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1. 发明申请

US20020185523A1 Integrated solder bump deposition apparatus and method 失效
标题翻译：集成焊锡凸块沉积设备及方法
公开(公告)号：US20020185523A1
公开(公告)日：2002-12-12
申请号：US09880185
申请日：2001-06-12
申请人： Applied Materials, Inc.
发明人： Yezdi N. Dordi , Robin Cheung
IPC分类号： B23K020/08 , B23K037/06 , B23K031/02 , B23K035/12
CPC分类号： H01L21/67236 , B23K3/0623 , H01L21/67225 , H01L21/6723
摘要： An integrated solder bump deposition method and apparatus that enables solder bumps to be lithographically formed on a substrate. The apparatus comprises a plurality of electrolyte cells, and etch/clean/passthrough station and a reflow chamber.
摘要翻译：一种集成焊料凸块淀积方法和装置，其使得能够在基板上光刻地形成焊料凸块。该设备包括多个电解质电池，以及蚀刻/清洁/直通站和回流室。

2. 发明申请

US20040035695A1 Flow diffuser to be used in electro-chemical plating system 失效
标题翻译：流动扩散器用于电化学电镀系统
公开(公告)号：US20040035695A1
公开(公告)日：2004-02-26
申请号：US10609862
申请日：2003-06-30
申请人： APPLIED MATERIALS, INC.
发明人： Yezdi N. Dordi , Joseph J. Stevens , H. Peter W. Hey , Donald J. K. Olgado
IPC分类号： C25D017/00
CPC分类号： C25D17/008 , C25D7/123 , C25D17/001 , H01L21/2885 , H05K3/241
摘要： An apparatus comprising an electrolyte cell, an anode, and a porous rigid diffuser. The electrolyte cell is configured to receive a substrate to have a metal film deposited thereon. An anode is contained within the electrolyte cell. A porous rigid diffuser is connected to the electrolyte cell and extends across the electrolyte cell. The diffuser is positioned between a location that the substrate is to be positioned when the metal film is deposited thereon and the anode.
摘要翻译：一种包括电解质电池，阳极和多孔刚性扩散器的装置。电解质电池被配置为接收衬底以在其上沉积金属膜。阳极被包含在电解质电池内。多孔刚性扩散器连接到电解质电池并延伸穿过电解质电池。当沉积金属膜并且阳极时，扩散器位于衬底要被定位的位置之间。

3. 发明申请

US20040016648A1 Tilted electrochemical plating cell with constant wafer immersion angle 审中-公开
标题翻译：具有恒定晶片浸入角度的倾斜电化学电镀槽
公开(公告)号：US20040016648A1
公开(公告)日：2004-01-29
申请号：US10266477
申请日：2002-10-07
申请人： Applied Materials, Inc.
发明人： Dmitry Lubomirsky , Saravjeet Singh , Yezdi N. Dordi , Sheshraj Tulshibagwale
IPC分类号： C25D017/00
CPC分类号： C25D17/02 , C25D7/123 , C25D17/001 , C25D21/00
摘要： A method and apparatus for immersing a substrate for plating operations. The apparatus generally includes a plating cell configured contain a plating solution therein. The plating cell includes at least one fluid basin, a diffusion plate position in a lower portion of the at least one fluid basin, and an anode positioned below the diffusion plate, the anode and the diffusion plate being positioned in parallel orientation with each other and in a tilted orientation with respect to horizontal. The apparatus further includes a head assembly positioned proximate the plating cell, the head assembly including a base member, an actuator positioned at a distal end of the base member, and a substrate support assembly in mechanical communication with the actuator, the substrate support assembly being configured to support a substrate in the at least one fluid basin for processing in an orientation that is generally parallel to the diffusion plate.
摘要翻译：一种用于浸渍电镀操作的基板的方法和装置。该装置通常包括在其中包含电镀液的电镀单元。所述电镀单元包括至少一个流体池，位于所述至少一个流体槽的下部的扩散板位置和位于所述扩散板下方的阳极，所述阳极和所述扩散板彼此平行取向地定位，相对于水平方向倾斜。所述装置还包括位于所述电镀单元附近的头部组件，所述头部组件包括基座构件，位于所述基座构件的远端的致动器以及与所述致动器机械连通的衬底支撑组件，所述衬底支撑组件被配置为支撑所述至少一个流体池中的基底，用于以大致平行于所述扩散板的取向进行处理。

4. 发明申请

US20020043466A1 Method and apparatus for patching electrochemically deposited layers using electroless deposited materials 审中-公开
标题翻译：使用无电沉积材料修补电化学沉积层的方法和装置
公开(公告)号：US20020043466A1
公开(公告)日：2002-04-18
申请号：US09900710
申请日：2001-07-06
申请人： APPLIED MATERIALS, INC.
发明人： Yezdi N. Dordi , Peter W. Hey
IPC分类号： C25D005/02 , H01L021/288 , H01L021/445 , C25D005/10 , C23C028/02 , C25D005/50
CPC分类号： H01L21/68728 , C23C18/165 , C23C18/1653 , C23C18/31 , C23C18/36 , C25D5/50 , C25D7/123 , H01L21/68742 , H01L21/68792
摘要： Methods and apparatus for forming a conformal conductive layer on a substrate for an electroplating process are provided. In one aspect, a method is provided for processing a substrate including depositing a conductive barrier layer on the substrate, and then depositing a nucleation layer on the conductive barrier layer. The nucleation layer is deposited by depositing a first conductive material on the substrate and then depositing a second conductive material on the first conductive material by an electroless deposition process. The second conductive material may comprise nickel, tin, or combinations thereof. The substrate may then be further processed by electroplating a third conductive material on the second conductive material and/or annealing the substrate.
摘要翻译：提供了在用于电镀工艺的衬底上形成保形导电层的方法和装置。在一个方面，提供了一种用于处理衬底的方法，包括在衬底上沉积导电阻挡层，然后在导电阻挡层上沉积成核层。通过在衬底上沉积第一导电材料然后通过无电沉积工艺将第二导电材料沉积在第一导电材料上来沉积成核层。第二导电材料可以包括镍，锡或其组合。然后可以通过在第二导电材料上电镀第三导电材料和/或退火衬底来进一步处理衬底。

5. 发明申请

US20040026255A1 Insoluble anode loop in copper electrodeposition cell for interconnect formation 审中-公开
标题翻译：用于互连形成的铜电沉积池中的不溶性阳极环
公开(公告)号：US20040026255A1
公开(公告)日：2004-02-12
申请号：US10358781
申请日：2003-02-04
申请人： Applied Materials, Inc
发明人： Nicolay Y. Kovarsky , Dmitry Lubomirsky , Anzhong Chang , Yezdi N. Dordi , Michael X. Yang
IPC分类号： C25D017/00 , C25D003/38
CPC分类号： H01L21/2885 , C25D7/123 , C25D21/18 , C25D21/22
摘要： Embodiments of the invention generally provide a method and apparatus for plating a metal on a substrate. The electrochemical plating system generally includes a plating cell having an anolyte compartment and a catholyte compartment, the anolyte compartment having an insoluble anode and an anolyte therein. The catholyte compartment generally includes a substrate support member and a catholyte therein. In addition, the plating cell generally includes an ion-exchange membrane disposed between the anolyte compartment and the catholyte compartment and a pump in fluid communication with the anolyte compartment, the pump configured to provide an anolyte to the anolyte compartment having a linear velocity of between about 0.5 cm/sec to about 50 cm/sec. The method generally includes supplying an anolyte solution to an anolyte compartment disposed in a plating cell having an anolyte compartment and a catholyte compartment. The anolyte solution generally passes through the anolyte compartment at a linear velocity of between about 0.5 cm/sec to about 50 cm/sec. The method further includes plating a metal onto the substrate with a catholyte solution disposed in a catholyte compartment of the plating cell, the catholyte compartment and the anolyte compartment separated by an ion-exchange membrane, removing used anolyte solution from the plating cell and passing at least a portion of the used anolyte solution through a correction device including at least one of copper oxide, copper hydroxide and combinations thereof.
摘要翻译：本发明的实施例通常提供一种用于在基底上电镀金属的方法和装置。电化学电镀系统通常包括具有阳极电解液室和阴极电解液隔室的电镀槽，阳极电解液室具有不溶性阳极和阳极电解液。阴极电解液隔室通常在其中包括基板支撑构件和阴极电解液。此外，电镀槽通常包括设置在阳极电解液室和阴极电解液室之间的离子交换膜和与阳极电解液室流体连通的泵，所述泵被配置为向阳极电解液室提供线性速度介于约0.5cm / sec至约50cm / sec。该方法通常包括将阳极电解液供应到设置在具有阳极电解液室和阴极电解液室的电镀槽中的阳极电解液室。阳极电解液通常以约0.5cm / sec至约50cm / sec的线速度穿过阳极电解液室。该方法还包括用设置在电镀池的阴极电解液室中的阴极电解液，阴离子电解质隔室和由离子交换膜隔开的阳极电解液室将金属电镀到基板上，从电镀槽中除去使用的阳极电解液并通过通过包括氧化铜，氢氧化铜及其组合中的至少一种的校正装置的至少一部分所使用的阳极电解液。

6. 发明申请

US20030201184A1 Method and associated apparatus for tilting a substrate upon entry for metal deposition 审中-公开
公开(公告)号：US20030201184A1
公开(公告)日：2003-10-30
申请号：US10424479
申请日：2003-04-28
申请人： Applied Materials, Inc.
发明人： Yezdi N. Dordi , Joseph J. Stevens , Michael N. Sugarman
IPC分类号： C25D005/00
CPC分类号： C25D7/123 , C25D21/00 , C25D21/04 , H01L21/2885 , H05K3/241
摘要： An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in the electrochemical plating system by tilting the substrate as it enters the electrolyte solution to limit the trapping or formation of air bubbles in the electrolyte solution between the substrate and the substrate holder. In another aspect, an apparatus is provided for electroplating that comprises a cell, a substrate holder, and an actuator. The actuator can displace the substrate holder assembly in the x and z directions and also tilt the substrate. In another aspect, a method is provided of driving a meniscus formed by electrolyte solution across a surface of a substrate. The method comprises enhancing the interaction between the electrolyte solution meniscus and the surface as the substrate is immersed into the electrolyte solution.

7. 发明申请

US20030034250A1 REVERSE VOLTAGE BIAS FOR ELECTRO-CHEMICAL PLATING SYSTEM AND METHOD 失效
标题翻译：电化学镀层系统的逆向偏置和方法
公开(公告)号：US20030034250A1
公开(公告)日：2003-02-20
申请号：US09766060
申请日：2001-01-18
申请人： Applied Materials, Inc.
发明人： H. Peter W. Hey , Yezdi N. Dordi
IPC分类号： C25D005/18 , C25D005/00 , C25D017/16 , C25D017/00 , C25D021/12
CPC分类号： H01L21/6723 , C25D5/18 , C25D7/123 , C25D17/001 , C25D21/04 , H01L21/2885 , H01L21/67028 , H01L21/67051 , H01L21/6708 , H01L21/67126 , H05K3/241
摘要： A method of immersing a substrate into electrolyte solution for electroplating, the method comprising connecting an electric source between an anode immersed in the electrolyte solution and a seed layer formed on the substrate. A first voltage level of the seed layer is biased to be equal to, or more positive than, a second voltage level of the anode. The substrate is then immersed into the electrolyte solution.
摘要翻译：一种将基板浸入用于电镀的电解液中的方法，所述方法包括将浸入电解质溶液中的阳极和形成在基板上的种子层之间的电源连接起来。种子层的第一电压电平被偏置成与阳极的第二电压电平相等或更正。然后将衬底浸入电解质溶液中。

8. 发明申请

US20040134775A1 Electrochemical processing cell 审中-公开
标题翻译：电化学处理池
公开(公告)号：US20040134775A1
公开(公告)日：2004-07-15
申请号：US10627336
申请日：2003-07-24
申请人： APPLIED MATERIALS, INC.
发明人： Michael X. Yang , Dmitry Lubomirsky , Yezdi N. Dordi , Saravjeet Sinh , Sheshraj L. Tulshibagwale , Nicolay Y. Kovarsky
IPC分类号： C25C007/04
CPC分类号： A23D7/01 , A23D7/00 , A23D7/005 , A23J7/00 , C07F9/103 , C25D7/123 , C25D17/001 , H01L21/2885
摘要： Embodiments of the invention provide an electrochemical plating cell. The plating cell includes a fluid basin having an anolyte solution compartment and a catholyte solution compartment, an ionic membrane positioned between the anolyte solution compartment and the catholyte solution compartment, and an anode positioned in the anolyte solution compartment, wherein the ionic membrane comprises a poly tetrafluoroethylene based ionomer.
摘要翻译：本发明的实施方案提供一种电化学电镀单元。电镀槽包括具有阳极电解液隔室和阴极电解液溶液隔室的流体池，位于阳极电解液室和阴极电解液溶液室之间的离子膜和位于阳极电解液溶液室中的阳极，其中离子膜包含聚四氟乙烯基离聚物。

9. 发明申请

US20010052465A1 Flow diffuser to be used in electro-chemical plating system 失效
标题翻译：流动扩散器用于电化学电镀系统
公开(公告)号：US20010052465A1
公开(公告)日：2001-12-20
申请号：US09731326
申请日：2000-12-05
申请人： Applied Materials, Inc.
发明人： Yezdi N. Dordi , Joseph J. Stevens , H. Peter W. Hey , Donald J. K. Olgado
IPC分类号： C25C007/00 , C25D005/16 , C25D017/00
CPC分类号： C25D17/008 , C25D7/123 , C25D17/001 , H01L21/2885 , H05K3/241
摘要： An apparatus comprising an electrolyte cell, an anode, and a porous rigid diffuser. The electrolyte cell is configured to receive a substrate to have a metal film deposited thereon. An anode is contained within the electrolyte cell. A porous rigid diffuser is connected to the electrolyte cell and extends across the electrolyte cell. The diffuser is positioned between a location that the substrate is to be positioned when the metal film is deposited thereon and the anode.
摘要翻译：一种包括电解质电池，阳极和多孔刚性扩散器的装置。电解质电池被配置为接收衬底以在其上沉积金属膜。阳极被包含在电解质电池内。多孔刚性扩散器连接到电解质电池并延伸穿过电解质电池。当沉积金属膜并且阳极时，扩散器位于衬底要被定位的位置之间。

10. 发明申请

US20010000396A1 Electric contact element for electrochemical deposition system 有权
标题翻译：电接触元件用于电化学沉积系统
公开(公告)号：US20010000396A1
公开(公告)日：2001-04-26
申请号：US09730968
申请日：2000-12-05
申请人： Applied Materials Inc.
发明人： Yezdi N. Dordi , Joseph J. Stevens
IPC分类号： C25D005/02 , C25D017/00
CPC分类号： C25D17/001 , C25D7/123 , C25D17/12 , H01L21/2885 , H05K3/241
摘要： An apparatus and associated method for deposition of metal ions contained in an electrolyte solution to form a metal film primarily on a seed layer formed on at least a first side of a substrate. The substrate has a second side that is opposed the first side and an edge joining the first side and the second side. The apparatus comprises a substrate holder system and an electric contact element. The electric contact element physically contacts one of the second side or the edge of the substrate. In one aspect, the substrate is rotated about its vertical axis when the seed layer of substrate is immersed in the electrolyte solution during the metal film deposition. In another aspect, the substrate is not rotated about its vertical axis when the seed layer on the substrate is immersed in the electrolyte solution during the metal film deposition. In different embodiments, the electric contact element contacts the seed layer on the second side of the substrate, a diffusion barrier layer on the second side of the substrate, or the seed layer on the edge of the substrate.
摘要翻译：一种用于沉积包含在电解质溶液中的金属离子的装置和相关方法，以主要形成在形成在基底的至少第一侧上的种子层上形成金属膜。衬底具有与第一侧相对的第二侧和连接第一侧和第二侧的边缘。该装置包括基板保持器系统和电接触元件。电接触元件物理地接触基板的第二面或边缘中的一个。在一个方面，当在金属膜沉积期间将衬底的晶种层浸入电解质溶液中时，衬底围绕其垂直轴线旋转。在另一方面，当在金属膜沉积期间当衬底上的晶种层浸入电解质溶液中时，衬底不绕其垂直轴旋转。在不同的实施例中，电接触元件接触衬底的第二侧上的种子层，在衬底的第二侧上的扩散阻挡层或衬底的边缘上的种子层。

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