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1. 发明申请

US20120182653A1 SEMICONDUCTOR MODULE AND SYSTEM INCLUDING THE SAME 审中-公开
标题翻译：半导体模块和系统，包括它们
公开(公告)号：US20120182653A1
公开(公告)日：2012-07-19
申请号：US13316020
申请日：2011-12-09
申请人： Joo-Han LEE , Young-Soo AN , Yong-Hyun KIM , Seong-Chan HAN
发明人： Joo-Han LEE , Young-Soo AN , Yong-Hyun KIM , Seong-Chan HAN
IPC分类号： H02H9/04
CPC分类号： H02H9/046 , H05K1/0259
摘要： A semiconductor module includes a printed circuit board, at least one on-board device unit coupled between at least one voltage line and a power line. The at least on-board device unit is mounted on the printed circuit board. At least one electrostatic discharge protection circuit unit, configured to protect the at least one on-board device unit from an electrostatic discharge that occurs in the at least one voltage line, is coupled to the at least one voltage line.
摘要翻译：半导体模块包括印刷电路板，耦合在至少一个电压线和电力线之间的至少一个板上器件单元。至少车载设备单元安装在印刷电路板上。至少一个静电放电保护电路单元被配置为保护至少一个板上器件单元免于在至少一个电压线中发生的静电放电，耦合到至少一个电压线。

2. 发明申请

US20100015362A1 METHOD OF ELECTROLESS PLATING 审中-公开
标题翻译：电镀镀层的方法
公开(公告)号：US20100015362A1
公开(公告)日：2010-01-21
申请号：US12505560
申请日：2009-07-20
申请人： Joo-Han LEE , Dong-Chun LEE , Yong-Hyun KIM , Seong-Chan Han
发明人： Joo-Han LEE , Dong-Chun LEE , Yong-Hyun KIM , Seong-Chan Han
IPC分类号： B05D1/18
CPC分类号： H05K3/244 , C23C18/1673 , C23C18/32 , C23C18/42 , H05K2203/072 , H05K2203/104
摘要： An apparatus for electroless plating includes a plating bath containing an aqueous metal salt solution, and a magnetic field generator for generating a magnetic field. An object to be plated is immersed in the solution. The magnetic field generated by the magnetic field generator increases the level at which the metal ions are attracted to a surface of the object. Therefore, a layer of plating of good quality may be formed at a rapid rate.
摘要翻译：无电镀装置包括含有金属盐水溶液的电镀液和用于产生磁场的磁场发生器。将待镀物体浸入溶液中。由磁场发生器产生的磁场增加金属离子被吸引到物体表面的水平。因此，可以以快速的速度形成质量好的电镀层。

3. 发明申请

US20080106876A1 SEMICONDUCTOR MEMORY MODULE WITH REVERSE MOUNTED CHIP RESISTOR 有权
标题翻译：具有反向安装芯片电阻的半导体存储器模块
公开(公告)号：US20080106876A1
公开(公告)日：2008-05-08
申请号：US11934616
申请日：2007-11-02
申请人： Hyun-Seok CHOI , Hyung-Mo HWANG , Yong-Hyun KIM , Hyo-Jae BANG , Su-Yong AN
发明人： Hyun-Seok CHOI , Hyung-Mo HWANG , Yong-Hyun KIM , Hyo-Jae BANG , Su-Yong AN
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K3/3442 , H05K1/111 , H05K1/181 , H05K3/06 , H05K3/244 , H05K2201/09736 , H05K2201/10477 , H05K2201/10636 , H05K2203/0369 , Y02P70/611 , Y02P70/613 , Y10T29/49133
摘要： A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection pad of a module substrate is formed to extend higher from the module substrate than other connection pads connected to other elements. Thus, the resistive material of the chip resistor does not contact the module substrate, thereby preventing poor alignment and defective connections.
摘要翻译：提供了具有反向安装的芯片电阻器的半导体存储器模块及其制造方法。通过将芯片电阻器反向安装在半导体存储器模块上，电阻材料被保护，从而防止由电阻材料损坏引起的开路。此外，模块基板的芯片电阻器连接焊盘形成为从与其它元件连接的其它连接焊盘相比，从模块基板延伸得更高。因此，片式电阻器的电阻材料不与模块基板接触，从而防止对准不良和连接不良。

4. 发明申请

US20080186685A1 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MEMORY MODULE USING THE SAME 审中-公开
标题翻译：印刷电路板和使用相同的半导体存储器模块
公开(公告)号：US20080186685A1
公开(公告)日：2008-08-07
申请号：US12013245
申请日：2008-01-11
申请人： Jung-Chan CHO , Hyun-Seok CHOI , Yong-Hyun KIM , Hyung-Mo HWANG , Kyu-Tae KIM
发明人： Jung-Chan CHO , Hyun-Seok CHOI , Yong-Hyun KIM , Hyung-Mo HWANG , Kyu-Tae KIM
IPC分类号： H05K1/14 , H05K1/02 , H05K7/20
CPC分类号： H05K1/0207 , H05K1/056 , H05K3/4641 , H05K2201/0919 , H05K2201/10159 , H05K2201/1056 , H05K2203/1572
摘要： The invention provides a semiconductor memory module. The semiconductor memory module includes a printed circuit board part having a first surface and a second surface facing the first surface, and a metal core having an insert part inserted inside the printed circuit board part and an extension part elongated from at least one side of the printed circuit board. The semiconductor memory module also includes memory parts mounted on the printed circuit board. The metal core has a folding structure having at least one bent portion to substantially cover the memory parts.
摘要翻译：本发明提供一种半导体存储器模块。半导体存储器模块包括印刷电路板部分，其具有第一表面和面向第一表面的第二表面，以及金属芯，其具有插入在印刷电路板部分内部的插入部分和从第一表面的至少一侧伸长的延伸部分印刷电路板。半导体存储器模块还包括安装在印刷电路板上的存储器部件。金属芯具有折叠结构，其具有至少一个弯曲部分，以基本上覆盖存储部件。

5. 发明申请

US20110258165A1 AUTOMATIC VERIFICATION SYSTEM FOR COMPUTER VIRUS VACCINE DATABASE AND METHOD THEREOF 审中-公开
标题翻译：用于计算机病毒疫苗数据库的自动验证系统及其方法
公开(公告)号：US20110258165A1
公开(公告)日：2011-10-20
申请号：US13004498
申请日：2011-01-11
申请人： Sang-Won JUNG , Jun-Seob KIM , Yong-Hyun KIM
发明人： Sang-Won JUNG , Jun-Seob KIM , Yong-Hyun KIM
IPC分类号： G06F17/30
CPC分类号： G06F21/568
摘要： The present invention relates to a method and system for automatically verifying a computer vaccine database and, more particularly, to a method and system for automatically verifying a computer vaccine database, which is capable of automatically verifying and modifying a vaccine database mounted on a vaccine engine so that a normal program is not recognized as viruses or malicious codes by storing information about the normal program in the vaccine database in order to remove computer viruses or malicious codes. According to the present invention, a file set of the latest vaccine database can be rapidly collected and processed, and the problems of a vaccine database file provided by a vendor can be checked in advance. Accordingly, there are advantages in that a function of alarming error conditions and a process of reporting error in a vaccine database update process can be automated.
摘要翻译：本发明涉及一种用于自动验证计算机疫苗数据库的方法和系统，更具体地，涉及一种用于自动验证计算机疫苗数据库的方法和系统，其能够自动验证和修改安装在疫苗引擎上的疫苗数据库以便通过在疫苗数据库中存储有关正常程序的信息来清除计算机病毒或恶意代码，从而不会将正常程序识别为病毒或恶意代码。根据本发明，可以快速收集和处理最新疫苗数据库的文件集，并且可以提前检查供应商提供的疫苗数据库文件的问题。因此，具有以下优点：疫苗数据库更新处理中的报警错误状况和报告错误处理的功能可以自动化。

6. 发明申请

US20080074848A1 HEAT SINK AND MEMORY MODULE USING THE SAME 有权
标题翻译：使用相同的散热和记忆模块
公开(公告)号：US20080074848A1
公开(公告)日：2008-03-27
申请号：US11859564
申请日：2007-09-21
申请人： Chang-Yong PARK , Yong-Hyun KIM , Kwang-Ho CHUN , Hyun-Jong OH
发明人： Chang-Yong PARK , Yong-Hyun KIM , Kwang-Ho CHUN , Hyun-Jong OH
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.
摘要翻译：提供了散热器和使用散热器的存储器模块。在一个实施例中，散热器包括分别设置在围绕待冷却物体放置的第一和第二散热器中的第一和第二引导销。第一和第二引导销有助于防止在第一和第二散热器之间发生不对准问题，以及当第一和第二散热器受到来自第一和第二散热器的压力施加压力时，有助于防止第一和第二散热器彼此接触外。

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