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1. 发明申请

US20040041001A1 Printed circuit board having solder bridges for electronically connecting conducting pads and method of fabricating solder bridges 失效
标题翻译：具有用于电连接导电焊盘的焊接桥的印刷电路板和制造焊接桥的方法
公开(公告)号：US20040041001A1
公开(公告)日：2004-03-04
申请号：US10654066
申请日：2003-09-03
发明人： Ian P. Shaeffer , Everett Basham , Christopher D. Price
IPC分类号： B23K037/06
CPC分类号： H05K3/3484 , H01R31/08 , H05K1/0293 , H05K3/1216 , H05K2201/0305 , H05K2203/043 , H05K2203/173
摘要： A method of fabricating a zero signal degradation solder bridge electrical connection for connecting adjacent conducting pads of a printed circuit board, and a printed circuit board having at least one of these solder bridge electrical connections. In the method, a stencil, having an opening that corresponds to the adjacent conducting pads and at least a portion of the surface area of the printed circuit board between the adjacent conducting pads, is placed on the surface of printed circuit board. Solder paste is then applied to the stencil such that the solder paste flows through the stencil opening and onto the adjacent conducting pads and at least a portion of the surface area of the printed circuit board between the pads. The stencil is then removed and the printed circuit board is subjected to reflow soldering, thereby fabricating a printed circuit board having a solder bridge electrical connector between adjacent conducting pads.
摘要翻译：一种制造用于连接印刷电路板的相邻导电焊盘的零信号劣化焊桥电连接的方法以及具有这些焊桥电连接中的至少一个的印刷电路板。在该方法中，将具有对应于相邻导电焊盘的开口和相邻导电焊盘之间的印刷电路板的表面区域的至少一部分的模板放置在印刷电路板的表面上。然后将焊膏施加到模板上，使得焊膏流过模板开口并且流到衬垫之间的相邻导电焊盘和印刷电路板的表面区域的至少一部分。然后去除模版，并且对印刷电路板进行回流焊接，从而制造在相邻导电焊盘之间具有焊料桥电连接器的印刷电路板。

2. 发明申请

US20040035917A1 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece 有权
标题翻译：用于在微电子工件上沉积和回流焊膏的装置和方法
公开(公告)号：US20040035917A1
公开(公告)日：2004-02-26
申请号：US10226509
申请日：2002-08-22
发明人： Michel Koopmans
IPC分类号： B23K001/08 , B23K037/06 , B23K020/14 , B23K035/12
CPC分类号： H05K3/3484 , B23K1/0016 , B23K1/0053 , B23K1/0056 , B23K1/012 , B23K3/0607 , B23K3/0638 , B23K37/06 , B23K2101/36 , H01L21/4853 , H01L24/11 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05569 , H01L2224/05571 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K3/1216 , H05K3/3494 , H05K2203/043 , H05K2203/0557 , H05K2203/107 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： Stenciling machines and methods for forming solder balls on microelectronic-workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a microelectronic workpiece having a plurality of dies includes positioning a stencil having a plurality of apertures at least proximate to the workpiece. The method further includes placing discrete masses of solder paste into the apertures and reflowing the discrete masses of solder paste while the stencil is positioned at least proximate to the workpiece and while the discrete masses are in the apertures. In another embodiment of the invention, a stenciling machine for depositing and reflowing solder paste on the microelectronic workpiece includes a heater for reflowing the solder paste, a stencil having a plurality of apertures, and a controller operatively coupled to the heater and the stencil. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.
摘要翻译：本文公开了用于在微电子工件上形成焊球的模板机和方法。在一个实施例中，一种用于在具有多个模具的微电子工件上沉积和回流焊膏的方法包括将具有多个孔的模板定位至少靠近工件。该方法还包括将离散质量的焊膏放置在孔中并回流焊料糊的离散质量，同时模板至少靠近工件定位，而离散质量位于孔中。在本发明的另一个实施例中，用于在微电子工件上沉积和回流焊膏的模板机包括用于回流焊膏的加热器，具有多个孔的模板，以及可操作地耦合到加热器和模板的控制器。控制器具有包含执行上述方法的指令的计算机可读介质。

3. 发明申请

US20040079783A1 Solder bump fabrication method and apparatus 审中-公开
标题翻译：焊点制造方法和装置
公开(公告)号：US20040079783A1
公开(公告)日：2004-04-29
申请号：US10685427
申请日：2003-10-16
发明人： Chih-Ming Chen
IPC分类号： B23K037/06
CPC分类号： H05K3/3452 , H05K1/0266 , H05K3/1216 , H05K3/3436 , H05K2201/09909 , H05K2201/09936
摘要： A solder bump fabrication method and apparatus. First, a printed circuit board, having a plurality of devices, is provided. A material is formed on the printed circuit board, and it is disposed between pins of the devices to prevent the devices from short-circuiting due to the solder bumps. Then, the solder bumps are formed on the pins of the devices so that the devices are fixed on the printed circuit board. The printed circuit board is passed through an infrared oven to melt the solder bumps. The material separates the solder bumps attached to the pins of the devices so that the devices are prevented from short-circuiting.
摘要翻译：焊料凸块制造方法和装置。首先，提供具有多个装置的印刷电路板。在印刷电路板上形成材料，并且将其设置在器件的引脚之间，以防止器件由于焊料凸块而短路。然后，在器件的引脚上形成焊料凸块，使得器件固定在印刷电路板上。印刷电路板通过红外线烘箱熔化焊料凸块。该材料将附着在器件引脚上的焊料凸块分开，以防止器件短路。

4. 发明申请

US20030111518A1 Method and apparatus for deposition of solder paste for surface mount components on a printed wiring board 失效
公开(公告)号：US20030111518A1
公开(公告)日：2003-06-19
申请号：US10017598
申请日：2001-12-18
申请人： Xerox Corporation
发明人： Robert J. Dances
IPC分类号： B23K031/02 , B23K005/22 , B23K037/06 , B23K020/14
CPC分类号： H05K3/363 , B23K3/0638 , B23K2101/42 , H05K3/0061 , H05K3/1225 , H05K3/3484 , H05K2201/09572 , H05K2201/10666
摘要： A method and apparatus for depositing solder paste on a printed wiring board has a stencil with a pattern of multiple apertures. The pattern aligns with a through-hole in the printed wiring board when the stencil is in physical contact with the printed wiring board. A squeegee arrangement applies solder paste through the multiple apertures in the stencil through the through-hole of the printed wiring board to the upper surface of the printed wiring board for securely mounting electronic components to the upper surface of the printed wiring board, for providing a thermal path for the heat sinks of the electronic components and for providing a low inductance electrical path to ground for the electrical components.

5. 发明申请

US20030024966A1 Process and device for soldering electrical components on a plastic sheet 失效
标题翻译：用于焊接塑料片上的电气部件的工艺和装置
公开(公告)号：US20030024966A1
公开(公告)日：2003-02-06
申请号：US10190618
申请日：2002-07-09
申请人： SEHO Systemtechnik GmbH
发明人： Rolf Ludwig Diehm , Volker Liedke
IPC分类号： B23K001/08 , B23K037/06 , B23K031/02
CPC分类号： B23K1/012 , B23K2101/36 , B23K2101/42 , H05K1/189 , H05K3/3494 , H05K2203/0557 , H05K2203/081 , H05K2203/111 , H05K2203/1581
摘要： The invention relates to a process for soldering electrical components to soldering positions, which are provided with soldering material, on a plastic sheet provided with applied conductor tracks. The plastic sheet is heated, from the side which is remote from the components, to a below its damage temperature and after heating its side which is remote from the components is thermally insulated. Then, the side which faces the components is acted on by a heating-gas stream which is concentrated onto the locations which are to be soldered by a template which has windows.
摘要翻译：本发明涉及一种将电气部件焊接到设置有焊接材料的焊接位置到设置有施加导体轨迹的塑料片上的工艺。塑料片从远离部件的一侧被加热到低于其损坏温度，并且在加热之后，远离部件的一侧被隔热。然后，面对组件的一侧由加热气流作用，该加热气体流集中在由具有窗口的模板被焊接的位置上。

6. 发明申请

US20020185523A1 Integrated solder bump deposition apparatus and method 失效
标题翻译：集成焊锡凸块沉积设备及方法
公开(公告)号：US20020185523A1
公开(公告)日：2002-12-12
申请号：US09880185
申请日：2001-06-12
申请人： Applied Materials, Inc.
发明人： Yezdi N. Dordi , Robin Cheung
IPC分类号： B23K020/08 , B23K037/06 , B23K031/02 , B23K035/12
CPC分类号： H01L21/67236 , B23K3/0623 , H01L21/67225 , H01L21/6723
摘要： An integrated solder bump deposition method and apparatus that enables solder bumps to be lithographically formed on a substrate. The apparatus comprises a plurality of electrolyte cells, and etch/clean/passthrough station and a reflow chamber.
摘要翻译：一种集成焊料凸块淀积方法和装置，其使得能够在基板上光刻地形成焊料凸块。该设备包括多个电解质电池，以及蚀刻/清洁/直通站和回流室。

7. 发明申请

US20020084305A1 Scavenging system 失效
标题翻译：清除系统
公开(公告)号：US20020084305A1
公开(公告)日：2002-07-04
申请号：US10026338
申请日：2001-12-20
发明人： Jesse L. Pedigo
IPC分类号： B23K005/22 , B23K001/08 , B23K037/06
CPC分类号： H05K3/1233 , H05K3/0094 , H05K3/4053 , H05K3/4069 , H05K2201/0959 , H05K2201/10204 , H05K2203/0126 , H05K2203/0139 , H05K2203/0156 , H05K2203/0182 , H05K2203/0554 , H05K2203/1105
摘要： A system comprising a scavenging blade, a printed wiring board receiving portion, and a movement mechanism adapted to move the scavenging blade and printed wiring board receiving portion relative to each other, and to a method of removing excess fill material comprising providing a printed wiring board having filled holes and at least some excess fill material on a surface of the printed wiring board, providing a system comprising a scavenging blade, positioning the printed wiring board in the system, and causing the scavenging blade to traverse at least a portion of the printed wiring board in a manner that causes the scavenging blade to remove at least a portion of the excess fill material from the printed wiring board.
摘要翻译：一种包括扫气叶片，印刷线路板接收部分和适于相对于彼此移动扫气叶片和印刷线路板接收部分的移动机构的系统，以及一种去除多余填充材料的方法，包括提供印刷线路板在印刷电路板的表面上填充孔和至少一些多余的填充材料，提供包括清扫刀片的系统，将印刷线路板定位在系统中，并且使扫气刀片穿过至少一部分印刷布线板以使清扫刀片从印刷线路板去除多余的填充材料的至少一部分的方式。

8. 发明申请

US20020053588A1 Reflow method and reflow device 审中-公开
公开(公告)号：US20020053588A1
公开(公告)日：2002-05-09
申请号：US10035443
申请日：2002-01-04
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Masahiro Taniguchi , Kazumi Ishimoto , Koichi Nagai , Osamu Yamazaki , Tatsuaki Kitagawa , Osamu Matsushima , Kazuhiro Uji , Seizo Nemoto
IPC分类号： B23K001/08 , B23K037/06
CPC分类号： B23K3/085 , B23K1/008 , B23K2101/42 , H05K3/3415 , H05K3/3447 , H05K3/3494 , H05K2203/087 , H05K2203/304
摘要： For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-connected points on said one surface of the printed circuit board. This reflow method permits secure soldering even if the hot air is set at a temperature not exceeding the heat resistance of the electronic components, which is possilbe because of its combination with the radiant heat. Moreover, this reflow method can permit soldering in such a manner that only the to-be-connected points are heated selectively, because the hot air is blown locally and roughly perpendicular to the points to be connected. Thus, this reflow method prevents heat damage to other sections than the to-be-connected points and ensures that the solder at the to-be-connected points is melted.

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