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1. 发明申请

US20020043466A1 Method and apparatus for patching electrochemically deposited layers using electroless deposited materials 审中-公开
标题翻译：使用无电沉积材料修补电化学沉积层的方法和装置
公开(公告)号：US20020043466A1
公开(公告)日：2002-04-18
申请号：US09900710
申请日：2001-07-06
申请人： APPLIED MATERIALS, INC.
发明人： Yezdi N. Dordi , Peter W. Hey
IPC分类号： C25D005/02 , H01L021/288 , H01L021/445 , C25D005/10 , C23C028/02 , C25D005/50
CPC分类号： H01L21/68728 , C23C18/165 , C23C18/1653 , C23C18/31 , C23C18/36 , C25D5/50 , C25D7/123 , H01L21/68742 , H01L21/68792
摘要： Methods and apparatus for forming a conformal conductive layer on a substrate for an electroplating process are provided. In one aspect, a method is provided for processing a substrate including depositing a conductive barrier layer on the substrate, and then depositing a nucleation layer on the conductive barrier layer. The nucleation layer is deposited by depositing a first conductive material on the substrate and then depositing a second conductive material on the first conductive material by an electroless deposition process. The second conductive material may comprise nickel, tin, or combinations thereof. The substrate may then be further processed by electroplating a third conductive material on the second conductive material and/or annealing the substrate.
摘要翻译：提供了在用于电镀工艺的衬底上形成保形导电层的方法和装置。在一个方面，提供了一种用于处理衬底的方法，包括在衬底上沉积导电阻挡层，然后在导电阻挡层上沉积成核层。通过在衬底上沉积第一导电材料然后通过无电沉积工艺将第二导电材料沉积在第一导电材料上来沉积成核层。第二导电材料可以包括镍，锡或其组合。然后可以通过在第二导电材料上电镀第三导电材料和/或退火衬底来进一步处理衬底。

2. 发明申请

US20040118695A1 Two-coat electrocoating process 审中-公开
标题翻译：双层电涂工艺
公开(公告)号：US20040118695A1
公开(公告)日：2004-06-24
申请号：US10648673
申请日：2003-08-26
发明人： Ding-Yu Chung
IPC分类号： C25D005/50
CPC分类号： C25D13/06 , C25D15/02
摘要： The present invention generally relates to a two-coat electrocoating process. More particularly, the present invention relates to a process wherein a substrate is first coated via a cathodic electrodeposition system and a second coat is subsequently applied via an anodic electrodeposition system, and curing the at least two electrodepositable layers simultaneously in a single bake where the primer coating composition is still wet when the second coat is applied.
摘要翻译：本发明一般涉及双层电涂覆工艺。更具体地说，本发明涉及一种方法，其中首先通过阴极电沉积系统涂覆基底，随后通过阳极电沉积系统施加第二涂层，并在单一烘烤中同时固化至少两个可电沉积层，其中底漆当施加第二层时，涂料组合物仍然是湿的。

3. 发明申请

US20040094425A1 Method for producing a multilayer coating and the use thereof 失效
标题翻译：多层涂层的制造方法及其用途
公开(公告)号：US20040094425A1
公开(公告)日：2004-05-20
申请号：US10381534
申请日：2003-03-26
发明人： Karl-Heinz Grosse-Brinkhaus , Georg Wigger
IPC分类号： C25D005/50
CPC分类号： B05D7/544
摘要： A process for producing a multicoat system on a substrate, in which a) an electrodeposition coating film is deposited on the substrate, b) the electrodeposition coating film is predried by heating to a predrying temperature for a predetermined period, c) a coat of a surfacer is applied to the electrodeposition coating film, and d) the electrodeposition coating film and the coat of the surfacer are baked together at elevated temperatures, and in which the predrying temperature in step b) is equal to the temperature (Tp) or lies above the temperature (Tp) at which the loss factor tannull, which is the quotient formed from the loss modulus Enull and the storage modulus Enull, of the unbaked electrodeposition coating material shows a maximum, and the use of the resulting multicoat system.
摘要翻译：一种在基板上制造多点印刷系统的方法，其中a）将电沉积涂膜沉积在基板上，b）电沉积涂膜通过加热到预烘烤温度预定的时间段，c）将表面涂料施加到电沉积涂膜上，d）将电沉积涂膜和表面涂层在高温下烘烤在一起，步骤b）中的预干燥温度等于温度（Tp）或上述由未烘烤的电沉积涂层材料的损耗模量E“和储能模量E'形成的商的损耗系数tandelta显示最大值的温度（Tp）以及所得到的多芯体系的使用。

4. 发明申请

US20030219608A1 Metal transfer sheet, producing method thereof, and producing method of ceramic condenser 审中-公开
标题翻译：金属转印片及其制造方法以及陶瓷电容器的制造方法
公开(公告)号：US20030219608A1
公开(公告)日：2003-11-27
申请号：US10442069
申请日：2003-05-21
发明人： Hitoshi Ishizaka , Yasuhiko Yamamoto , Kazuo Ouchi , Takashi Oda , Takuji Okeyui
IPC分类号： B32B015/04 , C25D005/50
CPC分类号： C23C28/023 , C25D1/04 , C25D5/34 , H05K1/0306 , H05K3/205 , Y10T428/12882 , Y10T428/1291
摘要： A metal transfer sheet which is so low in peel-strength as to be transferred to an object to be transferred with ease and reliability; a producing method thereof; and a ceramic condenser producing method for producing a reliable, compact, thin-layer ceramic condenser with improved production efficiency by transferring a metal layer to the ceramic condenser by using the metal transfer sheet. After a first metal layer is formed on a carrier film in a sputtering or an electrolytic plating method, the member thus formed is dipped in plating solution and voltage is applied in such a way that the first metal layer side is anode, to form a passive film. Sequentially, with the polarity reversed, voltage is applied in such a way that the passive film side is cathode, to form the second metal layer. After this manner, a metal transfer sheet in which the first metal layer and the second metal layer are laminated through the passive film interposed therebetween is obtained. Thereafter, the second metal layer is transferred to a ceramic green sheet in the form of an internal electrode.
摘要翻译：一种金属转印片，其剥离强度低，易于转移到被转印物体上，可靠性高; 其制造方法; 以及通过使用金属转印片将金属层转移到陶瓷冷凝器的陶瓷电容器制造方法，其制造可靠，紧凑的薄层陶瓷电容器，其具有提高的生产效率。在溅射法或电解电镀法中在载体膜上形成第一金属层之后，将如此形成的部件浸入电镀溶液中，并以第一金属层侧为阳极的方式施加电压，形成被动电影。接着，极性反转，以无源膜侧为阴极的方式施加电压，形成第二金属层。此后，得到金属转印片，其中第一金属层和第二金属层通过其间的钝化膜层压。此后，第二金属层以内部电极的形式转移到陶瓷生片。

5. 发明申请

US20010014406A1 Surface-treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil 失效
标题翻译：表面处理铜箔，表面处理铜箔的制造方法以及使用表面处理铜箔的覆铜层压板
公开(公告)号：US20010014406A1
公开(公告)日：2001-08-16
申请号：US09769244
申请日：2001-01-26
申请人： Mitsui Mining & Smelting Co., Ltd.
发明人： Masakazu Mitsuhashi , Takashi Kataoka , Naotomi Takahashi
IPC分类号： C25D005/12 , C25D005/34 , C25D005/50 , C25D007/00 , B21C037/00
CPC分类号： C23C28/00 , C23C2222/20 , C25D1/04 , C25D3/565 , C25D5/16 , C25D5/48 , H05K3/384 , H05K3/389 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K2203/1105 , Y10T428/12431
摘要： An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss in resistance against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in copper foil coated with an anti-corrosive layer formed of a zinc-copper-nickel ternary alloy. Another object is to impart excellent moisture resistance to the surface-treated copper foil. In order to attain these objects, the invention provides a surface-treated copper foil for producing printed wiring boards whose surface has been subjected to nodular treatment and anti-corrosion treatment, wherein the anti-corrosion treatment includes forming a zinc-copper-nickel ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105null C.-200null C.
摘要翻译：本发明的目的是提供一种表面处理铜箔，其能够一致地获得耐盐酸降解的百分比损失为10％以下，由铜箔制成的铜线图案测定，线宽为0.2 通过提出涂覆有由锌 - 铜 - 镍三元合金形成的防腐蚀层的铜箔中使用的硅烷偶联剂的最大效果。另一个目的是赋予表面处理铜箔优异的耐湿性。为了达到上述目的，本发明提供了一种表面经处理和防腐蚀处理的印刷线路板的表面处理铜箔，其中防腐处理包括形成锌 - 铜 - 镍三元铜箔表面的合金防腐蚀镀层; 在所述防腐镀层上形成电解铬酸盐层; 在电解铬酸盐层上形成硅烷偶联剂吸附层; 并将铜箔干燥2-6秒，使铜箔达到105℃-200℃。

6. 发明申请

US20040003873A1 Method and apparatus for annealing copper films 有权
标题翻译：铜膜退火方法和设备
公开(公告)号：US20040003873A1
公开(公告)日：2004-01-08
申请号：US10611589
申请日：2003-06-30
申请人： Applied Materials, Inc.
发明人： B. Michelle Chen , Ho Seon Shin , Yezdi Dordi , Ratson Morad , Robin Cheung
IPC分类号： C25D005/50
CPC分类号： H01L21/6723 , C22F1/02 , C22F1/08 , C25D5/48 , C25D5/50 , C25D7/123 , H01L21/67098 , H01L21/67103 , H01L21/67109 , H01L21/76838 , H01L21/7684 , H01L21/76886
摘要： A method and apparatus for annealing copper. The method comprises forming a copper layer by electroplating on a substrate in an integrated processing system and annealing the copper layer in a chamber inside the integrated processing system.
摘要翻译：一种退火铜的方法和装置。该方法包括通过电镀在一体化处理系统中的基板上形成铜层，并对集成处理系统内的室内的铜层退火。

7. 发明申请

US20030150531A1 Method and apparatus for induction heat treating electrical contacts 有权
标题翻译：感应热处理电触头的方法和装置
公开(公告)号：US20030150531A1
公开(公告)日：2003-08-14
申请号：US10073488
申请日：2002-02-11
发明人： George Jyh-Shann Chou , Bogdan Octav Ciocirlan
IPC分类号： C25D005/50
CPC分类号： H01R13/03 , C25D5/50 , H01R43/16
摘要： A method and apparatus are provided in accordance with embodiments of the present invention for heat-treating electrical contacts. The method and apparatus include plating a core wire with at least one conductive coating to form an electrical contact that experiences internal stresses. The method and apparatus further include induction heating the electrical contact for a predetermined period of time to at least partially relieve the internal stresses. A plurality of electrical contacts may be mounted on a substrate that is held near induction coils to cause heating. The electrical contacts may be formed with spring shaped bodies that are aligned at a desired orientation within magnetic fields created during induction heating. In accordance with at least one embodiment of the present invention, different portions of each electrical contact may be annealed by different desired amounts. The electrical contacts are annealed such that a base portion of each electrical contact undergoes less annealing to retain superior strength properties and the flexible portion of the electrical contact which retains superior stress-relaxation properties.
摘要翻译：根据本发明的实施例提供了一种用于热电接触的方法和装置。该方法和装置包括用至少一个导电涂层电镀芯线以形成经历内部应力的电接触。该方法和装置还包括感应加热电接触一段预定的时间以至少部分地减轻内应力。多个电触点可以安装在保持在感应线圈附近以引起加热的基板上。电触点可以形成有弹簧形体，其在感应加热期间产生的磁场内以期望的取向对准。根据本发明的至少一个实施例，每个电接触的不同部分可以通过不同的期望量进行退火。电触点退火，使得每个电接触的基部经历较少的退火以保持优异的强度性能和保持优异的应力松弛性能的电接触的柔性部分。

8. 发明申请

US20030066755A1 Metal-based anodes for aluminium electrowinning cells 失效
标题翻译：用于铝电解冶金电池的金属阳极
公开(公告)号：US20030066755A1
公开(公告)日：2003-04-10
申请号：US10161036
申请日：2002-06-03
发明人： Jean-Jacques Duruz , Thinh T. Nguyen , Vittorio De Nora
IPC分类号： C25D005/48 , C25D005/50 , B01D001/00 , B01D059/40 , C25C007/02 , C25B011/00 , C25D017/10
CPC分类号： C25C3/12 , C25C3/06
摘要： An anode of a cell for the electrowinning of aluminium comprises a nickel-iron alloy substrate having an openly porous nickel metal rich outer portion whose surface is electrochemically active. The outer portion is optionally covered with an external integral nickel-iron oxide containing surface layer which adheres to the nickel metal rich outer portion of the nickel-iron alloy and which in use is pervious to molten electrolyte. During use, the nickel metal rich outer portion contains cavities some or all of which are partly or completely filled with iron and nickel compounds, in particular oxides, fluorides and oxyfluorides.
摘要翻译：用于电解铝的电池的阳极包括镍 - 铁合金基底，其具有表面具有电化学活性的开孔的镍金属丰富的外部部分。外部部分可选地覆盖有外部整合的含镍 - 铁氧化物的表面层，该表面层附着于镍 - 铁合金的富含镍金属的外部部分，并且其在使用中可透过熔融电解质。在使用期间，富含镍金属的外部部分包含空腔，其中部分或全部部分或全部被铁和镍化合物，特别是氧化物，氟化物和氟氧化物填充。

9. 发明申请

US20020011415A1 Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio 失效
标题翻译：克服铜种子层异常的方法和装置，并调整特征尺寸和纵横比
公开(公告)号：US20020011415A1
公开(公告)日：2002-01-31
申请号：US09853962
申请日：2001-05-10
申请人： Applied Materials, Inc.
发明人： Peter Hey , Byung-Sung Leo Kwak
IPC分类号： C25D005/18 , C25D005/10 , C25D005/48 , C25D005/50
CPC分类号： H01L21/76843 , C25D5/10 , C25D5/18 , C25D7/123 , H01L21/76868 , H01L21/76873 , H01L2221/1089 , H05K3/423
摘要： A method and apparatus for electrochemically depositing a metal into a high aspect ratio structure on a substrate are provided. In one aspect, a method is provided for processing a substrate including positioning a substrate having a first conductive material disposed thereon in a processing chamber containing an electrochemical bath, depositing a second conductive material on the first conductive material as the conductive material is contacted with the electrochemical bath by applying a plating bias to the substrate while immersing the substrate into the electrochemical bath, and depositing a third conductive material in situ on the second conductive material by an electrochemical deposition technique to fill the feature. The bias may include a charge density between about 20 mA*sec/cm2 and about 160 mA*sec/cm2. The electrochemical deposition technique may include a pulse modulation technique.
摘要翻译：提供了一种在基板上将金属电化学沉积成高纵横比结构的方法和装置。在一个方面，提供了一种用于处理衬底的方法，包括在包含电化学浴的处理室中定位其上具有第一导电材料的衬底，当第一导电材料与第一导电材料接触时，将第二导电材料沉积在第一导电材料上通过在将基板浸入电化学浴中的同时将衬底施加电镀偏压并通过电化学沉积技术在第二导电材料上原位沉积第三导电材料来填充该特征，从而进行电化学浴。该偏压可以包括约20mA * sec / cm 2和约160mA * sec / cm 2之间的电荷密度。电化学沉积技术可以包括脉冲调制技术。

10. 发明申请

US20010014408A1 Surface -treated copper foil, method of producing the surface-treated copper foil, and copper-clad laminate employing the surface-treated copper foil 失效
标题翻译：表面处理铜箔，表面处理铜箔的制造方法和使用表面处理铜箔的覆铜层压板
公开(公告)号：US20010014408A1
公开(公告)日：2001-08-16
申请号：US09769253
申请日：2001-01-26
申请人： Mitsui Mining & Smelting Co. Ltd.
发明人： Masakazu Mitsuhashi , Takashi Kataoka , Naotomi Takahashi
IPC分类号： C25D007/06 , C25D005/12 , C25D005/34 , C25D005/50 , B21C037/00
CPC分类号： H05K3/384 , C23C28/00 , C23C2222/20 , C25D1/04 , C25D3/565 , C25D5/16 , C25D5/48 , C25D11/38 , H05K3/389 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K2203/1105 , Y10T428/12431
摘要： An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss in peel strength in resistance against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in copper foil coated with an anti-corrosive layer formed of a zinc-copper-tin ternary alloy. Another object is to impart excellent moisture resistance and heat resistance to the surface-treated copper foil. In order to attain these objects, the invention provides a surface-treated copper foil for producing printed wiring boards whose surface has been subjected to nodular treatment and anti-corrosion treatment, wherein the anti-corrosion treatment includes forming a zinc-copper-tin ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105null C.-200null C.
摘要翻译：本发明的目的是提供一种表面处理铜箔，其能够一致地获得耐盐酸降解的剥离强度的百分比损失为10％以下，由铜箔制成的铜图案上测量，并具有线宽度为0.2mm，通过提出涂覆有由锌 - 铜 - 锡三元合金形成的防腐蚀层的铜箔中使用的硅烷偶联剂的最大效果。另一个目的是赋予表面处理铜箔优异的耐湿性和耐热性。为了达到上述目的，本发明提供了一种表面处理铜箔，用于制造其表面进行结核处理和防腐蚀处理的印刷线路板，其中防腐处理包括形成锌 - 铜 - 锡三元铜箔表面的合金防腐蚀镀层; 在所述防腐镀层上形成电解铬酸盐层; 在电解铬酸盐层上形成硅烷偶联剂吸附层; 并将铜箔干燥2-6秒，使铜箔达到105℃-200℃。

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