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1. 发明授权

US06613239B2 Method for making an electrical circuit board 失效
公开(公告)号：US06613239B2
公开(公告)日：2003-09-02
申请号：US09836644
申请日：2001-04-17
申请人： Andrew Z. Glovatsky , Robert E. Belke , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Marc A. Straub , Richard K. McMillan , Ram S. Raghava , Thomas B. Krautheim , Michael A. Howey , Vivek A. Jairazbhoy
发明人： Andrew Z. Glovatsky , Robert E. Belke , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Marc A. Straub , Richard K. McMillan , Ram S. Raghava , Thomas B. Krautheim , Michael A. Howey , Vivek A. Jairazbhoy
IPC分类号： B44C122
CPC分类号： H05K3/4641 , H05K3/062 , H05K3/4038 , H05K3/4623 , H05K2201/0305 , H05K2201/0361 , H05K2201/0397 , H05K2201/09554 , H05K2201/09881 , H05K2203/0733 , H05K2203/1184 , Y10T29/49155
摘要： A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.

2. 发明授权

US06852932B2 Circuit board with air-bridge 失效
标题翻译：带气桥的电路板
公开(公告)号：US06852932B2
公开(公告)日：2005-02-08
申请号：US10650309
申请日：2003-08-28
申请人： Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Robert Joseph Gordon , Thomas Bernd Krautheim
发明人： Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Robert Joseph Gordon , Thomas Bernd Krautheim
IPC分类号： H05K3/00 , H05K3/06 , H05K3/40 , H05K3/42 , H05K3/44 , H05K3/46 , H05K1/11 , H01R12/04
CPC分类号： H05K3/4038 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K3/4685 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T156/1056
摘要： A multi-layer circuit board having apertures that are selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by a polymeric material. Each of the apertures selectively receives an electrically conductive material.
摘要翻译：一种多层电路板，其具有与电接地构件选择性地和电隔离的孔，并且还具有由聚合物材料在结构上支撑的选择性地形成的空气桥和/或交叉构件。每个孔选择性地接收导电材料。

3. 发明授权

US06729023B2 Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material 失效
标题翻译：制造具有由聚合物材料支撑的空气桥的多层电路板组件的方法
公开(公告)号：US06729023B2
公开(公告)日：2004-05-04
申请号：US09815564
申请日：2001-03-23
申请人： Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Robert Joseph Gordon , Thomas Bernd Krautheim
发明人： Achyuta Achari , Andrew Zachary Glovatsky , Robert Edward Belke , Brenda Joyce Nation , Delin Li , Lakhi N. Goenka , Mohan R. Paruchuri , Robert Joseph Gordon , Thomas Bernd Krautheim
IPC分类号： H05K302
CPC分类号： H05K3/4038 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K3/4685 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T156/1056
摘要： A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.
摘要翻译：一种用于制造具有孔96,98的多层电路板116的方法，其可以与电接地构件46选择性地和电隔离，并且还具有在结构上由材料112支撑的选择性地形成的空气桥和/或交叉构件104.每个孔96,98选择性地接收导电材料114。

4. 发明授权

US06381837B1 Method for making an electronic circuit assembly 失效
标题翻译：制造电子电路组件的方法
公开(公告)号：US06381837B1
公开(公告)日：2002-05-07
申请号：US09148061
申请日：1998-09-04
申请人： Jay DeAvis Baker , Edward McLeskey , Delin Li , Cuong Van Pham , Robert Edward Belke , Vivek Amir Jairazbhoy , Thomas B Krautheim , Mohan R. Paruchuri , Lakhi Nandlal Goenka , Jun Ming Hu
发明人： Jay DeAvis Baker , Edward McLeskey , Delin Li , Cuong Van Pham , Robert Edward Belke , Vivek Amir Jairazbhoy , Thomas B Krautheim , Mohan R. Paruchuri , Lakhi Nandlal Goenka , Jun Ming Hu
IPC分类号： H05K334
CPC分类号： H05K3/4685 , H05K1/111 , H05K3/062 , H05K3/303 , H05K3/328 , H05K3/3442 , H05K3/4007 , H05K2201/0361 , H05K2201/0367 , H05K2201/0373 , H05K2201/09781 , H05K2201/10636 , H05K2201/2036 , H05K2203/049 , Y02P70/611 , Y02P70/613 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49156
摘要： A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.
摘要翻译：从蚀刻的三金属层结构制造电子电路组件（例如，电路板）的方法，其提供空气桥交叉和从三金属层结构的中间层蚀刻的特殊设计的凸起。凸起形成在特定的电路位置，以提供用于（1）重引线键合，（2）细线接合或（3）直接芯片附接的互连。或者提供（4）用于确保最小焊点间隙高度的提升器，或（5）阻止焊点裂纹扩展的障碍物。

5. 发明授权

US06673723B2 Circuit board and a method for making the same 失效
标题翻译：电路板及其制作方法
公开(公告)号：US06673723B2
公开(公告)日：2004-01-06
申请号：US09815226
申请日：2001-03-22
申请人： Bharat Z. Patel , Jay D. Baker , Lakhi N. Goenka , Michael Allen Howey , Mohan R. Paruchuri , Richard Keith McMillan
发明人： Bharat Z. Patel , Jay D. Baker , Lakhi N. Goenka , Michael Allen Howey , Mohan R. Paruchuri , Richard Keith McMillan
IPC分类号： H01L21302
CPC分类号： H05K3/44 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4038 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0305 , H05K2201/0352 , H05K2201/0361 , H05K2201/0397 , H05K2201/09509 , H05K2201/09554 , H05K2201/09609 , H05K2201/09881 , H05K2203/0369 , H05K2203/0733 , H05K2203/1184
摘要： A method 10 for making a multi-layer circuit board 70 having at least one electrically conductive interconnection portion or “via” 72 which extends within the board 70 and at least one air-bridge 74. The method 10 includes the steps of forming protuberances 13 upon a core member 12, attaching pre-circuit assemblies 32, 34 to the core member 12, thereby forming the circuit board 70 while concomitantly and selectively extending at least one of the protuberances 13 within the formed circuit board 70.
摘要翻译：制造多层电路板70的方法10具有至少一个在板70内和至少一个空气桥74上延伸的导电互连部分或“通孔”72。方法10包括以下步骤：形成突起13 在芯构件12上，将预电路组件32,34附接到芯构件12，从而形成电路板70，同时并且选择性地延伸形成的电路板70内的至少一个突起13。

6. 发明授权

US5964395A Predeposited transient phase electronic interconnect media 失效
标题翻译：预沉积的瞬态电子互连介质
公开(公告)号：US5964395A
公开(公告)日：1999-10-12
申请号：US868846
申请日：1997-06-09
申请人： Andrew Z. Glovatsky , Mohan R. Paruchuri
发明人： Andrew Z. Glovatsky , Mohan R. Paruchuri
IPC分类号： B23K35/02 , B23K35/26 , C23C4/00 , C23C26/02 , H05K3/32 , H05K3/34 , B23K31/02 , B23K35/12
CPC分类号： H05K3/3463 , B23K35/0222 , C23C26/02 , C23C4/00 , H05K3/328 , B23K35/26 , H05K2201/0373 , H05K2203/0495
摘要： A method of attaching an electronic component to a substrate comprising the steps of depositing a spray metal coating atop a substrate. An electronic component is placed atop a coating. A liquid metal is dispensed on or near the component. The liquid metal wets the component and the coating. The metal is reacted with the coating to form an electrically conductive bond with the substrate and adheres the component to the substrate. The reactive metal may be heated to a temperature which makes it liquid and facilitates wetting the coating and component. Suitable materials for the spray metal coating include copper, nickel, tin, bismuth, lead and silver and mixtures thereof. Suitable liquid metals generally include low melting temperature metals such as gallium and indium and mixtures thereof.
摘要翻译：一种将电子部件附接到基板的方法，包括以下步骤：在基板顶上沉积喷涂金属涂层。将电子部件放置在涂层的顶部。液体金属被分配在部件上或附近。液体金属润湿组分和涂层。金属与涂层反应以与基底形成导电结合并将组分粘合到基底上。反应性金属可以被加热到使其成为液体并有助于润湿涂层和组分的温度。用于喷涂金属涂层的合适材料包括铜，镍，锡，铋，铅和银及其混合物。合适的液态金属通常包括低熔点金属如镓和铟及其混合物。

7. 发明授权

US06658731B1 Method for fabricating connectors for interconnecting etched tri-metal circuit structures 失效
标题翻译：制造用于互连蚀刻的三金属电路结构的连接器的方法
公开(公告)号：US06658731B1
公开(公告)日：2003-12-09
申请号：US09703554
申请日：2000-11-01
申请人： Lakhi Nandlal Goenka , Mohan R. Paruchuri , Thomas B Krautheim
发明人： Lakhi Nandlal Goenka , Mohan R. Paruchuri , Thomas B Krautheim
IPC分类号： H05K302
CPC分类号： H05K3/4007 , H05K3/062 , H05K3/363 , H05K2201/0361 , H05K2201/0367 , H05K2201/09745 , H05K2201/209 , H05K2203/0152 , H05K2203/0376 , H05K2203/1184 , Y10S439/943 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155
摘要： In conventional ETM circuit structures a pin connector in which the pin is etched from the ETM substrate and the mating cavity is etched from the ETM substrate to be mated. The connector utilizes the subtractive ETM structure processing to define any one of several pin-cavity configurations. The pin serves as an anchor with the metallurgical bonds with solder in the cavity that forms on the copper surfaces of the ETM circuit structure to give good mechanical strength to the connection. In particular four different configurations of interconnections are shown and described.
摘要翻译：在传统的ETM电路结构中，一个引脚连接器，其中从ETM基板蚀刻引脚，并且从ETM基板蚀刻配合腔以进行配合。连接器利用减法ETM结构处理来定义几个引脚腔配置中的任何一个。该引脚用作锚固件，其中在空腔中与焊料的冶金结合形成在ETM电路结构的铜表面上，以为连接提供良好的机械强度。特别地示出和描述了四种不同的互连配置。

8. 发明授权

US06475703B2 Method for constructing multilayer circuit boards having air bridges 失效
标题翻译：用于构造具有空气桥的多层电路板的方法
公开(公告)号：US06475703B2
公开(公告)日：2002-11-05
申请号：US09203148
申请日：1998-12-01
申请人： Delin Li , Achyuta Achari , Alice Dawn Zitzmann , Robert Edward Belke, Jr. , Brenda Joyce Nation , Edward McLeskey , Mohan R. Paruchuri , Lakhi Nandlal Goenka
发明人： Delin Li , Achyuta Achari , Alice Dawn Zitzmann , Robert Edward Belke, Jr. , Brenda Joyce Nation , Edward McLeskey , Mohan R. Paruchuri , Lakhi Nandlal Goenka
IPC分类号： G03C556
CPC分类号： H05K3/062 , H05K3/205 , H05K3/386 , H05K3/4685 , H05K2201/0361 , H05K2201/0394 , H05K2203/0369 , H05K2203/0376
摘要： A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.
摘要翻译：一种具有空气桥交叉结构的多层电路板及其制造方法，其特征在于，该电路包括专门设计的金属强化层，用于机械地和/或电气地加固电路。

9. 发明授权

US07111883B1 Pivotable and interchangeable console 有权
标题翻译：数据透视和互换控制台
公开(公告)号：US07111883B1
公开(公告)日：2006-09-26
申请号：US11352155
申请日：2006-02-10
申请人： Udit Patel , Sunil Palakodati , Mohan R. Paruchuri , Balaji Bharadwaj , Abha Tiwari
发明人： Udit Patel , Sunil Palakodati , Mohan R. Paruchuri , Balaji Bharadwaj , Abha Tiwari
IPC分类号： B60R7/04
CPC分类号： B60R11/00 , B60R7/04 , B60R11/02 , B60R2011/0007 , B60R2011/0085
摘要： A center console for a motor vehicle comprising a stationary housing mounted within the vehicle. The housing includes an open center defined between opposing ends and has a console body mounted within the open center of the housing. The console body is rotatable about a longitudinal axis running through the console body and is mounted such that an operator may remove the body from the frame. Also, at least two longitudinal side walls of the rotating body are visible within the open center and the console body may be rotated such that alternate side walls may be positioned in an uppermost position with respect to the center console. Thus, a user may exchange the console body for another and access multiple sides of the console body, regardless of which is in the uppermost position.
摘要翻译：一种用于机动车辆的中控台，其包括安装在车辆内的固定壳体。壳体包括限定在相对端之间的开放中心，并且具有安装在壳体的开放中心内的控制台主体。控制台主体可以围绕运行通过控制台主体的纵向轴线旋转，并且被安装成使得操作者可以将该主体从框架上移除。此外，旋转体的至少两个纵向侧壁在打开中心内是可见的，并且控制台主体可以旋转，使得交替的侧壁可以相对于中心控制台定位在最高位置。因此，用户可以将控制台主体更换为另一个并且访问控制台主体的多个侧面，而不管哪个处于最高位置。

10. 发明授权

US06274407B1 Method and article for attaching high-operating-temperature electronic component 失效
标题翻译：安装高温电子元器件的方法和制品
公开(公告)号：US06274407B1
公开(公告)日：2001-08-14
申请号：US09619546
申请日：2000-07-19
申请人： Jay DeAvis Baker , Mohan R. Paruchuri , Prathap Amerwai Reddy , Vivek Amir Jairazbhoy
发明人： Jay DeAvis Baker , Mohan R. Paruchuri , Prathap Amerwai Reddy , Vivek Amir Jairazbhoy
IPC分类号： H01L2144
CPC分类号： H01L24/83 , H01L23/3736 , H01L24/29 , H01L24/32 , H01L24/48 , H01L2224/05599 , H01L2224/26175 , H01L2224/27013 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/32057 , H01L2224/48091 , H01L2224/73265 , H01L2224/83051 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/83385 , H01L2224/83815 , H01L2224/83855 , H01L2224/8392 , H01L2224/83951 , H01L2224/85399 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/351 , H01L2924/00 , H01L2924/01048 , H01L2924/01083 , H01L2924/0132 , H01L2924/3512 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A method and article for attaching an electronic component, such as a semiconductor die, to a substrate includes applying a relatively low-melting-temperature solder preform to the substrate; and applying a bead of a curable bonding material to the substrate around the periphery of the solder preform in an amount sufficient to substantially contain the solder material and bridge the gap between the die and the substrate upon a subsequent collapse of the solder preform along its thickness dimension. After placing the die atop the solder preform so as to at least partially overlie the bonding material, the method includes heating the solder preform and the bonding material so as to reflow the solder, whereupon the solder preform collapses to allow the bonding material to engage the underside of the die, and to subsequently cure the bonding material.
摘要翻译：用于将诸如半导体管芯的电子部件附接到基板的方法和制品包括将相对低熔点的焊料预制件施加到基板上; 以及在足以基本上容纳焊料材料的量的基础上将可固化粘合材料的珠粒施加到围绕焊料预制件周围的基底上，并且随着焊料预成型件沿其厚度的随后的崩溃，桥接模具和衬底之间的间隙尺寸。在将模具放置在焊料预制件顶部以至少部分地覆盖接合材料之后，该方法包括加热焊料预成型件和接合材料以便回流焊料，于是焊料预制件塌陷以允许接合材料接合并且随后固化粘结材料。

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