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    • 5. 发明授权
    • Method of forming protrusions on single crystal silicon structures built on silicon-on-insulator wafers
    • 在绝缘体上硅晶片上形成的单晶硅结构上形成突起的方法
    • US06413793B1
    • 2002-07-02
    • US09858469
    • 2001-05-17
    • Chuang-Chia LinPeter M. GulvinAlex T. TranNena Liakopoulos
    • Chuang-Chia LinPeter M. GulvinAlex T. TranNena Liakopoulos
    • H01L2100
    • B81B3/001
    • A semiconductor structure includes a substrate, a sacrificial layer formed on or over the substrate, and a structural layer formed on or over the sacrificial layer. At least one opening is formed in the structural layer. At least one opening is formed in the sacrificial layer below the at least one opening in the structural layer. The at least one opening in the structural layer and the at least one opening in the sacrificial layer are at least partially filled with a filler material. At least one portion of the structural layer is removed to define at least one microstructure. The sacrificial layer is removed such that the at least one microstructure is released from the substrate and the filler material forms one or more protrusions on the at least one microstructure, and/or one or more anchors anchoring the at least one microstructure to the substrate.
    • 半导体结构包括衬底,形成在衬底上或衬底上的牺牲层以及形成在牺牲层上或之上的结构层。 在结构层中形成至少一个开口。 在结构层中的至少一个开口下方的牺牲层中形成至少一个开口。 结构层中的至少一个开口和牺牲层中的至少一个开口至少部分地填充有填充材料。 去除结构层的至少一部分以限定至少一个微结构。 去除牺牲层,使得至少一个微结构从衬底释放并且填充材料在至少一个微结构上形成一个或多个突起,和/或一个或多个将至少一个微结构锚定到衬底的锚固件。
    • 8. 发明授权
    • Thermal actuator and an optical waveguide switch including the same
    • 热致动器和包括其的光波导开关
    • US06983088B2
    • 2006-01-03
    • US10634941
    • 2003-08-05
    • Joel A. KubbyJun MaKristine A. GermanPeter M. GulvinPinyen Lin
    • Joel A. KubbyJun MaKristine A. GermanPeter M. GulvinPinyen Lin
    • G02B6/26G02B6/42H01H37/00
    • G02B6/3576B81B3/0018G02B6/3566G02B6/3584
    • A thermal actuator comprises a plurality of substantially straight and parallel beams arranged to form a beam array. The midpoint of each beam is attached or coupled to an orthogonal coupling beam. Each array beam has a beam heating parameter with a corresponding beam heating parameter value. The beam heating parameter values vary across the beam array based on a predetermined pattern. As the beams are heated by an included heating means, the distribution of beam temperatures in the beam array becomes asymmetric, thus causing the beam array to buckle. The buckling of the beams in the beam array, in turn, causes the attached coupling beam to move in a predetermined direction. The coupling beam motion, in turn, operates an included optical waveguide switch. The beams in the beam array are heated by any of Joule heating, eddy current heating, conduction heating, convection heating and radiation heating.
    • 热致动器包括布置成形成束阵列的多个基本上直的和平行的光束。 每个光束的中点附加或耦合到正交耦合光束。 每个阵列光束具有具有对应的光束加热参数值的光束加热参数。 光束加热参数值基于预定图案在波束阵列上变化。 当束被加热装置加热时,光束阵列中光束温度的分布变得不对称,从而使光束阵列发生弯曲。 光束阵列中的光束的弯曲又使连接的光束沿预定的方向移动。 耦合光束运动反过来操作包括的光波导开关。 光束阵列中的光束通过焦耳加热,涡流加热,传导加热,对流加热和辐射加热中的任何一种加热。
    • 9. 发明授权
    • Bistable microelectromechanical system based structures, systems and methods
    • 双稳态微机电系统的结构,系统和方法
    • US06828887B2
    • 2004-12-07
    • US10063762
    • 2002-05-10
    • Joel A. KubbyFuqian YangJun MaKristine A. GermanPeter M. Gulvin
    • Joel A. KubbyFuqian YangJun MaKristine A. GermanPeter M. Gulvin
    • H01H5122
    • G02B6/3508B81B3/0054B81B2201/032G02B6/3546G02B6/3568G02B6/3582G02B6/3596H01H2001/0042
    • A bistable microelectromechanical system (MEMS) based system comprises a micromachined beam having a first stable state, in which the beam is substantially stress-free and has a specified non-linear shape, and a second stable state. The curved shape may comprises a simple curve or a compound curve. In embodiments, the boundary conditions for the beam are fixed boundary conditions, bearing boundary conditions, spring boundary conditions, or a combination thereof. The system may further comprise an actuator arranged to move the beam between the first and second stable states and a movable element that is moved between a first position and a second position in accordance with the movement of the beam between the first and second stable states. The actuator may comprise one of a thermal actuator, an electrostatic actuator, a piezoelectric actuator and a magnetic actuator. The actuator may further comprise a thermal impact actuator or a zippering electrostatic actuator.
    • 基于双稳态微机电系统(MEMS)的系统包括具有第一稳定状态的微加工梁,其中梁基本上无应力且具有特定的非线性形状和第二稳定状态。 弯曲形状可以包括简单曲线或复合曲线。 在实施例中,梁的边界条件是固定的边界条件,轴承边界条件,弹簧边界条件或其组合。 系统还可以包括致动器,其被布置成在第一和第二稳定状态之间移动梁,以及根据梁在第一和第二稳定状态之间的移动而在第一位置和第二位置之间移动的可动元件。 致动器可以包括热致动器,静电致动器,压电致动器和磁致动器中的一个。 致动器还可以包括热冲击致动器或拉链静电致动器。