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1. 发明授权

US07659735B2 Probe card capable of multi-probing 有权
标题翻译：探头卡能够进行多次探测
公开(公告)号：US07659735B2
公开(公告)日：2010-02-09
申请号：US11646014
申请日：2006-12-27
申请人： Min-gu Kim , Ho-jeong Choi , Young-soo An
发明人： Min-gu Kim , Ho-jeong Choi , Young-soo An
IPC分类号： G01R31/02
CPC分类号： G01R31/2886 , G01R31/2889
摘要： A probe card capable of multi-probing includes a print circuit board having a plurality of contact portions and a test module having a plurality of test boards. Each of the test boards includes at least one probing portion on which a plurality of needles are arrayed. The test module selects one of the test boards and probes semiconductor chips formed on a semiconductor wafer through the needles arrayed on the probing portion of the selected test board.
摘要翻译：能够进行多次探测的探针卡包括具有多个接触部分的印刷电路板和具有多个测试板的测试模块。每个测试板包括至少一个探针部分，多个针排列在该探测部分上。测试模块通过布置在所选择的测试板的探测部分上的针来选择形成在半导体晶片上的测试板和探测半导体芯片之一。

2. 发明申请

US20100176796A1 Apparatus for testing electrical characteristics 审中-公开
标题翻译：用于测试电气特性的装置
公开(公告)号：US20100176796A1
公开(公告)日：2010-07-15
申请号：US12654955
申请日：2010-01-11
申请人： Dong-dae Kim , Min-gu Kim , Ho-jeong Choi , Young-soo An , Yang-gi Kim
发明人： Dong-dae Kim , Min-gu Kim , Ho-jeong Choi , Young-soo An , Yang-gi Kim
IPC分类号： G01R1/06
CPC分类号： G01R1/06772
摘要： An apparatus for testing electrical characteristics includes a probe configured to contact a test object, a DC signal transmission line configured to transmit a DC signal to the probe, a frequency signal transmission line configured to transmit a frequency signal to the probe, and a line selection unit configured to selectively connect only one of the frequency signal transmission line and the DC signal transmission line to the probe at a time in accordance with a selected test.
摘要翻译：一种用于测试电气特性的装置包括被配置为接触测试对象的探针，被配置为向探测器发送DC信号的DC信号传输线，被配置为向探头发送频率信号的频率信号传输线，以及线选择单元，被配置为根据所选择的测试一次选择性地将频率信号传输线和DC信号传输线中的一个连接到探针。

3. 发明申请

US20070152688A1 Probe card capable of multi-probing 有权
标题翻译：探头卡能够进行多次探测
公开(公告)号：US20070152688A1
公开(公告)日：2007-07-05
申请号：US11646014
申请日：2006-12-27
申请人： Min-gu Kim , Ho-jeong Choi , Young-soo An
发明人： Min-gu Kim , Ho-jeong Choi , Young-soo An
IPC分类号： G01R31/02
CPC分类号： G01R31/2886 , G01R31/2889
摘要： A probe card capable of multi-probing includes a print circuit board having a plurality of contact portions and a test module having a plurality of test boards. Each of the test boards includes at least one probing portion on which a plurality of needles are arrayed. The test module selects one of the test boards and probes semiconductor chips formed on a semiconductor wafer through the needles arrayed on the probing portion of the selected test board.
摘要翻译：能够进行多次探测的探针卡包括具有多个接触部分的印刷电路板和具有多个测试板的测试模块。每个测试板包括至少一个探针部分，多个针排列在该探测部分上。测试模块通过布置在所选择的测试板的探测部分上的针来选择形成在半导体晶片上的测试板和探测半导体芯片之一。

4. 发明授权

US06396294B2 Socket pin and socket for electrical testing of semiconductor packages 失效
标题翻译：用于半导体封装电气测试的插座针和插座
公开(公告)号：US06396294B2
公开(公告)日：2002-05-28
申请号：US09430997
申请日：1999-11-01
申请人： Young-soo An , Young-moon Lee , Jae-il Lee , Hyo-geun Chae
发明人： Young-soo An , Young-moon Lee , Jae-il Lee , Hyo-geun Chae
IPC分类号： G01R104
CPC分类号： G01R1/0466
摘要： A socket pin and a socket for electrical testing of a semiconductor package suppress electrical open/short defects due to contact failure and reduce manufacturing costs. The socket pin includes: an upper portion that connects to a lead of the semiconductor package, for exchanging a signal between the semiconductor package and a tester; a body connected to the upper portion, for buffering at two points, a downward force applied by the lead of the semiconductor package to the upper portion; a lower portion connected to the body of the socket pin, the lower portion being elastically durable to the force from the upper portion and the body; and a lower socket pin connected to the lower portion, which acts as a path for transmitting or receiving an electrical signal.
摘要翻译：用于半导体封装的电气测试的插座销和插座抑制由于接触故障引起的电开路/短路缺陷并降低制造成本。插座销包括：连接到半导体封装的引线的上部，用于在半导体封装和测试器之间交换信号; 连接到上部的主体，用于在两个点处缓冲由半导体封装的引线施加到上部的向下的力; 连接到所述插座销的主体的下部，所述下部弹性地抵抗来自所述上部和所述主体的力; 以及连接到下部的下插座销，其作为用于发送或接收电信号的路径。

5. 发明申请

US20100117673A1 Interface structure of wafer test equipment 有权
标题翻译：晶圆测试设备的接口结构
公开(公告)号：US20100117673A1
公开(公告)日：2010-05-13
申请号：US12455445
申请日：2009-06-02
申请人： Sang-hoon Lee , Chang-woo Ko , Young-soo An , Se-jang Oh
发明人： Sang-hoon Lee , Chang-woo Ko , Young-soo An , Se-jang Oh
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R1/07378
摘要： A wafer test equipment system includes a performance board connected to a tester head of a tester. A universal block printed circuit board is positioned on the performance board, directly connecting a plurality of normal signal lines to a probe card and dividing each of a plurality of power signal lines into multiple paths and connecting them to the probe card. A cable assembly transfers the normal signal lines and the power signal lines between the universal block printed circuit board and the tester head. The cable assembly is soldered directly to the universal block printed circuit board in a perpendicular direction through a center portion of the performance board. A probe card is removably secured to the performance board including the universal block printed circuit board. The probe card includes an interposer on an upper surface thereof, a ceramic multi-layer substrate positioned below the interposer, and a plurality of needles positioned below the ceramic multi-layer substrate on a lower surface thereof opposite the upper surface.
摘要翻译：晶片测试设备系统包括连接到测试仪测试头的性能板。通用块印刷电路板位于性能板上，将多条正常信号线直接连接到探针卡，并将多条电源信号线分成多个路径并将其连接到探针卡。电缆组件将通用块印刷电路板和测试仪头之间的正常信号线和功率信号线传送。电缆组件通过执行板的中心部分沿垂直方向直接焊接到通用块印刷电路板。探针卡可移除地固定到包括通用块印刷电路板的性能板上。探针卡在其上表面包括插入件，位于插入件下方的陶瓷多层基板和位于陶瓷多层基板的下方与表面相反的多个针。

6. 发明授权

US08026733B2 Interface structure of wafer test equipment 有权
标题翻译：晶圆测试设备的接口结构
公开(公告)号：US08026733B2
公开(公告)日：2011-09-27
申请号：US12455445
申请日：2009-06-02
申请人： Sang-hoon Lee , Chang-woo Ko , Young-soo An , Se-jang Oh
发明人： Sang-hoon Lee , Chang-woo Ko , Young-soo An , Se-jang Oh
IPC分类号： G01R31/20
CPC分类号： G01R31/2889 , G01R1/07378
摘要： A wafer test equipment system includes a performance board connected to a tester head of a tester. A universal block printed circuit board is positioned on the performance board, directly connecting a plurality of normal signal lines to a probe card and dividing each of a plurality of power signal lines into multiple paths and connecting them to the probe card. A cable assembly transfers the normal signal lines and the power signal lines between the universal block printed circuit board and the tester head. The cable assembly is soldered directly to the universal block printed circuit board in a perpendicular direction through a center portion of the performance board. A probe card is removably secured to the performance board including the universal block printed circuit board. The probe card includes an interposer on an upper surface thereof, a ceramic multi-layer substrate positioned below the interposer, and a plurality of needles positioned below the ceramic multi-layer substrate on a lower surface thereof opposite the upper surface.
摘要翻译：晶片测试设备系统包括连接到测试仪测试头的性能板。通用块印刷电路板位于性能板上，将多条正常信号线直接连接到探针卡，并将多条电源信号线分成多个路径并将其连接到探针卡。电缆组件将通用块印刷电路板和测试仪头之间的正常信号线和功率信号线传送。电缆组件通过执行板的中心部分沿垂直方向直接焊接到通用块印刷电路板。探针卡可移除地固定到包括通用块印刷电路板的性能板上。探针卡在其上表面包括插入件，位于插入件下方的陶瓷多层基板和位于陶瓷多层基板的下方与表面相反的多个针。

7. 发明申请

US20090189624A1 Interposer and a probe card assembly for electrical die sorting and methods of operating and manufacturing the same 审中-公开
标题翻译：内插器和用于电气模具排列的探针卡组件及其操作和制造方法
公开(公告)号：US20090189624A1
公开(公告)日：2009-07-30
申请号：US12232963
申请日：2008-09-26
申请人： Se-Jang Oh , Hal-young Lee , Young-soo An , Sang-hoon Lee , Sung-ho Joo , Dong-yeop Kim
发明人： Se-Jang Oh , Hal-young Lee , Young-soo An , Sang-hoon Lee , Sung-ho Joo , Dong-yeop Kim
IPC分类号： G01R31/02 , H01R12/00
CPC分类号： G01R1/07378 , H01R12/714 , H01R13/2407
摘要： An interposer and a probe card assembly for electrical die sorting is provided. The assembly may include probes electrically contacting pads of dies on a substrate, a first wiring unit including a first wire on and electrically contacting the probes, an interposer unit including interposers on the first wiring unit and electrically contacting the first wire, and a second wiring unit including a second wire on the interposer unit and electrically contacting the interposers. At least one interposer includes a conductive member, a first connection member adjacent to a first end of the conductive member so as to electrically connect the conductive member to the first wire, a second connection member adjacent to a second end of the conductive member so as to electrically connect the conductive member to the second wire, and at least one protrusion member on an external surface of the conductive member between the first and second connection members.
摘要翻译：提供了用于电气模具分选的插入件和探针卡组件。组件可以包括电接触衬底上的管芯焊盘的探针，第一布线单元，其包括在第一布线单元上并与第一布线电接触的插入件和与第一布线电接触的插入件，单元，其包括在所述插入单元上的第二导线，并与所述插入件电接触。至少一个插入器包括导电构件，与导电构件的第一端相邻的第一连接构件，以便将导电构件电连接到第一线，与导电构件的第二端相邻的第二连接构件，以便将导电构件电连接到第二线，以及在第一和第二连接构件之间的导电构件的外表面上的至少一个突出构件。

8. 发明授权

US06489790B1 Socket including pressure conductive rubber and mesh for testing of ball grid array package 有权
标题翻译：插座包括压力导电橡胶和网格用于球栅阵列封装的测试
公开(公告)号：US06489790B1
公开(公告)日：2002-12-03
申请号：US09519720
申请日：2000-03-07
申请人： Young-soo An , Jae-Il Lee , Hyo-geun Chae , Jeong-ho Bang
发明人： Young-soo An , Jae-Il Lee , Hyo-geun Chae , Jeong-ho Bang
IPC分类号： G01R3102
CPC分类号： G01R1/073 , G01R1/0483
摘要： A socket for testing a BGA package capable of avoiding problems like deformation of external terminals of the BGA package or failing to detect a defective BGA package and a test method using the socket are provided. The socket for testing a BGA package connects solder balls (or solder bumps) as external terminals of the BGA package via a mesh, a pressure conductive rubber (PCR) as a middle connection unit, and a channel connection means of a socket board. A plane board having POGO pins or a printed circuit pattern can be used for the channel connection means.
摘要翻译：提供一种用于测试BGA封装的插座，其能够避免诸如BGA封装的外部端子的变形或不能检测到有缺陷的BGA封装的问题以及使用插座的测试方法。用于测试BGA封装的插座通过网格，作为中间连接单元的压力导电橡胶（PCR）和插座板的通道连接装置将焊球（或焊料凸块）作为BGA封装的外部端子连接。具有POGO引脚或印刷电路图案的平板可用于通道连接装置。

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