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1. 发明授权

US08742470B2 pH sensor and manufacturing method 有权
标题翻译： pH传感器和制造方法
公开(公告)号：US08742470B2
公开(公告)日：2014-06-03
申请号：US13600385
申请日：2012-08-31
申请人： Matthias Merz , Coenraad Cornelis Tak , Romano Hoofman
发明人： Matthias Merz , Coenraad Cornelis Tak , Romano Hoofman
IPC分类号： G01N27/403
CPC分类号： G01N27/302 , G01N27/4148 , G01N27/4167 , G01N33/02 , G01N33/04 , G01N33/12 , H01L2224/48091 , H01L2924/1815 , Y10T29/49002 , H01L2924/00014
摘要： Disclosed is a pH sensor comprising a carrier (10) comprising a plurality of conductive tracks and an exposed conductive area (40) defining a reference electrode connected to one of said conductive tracks; a sensing device (30) mounted on the carrier and connected at least one other of said conductive tracks; an encapsulation (20) covering the carrier, said encapsulation comprising a first cavity (22) exposing a surface (32) of the sensing device and a second cavity (24) exposing the exposed conductive area, said second cavity comprising a reference electrode material (42) and an ion reservoir material (44) sharing at least one ion type with said reference electrode material, the reference electrode material being sandwiched between the exposed conductive area and the ion reservoir material. A method of manufacturing such a pH sensor is also disclosed.
摘要翻译：公开了一种pH传感器，其包括包括多个导电轨道的载体（10）和限定连接到所述导电轨道之一的参考电极的暴露导电区域（40）感测装置（30），其安装在所述载体上并且连接至少另一个所述导电轨道; 覆盖所述载体的封装（20），所述封装包括暴露所述感测装置的表面（32）的第一空腔（22）和暴露所述暴露的导电区域的第二空腔（24），所述第二空腔包括参考电极材料 42）和与所述参考电极材料共享至少一种离子型离子储存器材料（44），所述参考电极材料夹在所述暴露的导电区域和所述离子储存器材料之间。还公开了制造这种pH传感器的方法。

2. 发明申请

US20130069176A1 INTEGRATED CIRCUIT WITH SENSOR AND METHOD OF MANUFACTURING SUCH AN INTEGRATED CIRCUIT 有权
标题翻译：带有传感器的集成电路和制造这样一个集成电路的方法
公开(公告)号：US20130069176A1
公开(公告)日：2013-03-21
申请号：US13610692
申请日：2012-09-11
申请人： Roel DAAMEN , Hendrik BOUMAN , Coenraad Cornelis TAK
发明人： Roel DAAMEN , Hendrik BOUMAN , Coenraad Cornelis TAK
IPC分类号： H01L29/66 , H01L21/02
CPC分类号： H01L23/564 , G01D11/245 , G01N27/121 , H01L21/565 , H01L23/315 , H01L23/3157 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An integrated circuit package for an integrated circuit having one or more sensor elements in a sensor element area of the circuit. An encapsulation covers bond wires but leaves an opening over the sensor element area. A protection layer is provided over the integrated circuit over which the encapsulation extends, and it has a channel around the sensor element area to act as a trap for any encapsulation material which has crept into the opening area.
摘要翻译：一种用于集成电路的集成电路封装，其具有在电路的传感器元件区域中的一个或多个传感器元件。封装覆盖接合线，但在传感器元件区域上留下一个开口。保护层设置在集成电路上，封装延伸通过该集成电路，并且其周围具有传感器元件区域的通道，以用作已经进入开口区域的任何封装材料的陷阱。

3. 发明申请

US20130069120A1 PH SENSOR AND MANUFACTURING METHOD 有权
标题翻译： PH传感器和制造方法
公开(公告)号：US20130069120A1
公开(公告)日：2013-03-21
申请号：US13600385
申请日：2012-08-31
申请人： Matthias MERZ , Coenraad Cornelis TAK , Romano HOOFMAN
发明人： Matthias MERZ , Coenraad Cornelis TAK , Romano HOOFMAN
IPC分类号： G01N27/414 , H01L21/98
CPC分类号： G01N27/302 , G01N27/4148 , G01N27/4167 , G01N33/02 , G01N33/04 , G01N33/12 , H01L2224/48091 , H01L2924/1815 , Y10T29/49002 , H01L2924/00014
摘要： Disclosed is a pH sensor comprising a carrier (10) comprising a plurality of conductive tracks and an exposed conductive area (40) defining a reference electrode connected to one of said conductive tracks; a sensing device (30) mounted on the carrier and connected at least one other of said conductive tracks; an encapsulation (20) covering the carrier, said encapsulation comprising a first cavity (22) exposing a surface (32) of the sensing device and a second cavity (24) exposing the exposed conductive area, said second cavity comprising a reference electrode material (42) and an ion reservoir material (44) sharing at least one ion type with said reference electrode material, the reference electrode material being sandwiched between the exposed conductive area and the ion reservoir material. A method of manufacturing such a pH sensor is also disclosed.
摘要翻译：公开了一种pH传感器，其包括包括多个导电轨道的载体（10）和限定连接到所述导电轨道之一的参考电极的暴露导电区域（40）感测装置（30），其安装在所述载体上并且连接至少另一个所述导电轨道; 覆盖所述载体的封装（20），所述封装包括暴露所述感测装置的表面（32）的第一空腔（22）和暴露所述暴露的导电区域的第二空腔（24），所述第二空腔包括参考电极材料 42）和与所述参考电极材料共享至少一种离子型离子储存器材料（44），所述参考电极材料夹在所述暴露的导电区域和所述离子储存器材料之间。还公开了制造这种pH传感器的方法。

4. 发明授权

US09070695B2 Integrated circuit with sensor and method of manufacturing such an integrated circuit 有权
标题翻译：具有传感器的集成电路和制造这种集成电路的方法
公开(公告)号：US09070695B2
公开(公告)日：2015-06-30
申请号：US13610692
申请日：2012-09-11
申请人： Roel Daamen , Hendrik Bouman , Coenraad Cornelis Tak
发明人： Roel Daamen , Hendrik Bouman , Coenraad Cornelis Tak
IPC分类号： H01L27/14 , H01L23/00 , H01L23/31 , H01L21/56 , G01N27/12 , G01D11/24
CPC分类号： H01L23/564 , G01D11/245 , G01N27/121 , H01L21/565 , H01L23/315 , H01L23/3157 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An integrated circuit package for an integrated circuit having one or more sensor elements in a sensor element area of the circuit. An encapsulation covers bond wires but leaves an opening over the sensor element area. A protection layer is provided over the integrated circuit over which the encapsulation extends, and it has a channel around the sensor element area to act as a trap for any encapsulation material which has crept into the opening area.
摘要翻译：一种用于集成电路的集成电路封装，其具有在电路的传感器元件区域中的一个或多个传感器元件。封装覆盖接合线，但在传感器元件区域上留下一个开口。保护层设置在集成电路上，封装延伸通过该集成电路，并且其周围具有传感器元件区域的通道，以用作已经进入开口区域的任何封装材料的陷阱。

5. 发明申请

US20080290511A1 Chip Assembly and Method of Manufacturing Thereof 审中-公开
标题翻译：芯片组装及其制造方法
公开(公告)号：US20080290511A1
公开(公告)日：2008-11-27
申请号：US12093336
申请日：2006-11-07
申请人： Nicolaas Johannes Anthonius Van Veen , Ronald Dekker , Coenraad Cornelis Tak
发明人： Nicolaas Johannes Anthonius Van Veen , Ronald Dekker , Coenraad Cornelis Tak
IPC分类号： H01L21/50 , H01L23/48
CPC分类号： H01L25/0657 , H01L23/5389 , H01L24/48 , H01L24/73 , H01L25/03 , H01L25/105 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16265 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73204 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2225/06517 , H01L2225/06524 , H01L2225/06555 , H01L2225/06586 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/07811 , H01L2924/10329 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/48145 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An assembly of a first chip (100) and a second chip (200), which first chip (100) is flexible and is provided with a first and a second resin layer (12, 52) on opposite sides (1, 2) of the chip (100), which allows to keep the first chip under compressive conditions, on which first and second side (1,2) respectively first side contact pads (33) and second side contact pads (31) are present, which first side contact pads (33) are coupled to corresponding contact pads (211) of the second chip (200), and which second side contact pads (31) are designed for external connection of the assembly.
摘要翻译：第一芯片（100）和第二芯片（200）的组件，第一芯片（100）是柔性的并且在第二芯片（100）的相对侧（1,2）上设置有第一和第二树脂层（12,52）存在第一和第二侧（1,2）分别为第一侧接触焊盘（33）和第二侧接触焊盘（31）的第一芯片（100），其保持第一芯片处于压缩状态，第一侧接触焊盘（33）耦合到第二芯片（200）的对应的接触焊盘（211），并且哪个第二侧接触焊盘（31）被设计用于组件的外部连接。

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