductor substrate and first and second bitlines are formed therein. A wordline material and a hard mask material are deposited over the wordline material. A photoresist material is deposited over the hard mask material and is processed to form a patterned photoresist material. The hard mask material is processed using the patterned photoresist material to form a patterned hard mask material. The patterned photoresist is then removed. A hard mask extension material is deposited over the wordline material and is processed to form a hard mask extension. The wordline material is processed using the patterned hard mask material and the hard mask extension to form a wordline, and the patterned hard mask material and the hard mask extension are then removed.
摘要翻译：提供了一种用于通过使用硬掩模延伸部形成的具有紧密间隔的字线的集成电路存储器的制造方法。在半导体衬底上沉积电荷俘获电介质材料，并在其中形成第一和第二位线。字线材料和硬掩模材料沉积在字线材料上。光致抗蚀剂材料沉积在硬掩模材料上并被处理以形成图案化的光致抗蚀剂材料。使用图案化的光致抗蚀剂材料处理硬掩模材料以形成图案化的硬掩模材料。然后去除图案化的光致抗蚀剂。硬掩模延伸材料沉积在字线材料上并被处理以形成硬掩模延伸部。使用图案化的硬掩模材料和硬掩模延伸部来处理字线材料以形成字线，然后去除图案化的硬掩模材料和硬掩模延伸部。

9. 发明授权

US06670241B1 Semiconductor memory with deuterated materials 有权
标题翻译：具有氘化材料的半导体存储器
公开(公告)号：US06670241B1
公开(公告)日：2003-12-30
申请号：US10128771
申请日：2002-04-22
申请人： Tazrien Kamal , Arvind Halliyal , Minh Van Ngo , Mark T. Ramsbey , Jean Y. Yang , Hidehiko Shiraiwa , Rinji Sugino
发明人： Tazrien Kamal , Arvind Halliyal , Minh Van Ngo , Mark T. Ramsbey , Jean Y. Yang , Hidehiko Shiraiwa , Rinji Sugino
IPC分类号： H01L21336
CPC分类号： H01L27/11568 , H01L29/66833
摘要： A device and method for manufacturing thereof for a MirrorBit® Flash memory includes providing a semiconductor substrate and successively depositing a first insulating layer, a charge-trapping layer, and a second insulating layer. First and second bitlines are implanted and wordlines are formed before completing the memory. Spacers are formed between the wordlines and an inter-layer dielectric layer is formed over the wordlines. One or more of the second insulating layer, wordlines, spacers, and inter-layer dielectric layers are deuterated, replacing hydrogen bonds with deuterium, thus improving data retention and substantially reducing charge loss.
摘要翻译：用于制造MirrorBit（闪存）闪存的器件及其制造方法包括：提供半导体衬底，并依次沉积第一绝缘层，电荷俘获层和第二绝缘层。植入第一和第二位线，并在完成内存之前形成字线。在字线之间形成间隔，并且在字线之间形成层间电介质层。第二绝缘层，字线，间隔层和层间电介质层中的一个或多个被氘化，用氘替代氢键，从而改善数据保留并显着降低电荷损失。

10. 发明授权

US06653191B1 Memory manufacturing process using bitline rapid thermal anneal 失效
标题翻译：使用位线快速热退火的存储器制造过程
公开(公告)号：US06653191B1
公开(公告)日：2003-11-25
申请号：US10151576
申请日：2002-05-16
申请人： Jean Y. Yang , Arvind Halliyal , Amir H. Jafarpour , Tazrien Kamal , Mark T. Ramsbey , Emmanuil Lingunis , Hidehiko Shiraiwa
发明人： Jean Y. Yang , Arvind Halliyal , Amir H. Jafarpour , Tazrien Kamal , Mark T. Ramsbey , Emmanuil Lingunis , Hidehiko Shiraiwa
IPC分类号： H01L218247
CPC分类号： H01L27/11568 , H01L27/105 , H01L27/115 , H01L27/11573
摘要： A method of manufacturing an integrated circuit includes providing a semiconductor substrate and depositing a charge-trapping dielectric layer and a gate dielectric layer over the semiconductor substrate. Bitlines are implanted closely in the semiconductor substrate and annealed using a rapid thermal anneal. Wordlines and gates are formed and source/drain junctions are implanted in the semiconductor substrate. An interlayer dielectric layer is deposited and the integrated circuit completed.
摘要翻译：集成电路的制造方法包括提供半导体衬底，并在半导体衬底上沉积电荷俘获电介质层和栅介质层。位线在半导体衬底中紧密地植入，并使用快速热退火退火。形成字线和栅极，并且将源极/漏极结注入到半导体衬底中。沉积层间电介质层并完成集成电路。

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