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1. 发明申请

US20120182653A1 SEMICONDUCTOR MODULE AND SYSTEM INCLUDING THE SAME 审中-公开
标题翻译：半导体模块和系统，包括它们
公开(公告)号：US20120182653A1
公开(公告)日：2012-07-19
申请号：US13316020
申请日：2011-12-09
申请人： Joo-Han LEE , Young-Soo AN , Yong-Hyun KIM , Seong-Chan HAN
发明人： Joo-Han LEE , Young-Soo AN , Yong-Hyun KIM , Seong-Chan HAN
IPC分类号： H02H9/04
CPC分类号： H02H9/046 , H05K1/0259
摘要： A semiconductor module includes a printed circuit board, at least one on-board device unit coupled between at least one voltage line and a power line. The at least on-board device unit is mounted on the printed circuit board. At least one electrostatic discharge protection circuit unit, configured to protect the at least one on-board device unit from an electrostatic discharge that occurs in the at least one voltage line, is coupled to the at least one voltage line.
摘要翻译：半导体模块包括印刷电路板，耦合在至少一个电压线和电力线之间的至少一个板上器件单元。至少车载设备单元安装在印刷电路板上。至少一个静电放电保护电路单元被配置为保护至少一个板上器件单元免于在至少一个电压线中发生的静电放电，耦合到至少一个电压线。

2. 发明授权

US08139949B2 Electrical signal transmission module, method of transmitting electric signals and electrical inspection apparatus having the same 有权
标题翻译：电信号传输模块，发送电信号的方法和具有该信号的电气检查装置
公开(公告)号：US08139949B2
公开(公告)日：2012-03-20
申请号：US12179015
申请日：2008-07-24
申请人： Sang-Hoon Lee , Ho-Jeong Choi , Se-Jang Oh , Young-Soo An , Gyu-Yeol Kim
发明人： Sang-Hoon Lee , Ho-Jeong Choi , Se-Jang Oh , Young-Soo An , Gyu-Yeol Kim
IPC分类号： H04B10/12
CPC分类号： H04B10/2504 , G01R31/2889 , H04B10/801
摘要： An electrical signal transmission module includes a plurality of optical signal lines and a plurality of electrical signal lines. The plurality of optical signal lines converting a first externally input electrical signal into an optical signal, transmitting the optical signal, converting the optical signal back into the first electrical signal, and outputting the first electrical signal. The plurality of electrical signal lines transmitting a second externally input electrical signal and outputting the second electrical signal.
摘要翻译：电信号传输模块包括多个光信号线和多个电信号线。多个光信号线将第一外部输入的电信号转换为光信号，发送光信号，将光信号转换回第一电信号，并输出第一电信号。多个电信号线发送第二外部输入电信号并输出第二电信号。

3. 发明授权

US07659735B2 Probe card capable of multi-probing 有权
标题翻译：探头卡能够进行多次探测
公开(公告)号：US07659735B2
公开(公告)日：2010-02-09
申请号：US11646014
申请日：2006-12-27
申请人： Min-gu Kim , Ho-jeong Choi , Young-soo An
发明人： Min-gu Kim , Ho-jeong Choi , Young-soo An
IPC分类号： G01R31/02
CPC分类号： G01R31/2886 , G01R31/2889
摘要： A probe card capable of multi-probing includes a print circuit board having a plurality of contact portions and a test module having a plurality of test boards. Each of the test boards includes at least one probing portion on which a plurality of needles are arrayed. The test module selects one of the test boards and probes semiconductor chips formed on a semiconductor wafer through the needles arrayed on the probing portion of the selected test board.
摘要翻译：能够进行多次探测的探针卡包括具有多个接触部分的印刷电路板和具有多个测试板的测试模块。每个测试板包括至少一个探针部分，多个针排列在该探测部分上。测试模块通过布置在所选择的测试板的探测部分上的针来选择形成在半导体晶片上的测试板和探测半导体芯片之一。

4. 发明授权

US07538566B2 Electrical test system including coaxial cables 有权
标题翻译：电测试系统包括同轴电缆
公开(公告)号：US07538566B2
公开(公告)日：2009-05-26
申请号：US11926172
申请日：2007-10-29
申请人： Young-Soo An , Se-Jang Oh , Jung-Hyun Nam
发明人： Young-Soo An , Se-Jang Oh , Jung-Hyun Nam
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2889
摘要： An electrical test system includes a test head, a performance board, a probe card and coaxial cables. The performance board includes a first side and an opposite second side, where the first side of the performance board is electrically connected to the test head and the second side of the performance board includes first coaxial cable connection portions. The probe card includes a first side and an opposite second side, where the first side of the probe card includes second coaxial cable connection portions and the second side includes a wafer test probes. The coaxial cables respectively electrically connect the first coaxial cable connection portions of the performance board to the second coaxial cable connection portions of the probe card.
摘要翻译：电气测试系统包括测试头，演奏板，探针卡和同轴电缆。所述性能板包括第一侧和相对的第二侧，其中所述性能板的第一侧电连接到所述测试头，并且所述性能板的第二侧包括第一同轴电缆连接部分。探针卡包括第一侧和相对的第二侧，其中探针卡的第一侧包括第二同轴电缆连接部分，并且第二侧包括晶片测试探针。同轴电缆分别将性能板的第一同轴电缆连接部分电连接到探针卡的第二同轴电缆连接部分。

5. 发明申请

US20090028571A1 ELECTRICAL SIGNAL TRANSMISSION MODULE, METHOD OF TRANSMITTING ELECTRIC SIGNALS AND ELECTRICAL INSPECTION APPARATUS HAVING THE SAME 有权
标题翻译：电子信号传输模块，发送电信号的方法和具有该信号的电子检测装置
公开(公告)号：US20090028571A1
公开(公告)日：2009-01-29
申请号：US12179015
申请日：2008-07-24
申请人： Sang-Hoon Lee , Ho-Jeong Choi , Se-Jang Oh , Young-Soo An , Gyu-Yeol Kim
发明人： Sang-Hoon Lee , Ho-Jeong Choi , Se-Jang Oh , Young-Soo An , Gyu-Yeol Kim
IPC分类号： H04B10/00
CPC分类号： H04B10/2504 , G01R31/2889 , H04B10/801
摘要： An electrical signal transmission module includes a plurality of optical signal lines and a plurality of electrical signal lines. The plurality of optical signal lines converting a first externally input electrical signal into an optical signal, transmitting the optical signal, converting the optical signal back into the first electrical signal, and outputting the first electrical signal. The plurality of electrical signal lines transmitting a second externally input electrical signal and outputting the second electrical signal.
摘要翻译：电信号传输模块包括多个光信号线和多个电信号线。多个光信号线将第一外部输入的电信号转换为光信号，发送光信号，将光信号转换回第一电信号，并输出第一电信号。多个电信号线发送第二外部输入电信号并输出第二电信号。

6. 发明申请

US20080164898A1 Probe card for test of semiconductor chips and method for test of semiconductor chips using the same 审中-公开
标题翻译：用于半导体芯片测试的探针卡和使用其的半导体芯片的测试方法
公开(公告)号：US20080164898A1
公开(公告)日：2008-07-10
申请号：US12005888
申请日：2007-12-28
申请人： Sung-Hoon Bae , Jung-Hyeon Kim , Young-Soo An , Ho-Jeong Choi , Myoung-Sub Kim
发明人： Sung-Hoon Bae , Jung-Hyeon Kim , Young-Soo An , Ho-Jeong Choi , Myoung-Sub Kim
IPC分类号： G01R31/02
CPC分类号： G01R1/07385 , G01R1/07342
摘要： There are provided a probe card for test of semiconductor chips and a method for testing semiconductor chips using the probe card. In implementing the probe card for electrically testing semiconductor chips, the probe blocks corresponding to multiple selected ones of the semiconductor chips on the wafer can be selected so that the selected semiconductor chips are EDS tested in a one-step process. As the selected semiconductor chips are EDS tested in a one-step process, equipment efficiency is improved, and statistical objectivity of data indicating characteristics of the wafer can be achieved.
摘要翻译：提供了用于半导体芯片测试的探针卡和使用探针卡测试半导体芯片的方法。在实现用于电测试半导体芯片的探针卡时，可以选择对应于晶片上的多个选定的半导体芯片的探针块，使得所选择的半导体芯片在一步法中进行EDS测试。由于所选择的半导体芯片在一步法中进行了EDS测试，所以提高了设备效率，并且可以实现表示晶片特性的数据的统计客观性。

7. 发明授权

US08026733B2 Interface structure of wafer test equipment 有权
标题翻译：晶圆测试设备的接口结构
公开(公告)号：US08026733B2
公开(公告)日：2011-09-27
申请号：US12455445
申请日：2009-06-02
申请人： Sang-hoon Lee , Chang-woo Ko , Young-soo An , Se-jang Oh
发明人： Sang-hoon Lee , Chang-woo Ko , Young-soo An , Se-jang Oh
IPC分类号： G01R31/20
CPC分类号： G01R31/2889 , G01R1/07378
摘要： A wafer test equipment system includes a performance board connected to a tester head of a tester. A universal block printed circuit board is positioned on the performance board, directly connecting a plurality of normal signal lines to a probe card and dividing each of a plurality of power signal lines into multiple paths and connecting them to the probe card. A cable assembly transfers the normal signal lines and the power signal lines between the universal block printed circuit board and the tester head. The cable assembly is soldered directly to the universal block printed circuit board in a perpendicular direction through a center portion of the performance board. A probe card is removably secured to the performance board including the universal block printed circuit board. The probe card includes an interposer on an upper surface thereof, a ceramic multi-layer substrate positioned below the interposer, and a plurality of needles positioned below the ceramic multi-layer substrate on a lower surface thereof opposite the upper surface.
摘要翻译：晶片测试设备系统包括连接到测试仪测试头的性能板。通用块印刷电路板位于性能板上，将多条正常信号线直接连接到探针卡，并将多条电源信号线分成多个路径并将其连接到探针卡。电缆组件将通用块印刷电路板和测试仪头之间的正常信号线和功率信号线传送。电缆组件通过执行板的中心部分沿垂直方向直接焊接到通用块印刷电路板。探针卡可移除地固定到包括通用块印刷电路板的性能板上。探针卡在其上表面包括插入件，位于插入件下方的陶瓷多层基板和位于陶瓷多层基板的下方与表面相反的多个针。

8. 发明申请

US20100118615A1 Semiconductor memory device 有权
标题翻译：半导体存储器件
公开(公告)号：US20100118615A1
公开(公告)日：2010-05-13
申请号：US12590417
申请日：2009-11-06
申请人： Jong-Hak Won , Young-Soo An , Jung-Hyeon Kim
发明人： Jong-Hak Won , Young-Soo An , Jung-Hyeon Kim
IPC分类号： G11C7/12 , G11C7/10
CPC分类号： G11C7/08 , G11C5/025 , G11C7/1012 , G11C7/12 , G11C2207/002
摘要： A semiconductor memory device includes a sub memory cell array region having memory cells each connected between word lines extending in a first direction and bit lines extending in a second direction that is orthogonal to the first direction of extension of the word lines and a sub word line driver region disposed at a side of the sub memory cell array region in the first direction and including sub word line drivers that activate the word lines. A sensing region is disposed at a side of the sub memory cell array region in the second direction and including an equalizer that precharges the bit line in response to a signal transferred through a drive signal line and at least one first control signal driver that activates an inverted control signal line in response to a signal transferred through a control signal line. A conjunction region disposed at an intersection between the sub word line driver region and the sensing region, in which the inverted control signal line is connected to the drive signal line.
摘要翻译：半导体存储器件包括具有存储单元的子存储单元阵列区域，每个存储单元分别连接在沿第一方向延伸的字线和沿着与字线的第一延伸方向正交的第二方向延伸的位线和一个子字线驱动器区域，设置在副存储单元阵列区域的第一方向的一侧，并且包括激活字线的子字线驱动器。感测区域设置在副存储单元阵列区域的第二方向的一侧，并且包括响应于通过驱动信号线传送的信号而对位线进行预充电的均衡器，以及至少一个第一控制信号驱动器，其激活响应于通过控制信号线传送的信号的反相控制信号线。配置在副字线驱动器区域和感测区域之间的交叉点处的连接区域，其中反相控制信号线连接到驱动信号线。

9. 发明申请

US20100025682A1 Interface device for wireless testing, semiconductor device and semiconductor package including the same, and method for wirelessly testing using the same 审中-公开
标题翻译：用于无线测试的接口设备，包括其的半导体器件和半导体封装以及使用其的无线测试的方法
公开(公告)号：US20100025682A1
公开(公告)日：2010-02-04
申请号：US12462373
申请日：2009-08-03
申请人： Sang-Hoon Lee , Eun-Jo Byun , Se-Jang Oh , Young-Soo An , Chang-Hyun Cho
发明人： Sang-Hoon Lee , Eun-Jo Byun , Se-Jang Oh , Young-Soo An , Chang-Hyun Cho
IPC分类号： H01L21/66 , H01L23/00
CPC分类号： G01R31/2889 , G01R31/3025 , G01R31/303 , H01L2224/48472 , H01L2924/3011 , H01L2924/00
摘要： In an interface device for wireless testing capable of testing a semiconductor chip in a non-contact manner, a semiconductor device and a semiconductor package including the same, and a method for wirelessly testing a semiconductor device using the same are provided, the interface device for wireless testing includes an interface substrate, interface antennas on the interface substrate, and interface transmitting and receiving circuits on the interface substrate, wherein the interface transmitting and receiving circuits are electrically connected to input/output pads of a semiconductor chip via interface vias passing through the interface substrate.
摘要翻译：在能够以非接触方式测试半导体芯片的无线测试用接口装置中，提供一种半导体器件和包括该半导体器件的半导体封装以及使用其的半导体器件的无线测试方法，无线测试包括接口基板，接口基板上的接口天线和接口基板上的接口发射和接收电路，其中接口发射和接收电路通过经过接口基板的接口通孔电连接到半导体芯片的输入/输出焊盘界面基板。

10. 发明申请

US20090189624A1 Interposer and a probe card assembly for electrical die sorting and methods of operating and manufacturing the same 审中-公开
标题翻译：内插器和用于电气模具排列的探针卡组件及其操作和制造方法
公开(公告)号：US20090189624A1
公开(公告)日：2009-07-30
申请号：US12232963
申请日：2008-09-26
申请人： Se-Jang Oh , Hal-young Lee , Young-soo An , Sang-hoon Lee , Sung-ho Joo , Dong-yeop Kim
发明人： Se-Jang Oh , Hal-young Lee , Young-soo An , Sang-hoon Lee , Sung-ho Joo , Dong-yeop Kim
IPC分类号： G01R31/02 , H01R12/00
CPC分类号： G01R1/07378 , H01R12/714 , H01R13/2407
摘要： An interposer and a probe card assembly for electrical die sorting is provided. The assembly may include probes electrically contacting pads of dies on a substrate, a first wiring unit including a first wire on and electrically contacting the probes, an interposer unit including interposers on the first wiring unit and electrically contacting the first wire, and a second wiring unit including a second wire on the interposer unit and electrically contacting the interposers. At least one interposer includes a conductive member, a first connection member adjacent to a first end of the conductive member so as to electrically connect the conductive member to the first wire, a second connection member adjacent to a second end of the conductive member so as to electrically connect the conductive member to the second wire, and at least one protrusion member on an external surface of the conductive member between the first and second connection members.
摘要翻译：提供了用于电气模具分选的插入件和探针卡组件。组件可以包括电接触衬底上的管芯焊盘的探针，第一布线单元，其包括在第一布线单元上并与第一布线电接触的插入件和与第一布线电接触的插入件，单元，其包括在所述插入单元上的第二导线，并与所述插入件电接触。至少一个插入器包括导电构件，与导电构件的第一端相邻的第一连接构件，以便将导电构件电连接到第一线，与导电构件的第二端相邻的第二连接构件，以便将导电构件电连接到第二线，以及在第一和第二连接构件之间的导电构件的外表面上的至少一个突出构件。

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