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    • 3. 发明授权
    • Method for making microstructures
    • 制造微结构的方法
    • US5370768A
    • 1994-12-06
    • US135644
    • 1993-10-14
    • Keith O. MersereauCasimir R. NijanderWesley P. Townsend
    • Keith O. MersereauCasimir R. NijanderWesley P. Townsend
    • G02B3/00B44C1/22C03C15/00C03C25/06H01L21/306
    • G02B3/0018G02B3/0056
    • Prior to the production of microlenses (29) by the reactive ion etch technique, a pattern of notches (25) is formed in a second surface of a substrate (11) opposite a first surface on which the microlenses (29) are to be formed. Reactive ion etching of the first surface to produce the microlenses is sufficiently deep to reach the pattern of notches, thereby to separate the substrate. The array of notches may define, for example, an array of first areas (26) on the second surface, each area being surrounded by a notch. Photoresist elements (28) are then each located on an area of the first surface corresponding to a first area of the second surface, so that the separation separates the substrate into a plurality of segments (26) each containing only one of the microlenses (29). The notches can be made such that each of the segments (26) is cylindrical so that each of the microlenses formed from the substrate has a circular outer periphery.
    • 在通过反应离子蚀刻技术生产微透镜(29)之前,在与要在其上形成微透镜(29)的第一表面相对的衬底(11)的第二表面中形成凹口(25)的图案 。 第一表面的反应离子蚀刻以产生微透镜足够深以达到凹口的图案,从而分离衬底。 凹口阵列可以例如限定第二表面上的第一区域(26)的阵列,每个区域被凹口包围。 光阻元件(28)然后各自位于与第二表面的第一区域对应的第一表面的区域上,使得该分离将基板分离成多个段(26),每个段仅包含一个微透镜(29 )。 可以制成切口,使得每个片段(26)是圆柱形的,使得由基底形成的每个微透镜具有圆形的外周边。
    • 6. 发明授权
    • Methods for making microstructures
    • 制作微结构的方法
    • US5439782A
    • 1995-08-08
    • US165203
    • 1993-12-13
    • William H. HaemmerleWilliam M. MacDonaldCasimir R. NijanderJoseph ShmulovichWesley P. TownsendYiu-Huen Wong
    • William H. HaemmerleWilliam M. MacDonaldCasimir R. NijanderJoseph ShmulovichWesley P. TownsendYiu-Huen Wong
    • C23F4/00G02B6/122G02B6/13G02B6/30G02B6/12
    • G02B6/1228G02B6/1221G02B6/305
    • Tapered optical waveguides (33') can be easily made by using photolithographic masking and etching to define on a substrate (21) a first polymer structure (22) having a substantially uniform thickness and a tapered width. The first polymer structure is heated sufficiently to form a meniscus along its entire length. The fluidity causes the material to redistribute itself such that, rather than being of uniform thickness, it has a thickness that varies with its width; consequently, the thickness as well as the width of the first polymer structure becomes tapered. The first polymer is cooled and hardened to form a second polymer structure (22') that has a tapered width and a tapered thickness as is desirable for a tapered optical waveguide. The second polymer structure itself can be used as a tapered optical waveguide, or it can be used to control the reactive ion etching of the underlying substrate. In the latter case, the configuration of the tapered second polymer structure is replicated in a glass substrate, for example, which then may be used as a glass tapered optical waveguide (33').
    • 锥形光波导(33')可以通过使用光刻掩模和蚀刻来在衬底(21)上限定具有基本上均匀的厚度和锥形宽度的第一聚合物结构(22)来容易地制成。 第一聚合物结构被充分加热以在整个长度上形成弯液面。 流动性导致材料重新分布自身,使得不是具有均匀的厚度,而是具有随其宽度而变化的厚度; 因此,第一聚合物结构的厚度以及宽度变得逐渐变细。 将第一聚合物冷却并硬化以形成第二聚合物结构(22'),其具有如锥形光波导所需的锥形宽度和锥形厚度。 第二聚合物结构本身可以用作锥形光波导,或者可以用于控制底层基板的反应离子蚀刻。 在后一种情况下,锥形第二聚合物结构的构造被复制在例如可用作玻璃锥形光波导(33')的玻璃基板中。
    • 9. 发明授权
    • Method of selectively depositing a metal on a surface
    • 在表面上选择性地沉积金属的方法
    • US4322457A
    • 1982-03-30
    • US872194
    • 1978-01-25
    • William J. BaronJohn T. KenneyWesley P. Townsend
    • William J. BaronJohn T. KenneyWesley P. Townsend
    • C23C18/16H05K3/18C23C3/02
    • C23C18/1605C23C18/1653H05K3/182
    • A method of selectively depositing a metal on a surface is disclosed. The method comprises selectively coating a surface with a surface active agent, having a first surface energy, to form a coated surface having a coated portion capable of burying a higher surface energy material applied thereto and an uncoated surface pattern not so capable. The selectively coated surface is then treated with a solution, having a second surface energy higher than the first, comprising a species selected from the group comprising (1) a species capable of reducing an activating metal ion to an activating metal and (2) an activating metal species capable of participating in an electroless metal deposition, to form a surface having the species deposited atop the uncoated pattern.
    • 公开了一种在表面上选择性地沉积金属的方法。 该方法包括用具有第一表面能的表面活性剂选择性地涂覆表面以形成具有能够掩埋施加到其上的较高表面能材料的涂覆部分和不能涂覆的未涂覆表面图案的涂覆表面。 然后用具有高于第一表面能的第二表面能的溶液处理选择性涂覆的表面,该溶液包含选自以下的物质:(1)能够将活化金属离子还原成活化金属的物质,和(2) 激活能够参与无电金属沉积的金属物质,以形成具有沉积在未涂覆图案顶部的物质的表面。
    • 10. 发明授权
    • Methods of providing contact between two members normally separable by
an intervening member
    • 提供通常由中间构件分离的两个构件之间的接触的方法
    • US3956077A
    • 1976-05-11
    • US562733
    • 1975-03-27
    • John T. Hamby, Jr.Wesley P. Townsend
    • John T. Hamby, Jr.Wesley P. Townsend
    • C25D5/02C25D7/06H05K3/24C25D7/00
    • H05K3/241C25D5/02C25D7/0614Y10T156/1023
    • A continuous length, flexible, polymeric substrate has thin layers of copper clad to opposite sides thereof. Patterns of dry photopolymer material are applied to and mask selected portions of the copper to leave exposed other selected portions of the copper. The copper clad substrate is guided by a series of cathodic electrode rollers exterior of a copper plating bath into successive passes through the bath. Portions of the exposed copper contact the electrode rollers and couple the cathodic potential thereof to the bath to effect the plating of copper from the bath onto the exposed selected portions of the copper.Prior to initial engagement with the cathodic rollers, a series of protrusions are formed in portions of the exposed copper at a height relative to the thickness of the photoresist material sufficient to insure that the copper, by virtue of the protrusions, contacts the electrode rollers to facilitate the plating operation notwithstanding the intervening photoresist material.
    • 连续长度,柔性的聚合物基底具有包覆在其相对侧的铜薄层。 将干燥的光聚合物材料的图案施加到并掩蔽铜的选定部分以留下铜的暴露的其它选定部分。 铜包覆基板由镀铜浴外部的一系列阴极电极辊引导到连续通过浴中。 暴露的铜的一部分接触电极辊并将其阴极电位耦合到浴中以实现将铜从镀液镀覆到铜的暴露的选定部分上。