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1. 发明申请

US20010052465A1 Flow diffuser to be used in electro-chemical plating system 失效
标题翻译：流动扩散器用于电化学电镀系统
公开(公告)号：US20010052465A1
公开(公告)日：2001-12-20
申请号：US09731326
申请日：2000-12-05
申请人： Applied Materials, Inc.
发明人： Yezdi N. Dordi , Joseph J. Stevens , H. Peter W. Hey , Donald J. K. Olgado
IPC分类号： C25C007/00 , C25D005/16 , C25D017/00
CPC分类号： C25D17/008 , C25D7/123 , C25D17/001 , H01L21/2885 , H05K3/241
摘要： An apparatus comprising an electrolyte cell, an anode, and a porous rigid diffuser. The electrolyte cell is configured to receive a substrate to have a metal film deposited thereon. An anode is contained within the electrolyte cell. A porous rigid diffuser is connected to the electrolyte cell and extends across the electrolyte cell. The diffuser is positioned between a location that the substrate is to be positioned when the metal film is deposited thereon and the anode.
摘要翻译：一种包括电解质电池，阳极和多孔刚性扩散器的装置。电解质电池被配置为接收衬底以在其上沉积金属膜。阳极被包含在电解质电池内。多孔刚性扩散器连接到电解质电池并延伸穿过电解质电池。当沉积金属膜并且阳极时，扩散器位于衬底要被定位的位置之间。

2. 发明申请

US20030141018A1 Electroless deposition apparatus 有权
标题翻译：无电沉积装置
公开(公告)号：US20030141018A1
公开(公告)日：2003-07-31
申请号：US10059572
申请日：2002-01-28
申请人： APPLIED MATERIALS, INC.
发明人： Joseph J. Stevens , Dmitry Lubomirsky , Ian Pancham , Donald J. K. Olgado , Howard E. Grunes , Yeuk-Fai Edwin Mok
IPC分类号： C23F001/00 , C23C016/00
CPC分类号： H01L21/67126 , C23C18/1607 , C23C18/1619 , C23C18/1628 , C23C18/165 , C23C18/1653 , C23C18/1678 , C25D7/123 , C25D17/001
摘要： An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a nullpatchnull of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer. In one embodiment, the conductive material is deposited over the catalytic layer by electroless deposition. In another embodiment, the conductive material is deposited over the catalytic layer by electroless deposition followed by electroplating or followed by chemical vapor deposition. In still another embodiment, the conductive material is deposited over the catalytic layer by electroplating or by chemical vapor deposition.
摘要翻译：一种沉积包含至少一种选自贵金属，半贵金属，其合金及其组合的金属的催化剂层的装置和方法，其形成在基板上形成的亚微米特征。贵金属的实例包括钯和铂。半贵金属的例子包括钴，镍和钨。可通过无电沉积，电镀或化学气相沉积来沉积催化层。在一个实施方案中，催化层可以沉积在特征中以用作随后沉积的导电材料的阻挡层。在另一个实施方案中，催化剂层可以沉积在阻挡层上。在另一个实施方案中，催化层可以沉积在沉积在阻挡层上的种子层上，以充当种子层中任何不连续性的“贴片”。一旦沉积了催化层，可以在催化剂层上沉积诸如铜的导电材料。在一个实施例中，导电材料通过无电沉积沉积在催化剂层上。在另一个实施方案中，导电材料通过无电沉积然后电镀或随后进行化学气相沉积沉积在催化剂层上。在另一个实施例中，导电材料通过电镀或化学气相沉积沉积在催化层上。

3. 发明申请

US20030205461A1 Removable modular cell for electro-chemical plating 审中-公开
标题翻译：用于电化学电镀的可拆卸模块
公开(公告)号：US20030205461A1
公开(公告)日：2003-11-06
申请号：US10429684
申请日：2003-05-05
申请人： APPLIED MATERIALS, INC.
发明人： Donald J. K. Olgado
IPC分类号： C25D017/00
CPC分类号： H01L21/67167 , C25D7/123 , C25D17/001 , C25D17/004 , H01L21/2885 , H01L21/67028 , H01L21/67051 , H01L21/6708 , H01L21/67126 , H01L21/6719 , H01L21/6723 , H05K3/241 , Y10T29/49002
摘要： The present invention relates to a method and apparatus for depositing metal on a substrate. More particularly, one embodiment of the metal deposition cell comprising a cell base, an anode, and a cell top. The cell base at least partially defines an interior recess. The anode mounted within the interior recess to the cell base. The cell top is removably mounted to the cell base. In one embodiment, a method of removing a modular metal deposition cell from a deposition cell mount is provided. The modular metal deposition cell comprises a cell top and a cell bottom. The method comprises unfastening a fastener that secures the cell top to the cell bottom, and also fastens the cell top and the cell bottom to the deposition cell mount. The cell top or the cell bottom is then removed from the deposition cell mount.
摘要翻译：本发明涉及一种在衬底上沉积金属的方法和装置。更具体地，包括电池基底，阳极和电池顶部的金属沉积电池的一个实施例。细胞基底至少部分地限定内部凹部。阳极安装在内部凹部内的细胞基底。细胞顶部可拆卸地安装到细胞基底。在一个实施例中，提供了从沉积电池座移除模块化金属沉积池的方法。模块化金属沉积池包括电池顶部和电池底部。该方法包括松开将细胞顶部固定到细胞底部的紧固件，并且还将细胞顶部和细胞底部紧固到沉积细胞基底。然后将细胞顶部或细胞底部从沉积单元底座移除。

4. 发明申请

US20030141673A1 Rotary vacuum-chuck with venturi formed at base of rotating shaft 失效
标题翻译：带有文丘里管的旋转式真空吸盘形成在旋转轴的底部
公开(公告)号：US20030141673A1
公开(公告)日：2003-07-31
申请号：US10057114
申请日：2002-01-25
申请人： Applied Materials, Inc.
发明人： Donald J. K. Olgado , Bernardo Donoso , Alexander Lerner
IPC分类号： B25B011/00 , B23Q003/00
CPC分类号： H01L21/6838 , B23B31/307 , B25B11/005 , Y10T279/11
摘要： In a first aspect, a rotary vacuum-chuck is provided that may hold a substrate such as a silicon wafer for rotation. The vacuum-chuck includes a hollow rotary shaft and a chuck mounted on the hollow rotary shaft and having a surface adapted to support a substrate. The chuck has one or more openings in fluid communication with the hollow rotary shaft. A venturi is formed near an end of the hollow rotary shaft to apply vacuum to the hollow rotary shaft and the openings in the chuck surface. No seal is required between the end of the hollow rotary shaft and a surrounding stationary block.
摘要翻译：在第一方面中，提供一种旋转式真空吸盘，其可以保持诸如硅晶片的基板旋转。真空吸盘包括中空旋转轴和安装在中空旋转轴上并具有适于支撑基底的表面的卡盘。卡盘具有与中空旋转轴流体连通的一个或多个开口。在中空旋转轴的端部附近形成文丘里管，以向空心旋转轴和卡盘表面中的开口施加真空。在空心旋转轴的端部和周围的固定块之间不需要密封。

5. 发明申请

US20040035695A1 Flow diffuser to be used in electro-chemical plating system 失效
标题翻译：流动扩散器用于电化学电镀系统
公开(公告)号：US20040035695A1
公开(公告)日：2004-02-26
申请号：US10609862
申请日：2003-06-30
申请人： APPLIED MATERIALS, INC.
发明人： Yezdi N. Dordi , Joseph J. Stevens , H. Peter W. Hey , Donald J. K. Olgado
IPC分类号： C25D017/00
CPC分类号： C25D17/008 , C25D7/123 , C25D17/001 , H01L21/2885 , H05K3/241
摘要： An apparatus comprising an electrolyte cell, an anode, and a porous rigid diffuser. The electrolyte cell is configured to receive a substrate to have a metal film deposited thereon. An anode is contained within the electrolyte cell. A porous rigid diffuser is connected to the electrolyte cell and extends across the electrolyte cell. The diffuser is positioned between a location that the substrate is to be positioned when the metal film is deposited thereon and the anode.
摘要翻译：一种包括电解质电池，阳极和多孔刚性扩散器的装置。电解质电池被配置为接收衬底以在其上沉积金属膜。阳极被包含在电解质电池内。多孔刚性扩散器连接到电解质电池并延伸穿过电解质电池。当沉积金属膜并且阳极时，扩散器位于衬底要被定位的位置之间。

6. 发明申请

US20020096436A1 Substrate holder system with substrate extension apparatus and associated method 失效
标题翻译：基板支架系统，具有基板延伸装置及相关方法
公开(公告)号：US20020096436A1
公开(公告)日：2002-07-25
申请号：US09765855
申请日：2001-01-19
申请人： Applied Materials, Inc.
发明人： Donald J. K. Olgado , Jayant Lakshmikanthan
IPC分类号： C25D005/48 , C25D017/00
CPC分类号： C25D5/04 , C25D7/123 , C25D17/001 , C25D17/004 , C25D17/06
摘要： An apparatus and associated method that removes electrolyte solution from a substrate, the apparatus comprises a thrust plate and a substrate extension unit. The thrust plate at least partially defines a spin recess. The substrate extension unit can be displaced between a retracted position and an extended position relative to the spin recess. The substrate extension unit is disposed within the spin recess when positioned in the retracted position. The substrate extension unit at least partially extends from within the spin recess when positioned in the extended position. The substrate is processed by immersing at least a portion of the substrate in a wet solution. The substrate is removed from the wet solution. The substrate extension unit extends into its extended position, and the substrate is spun. Extending the substrate extension unit limits the formation of fluid traps within the substrate holder assembly or between the substrate and the substrate holder assembly.
摘要翻译：一种从衬底去除电解质溶液的装置和相关方法，该装置包括推力板和衬底延伸单元。止推板至少部分地限定旋转凹槽。衬底延伸单元可以在缩回位置和相对于自旋凹部的延伸位置之间移动。当定位在缩回位置时，衬底延伸单元设置在旋转凹槽内。当定位在延伸位置时，衬底延伸单元至少部分地在旋转凹槽内部延伸。通过将至少一部分基底浸入湿溶液中来处理基底。从湿溶液中除去底物。衬底延伸单元延伸到其延伸位置，并且衬底被旋转。扩展衬底延伸单元限制衬底保持器组件内或衬底和衬底保持器组件之间的流体捕获器的形成。

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