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    • 3. 发明授权
    • Method of manufacturing and mounting electronic devices to limit the effects of parasitics
    • 制造和安装电子设备以限制寄生效应的方法
    • US06675450B1
    • 2004-01-13
    • US09698175
    • 2000-10-30
    • Linus Albert FetterYiu-Huen WongMichael George Zierdt
    • Linus Albert FetterYiu-Huen WongMichael George Zierdt
    • H04R1700
    • H03H9/172G01R31/2824H01L24/81H01L2224/8121H01L2224/81815H01L2924/01019H01L2924/14H03H3/02H03H9/02125Y10T29/42Y10T29/49144Y10T29/49155Y10T29/49156H01L2924/00
    • A method of producing and mounting electronic devices to negate the effects of parasitics on device performance. In one aspect, the substrate surface of the device is coated with a thin, etch-resistant film during fabrication that acts as a barrier to allow removal of substrate material beneath the film, creating a suspended structure upon which the remaining layers of circuitry rest. Alternatively the device is made with a film that is integral to the device, and that acts as the supporting membrane. To mount the device on a carrier or package, solder bumps are applied near the ends of the conductors of the device, and the die is then secured to a carrier or package, and positioned so that leads extending from the conductors mate up with bonding strips on the carrier or package. The solder bumps are then reflowed or melted to establish electrical connection between leads of the device and corresponding bonding strips of the carrier. The resultant electronic device is essentially immune to the effects or parasitic capacitanaces and parasitic inductances, with the device as mounted being further configured so as to tune out any residual parasitics which may still exist after fabrication.
    • 一种制造和安装电子设备以消除寄生效应对设备性能的方法。 在一个方面,在制造期间,器件的衬底表面涂覆有薄的耐蚀刻膜,其用作屏障以允许去除膜下方的衬底材料,产生悬挂结构,剩余的电路层在其上休息。 或者,该装置由与装置成一体的膜制成,并且用作支撑膜。 为了将器件安装在载体或封装上,在器件的导体的端部附近施加焊料凸块,然后将管芯固定到载体或封装上,并将其定位成使得从导体延伸的引线与接合条配合 在载体或包装上。 焊料凸块然后被回流或熔化,以在器件的引线和载体的相应接合条之间建立电连接。 所得到的电子器件基本上免受影响或寄生电容和寄生电感的影响,安装的器件被进一步配置以便调出在制造之后仍然存在的任何残留寄生效应。
    • 7. 发明授权
    • Methods for making microstructures
    • 制作微结构的方法
    • US5439782A
    • 1995-08-08
    • US165203
    • 1993-12-13
    • William H. HaemmerleWilliam M. MacDonaldCasimir R. NijanderJoseph ShmulovichWesley P. TownsendYiu-Huen Wong
    • William H. HaemmerleWilliam M. MacDonaldCasimir R. NijanderJoseph ShmulovichWesley P. TownsendYiu-Huen Wong
    • C23F4/00G02B6/122G02B6/13G02B6/30G02B6/12
    • G02B6/1228G02B6/1221G02B6/305
    • Tapered optical waveguides (33') can be easily made by using photolithographic masking and etching to define on a substrate (21) a first polymer structure (22) having a substantially uniform thickness and a tapered width. The first polymer structure is heated sufficiently to form a meniscus along its entire length. The fluidity causes the material to redistribute itself such that, rather than being of uniform thickness, it has a thickness that varies with its width; consequently, the thickness as well as the width of the first polymer structure becomes tapered. The first polymer is cooled and hardened to form a second polymer structure (22') that has a tapered width and a tapered thickness as is desirable for a tapered optical waveguide. The second polymer structure itself can be used as a tapered optical waveguide, or it can be used to control the reactive ion etching of the underlying substrate. In the latter case, the configuration of the tapered second polymer structure is replicated in a glass substrate, for example, which then may be used as a glass tapered optical waveguide (33').
    • 锥形光波导(33')可以通过使用光刻掩模和蚀刻来在衬底(21)上限定具有基本上均匀的厚度和锥形宽度的第一聚合物结构(22)来容易地制成。 第一聚合物结构被充分加热以在整个长度上形成弯液面。 流动性导致材料重新分布自身,使得不是具有均匀的厚度,而是具有随其宽度而变化的厚度; 因此,第一聚合物结构的厚度以及宽度变得逐渐变细。 将第一聚合物冷却并硬化以形成第二聚合物结构(22'),其具有如锥形光波导所需的锥形宽度和锥形厚度。 第二聚合物结构本身可以用作锥形光波导,或者可以用于控制底层基板的反应离子蚀刻。 在后一种情况下,锥形第二聚合物结构的构造被复制在例如可用作玻璃锥形光波导(33')的玻璃基板中。