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    • 4. 发明授权
    • Model import for electronic design automation
    • 电子设计自动化模型导入
    • US07954072B2
    • 2011-05-31
    • US11748604
    • 2007-05-15
    • Ru-Gun LiuChih-Ming LaiWen-Chun HuangBoren LuoI-Chang ShinYao-Ching KuCliff Hou
    • Ru-Gun LiuChih-Ming LaiWen-Chun HuangBoren LuoI-Chang ShinYao-Ching KuCliff Hou
    • G06F17/50
    • G06F17/50
    • Methods and systems for providing processing parameters in a secure format are disclosed. In one aspect, a method for providing semiconductor fabrication processing parameters to a design facility is disclosed. The method comprises providing a set of processing parameters of a fabrication facility; creating a model from the set of processing parameters; converting the model into a corresponding set of kernels; converting the set of kernels into a corresponding set of matrices; and communicating the set of matrices to the design facility. In another aspect, a method for providing semiconductor fabrication processing parameters is disclosed. The method comprises providing a set of processing parameters of a fabrication facility; creating a processing model from the set of processing parameters; encrypting the processing model into a format for use with a plurality of EDA tools; and communicating the encrypted processing model format to a design facility.
    • 公开了以安全格式提供处理参数的方法和系统。 一方面,公开了一种向设计设备提供半导体制造处理参数的方法。 该方法包括提供制造设施的一组处理参数; 从一组处理参数创建模型; 将模型转换为相应的一组内核; 将所述内核集合转换成相应的矩阵集合; 并将该组矩阵传送到设计设施。 另一方面,公开了一种用于提供半导体制造处理参数的方法。 该方法包括提供制造设施的一组处理参数; 从一组处理参数创建一个处理模型; 将处理模型加密成与多个EDA工具一起使用的格式; 并将加密的处理模型格式传送到设计设施。
    • 8. 发明申请
    • Model Import for Electronic Design Automation
    • 电子设计自动化模型导入
    • US20070265725A1
    • 2007-11-15
    • US11748604
    • 2007-05-15
    • Ru-Gun LiuChih-Ming LaiWen-Chun HuangBoren LuoI-Chang ShinYao-Ching KuCliff Hou
    • Ru-Gun LiuChih-Ming LaiWen-Chun HuangBoren LuoI-Chang ShinYao-Ching KuCliff Hou
    • G06F19/00
    • G06F17/50
    • Methods and systems for providing processing parameters in a secure format are disclosed. In one aspect, a method for providing semiconductor fabrication processing parameters to a design facility is disclosed. The method comprises providing a set of processing parameters of a fabrication facility; creating a model from the set of processing parameters; converting the model into a corresponding set of kernels; converting the set of kernels into a corresponding set of matrices; and communicating the set of matrices to the design facility. In another aspect, a method for providing semiconductor fabrication processing parameters is disclosed. The method comprises providing a set of processing parameters of a fabrication facility; creating a processing model from the set of processing parameters; encrypting the processing model into a format for use with a plurality of EDA tools; and communicating the encrypted processing model format to a design facility.
    • 公开了以安全格式提供处理参数的方法和系统。 一方面,公开了一种向设计设备提供半导体制造处理参数的方法。 该方法包括提供制造设施的一组处理参数; 从一组处理参数创建模型; 将模型转换为相应的一组内核; 将所述内核集合转换成相应的矩阵集合; 并将该组矩阵传送到设计设施。 另一方面,公开了一种用于提供半导体制造处理参数的方法。 该方法包括提供制造设施的一组处理参数; 从一组处理参数创建一个处理模型; 将处理模型加密成与多个EDA工具一起使用的格式; 并将加密的处理模型格式传送到设计设施。
    • 10. 发明授权
    • Method for automatically forming a phase shifting mask
    • 自动形成相移掩模的方法
    • US06013397A
    • 2000-01-11
    • US186127
    • 1998-11-04
    • Chin-Lung LinYao-Ching Ku
    • Chin-Lung LinYao-Ching Ku
    • G03F1/26G03F1/36G03F9/00
    • G03F1/26G03F1/36
    • A method for automatically forming a sub-resolution PSM is provided. The shielding layer is designed by adding an assist feature to a peripheral region of an original shielding layer formed on a quartz substrate. Using an etching process with a etching mask, a portion of the original shielding layer is removed to form an original pattern and an assist feature. The assist feature is separated from the original pattern by a distance. A photoresist layer is tormed on the rim of the shielding layer so that the original pattern, half of the assist feature, and an exposed portion of the quartz substrate between the original pattern and the assist feature are exposed. A selective etching process is performed to etch the exposed portion of the quartz substrate to a certain depth so that it behaves like a phase shifting layer. After removing the photoresist layer, the sub-resolution PSM including the integrated circuit pattern and the assist feature is complete.
    • 提供了一种自动形成子分辨率PSM的方法。 通过向形成在石英基板上的原始屏蔽层的外围区域添加辅助特征来设计屏蔽层。 使用具有蚀刻掩模的蚀刻工艺,去除原始屏蔽层的一部分以形成原始图案和辅助特征。 辅助功能与原始图案分开一段距离。 光致抗蚀剂层被置于屏蔽层的边缘上,使原始图案(辅助特征的一半)和原始图案与辅助特征之间的石英基板的暴露部分露出。 执行选择性蚀刻处理以将石英衬底的暴露部分蚀刻到一定深度,使得其表现为类似于移相层。 在去除光致抗蚀剂层之后,包括集成电路图案和辅助特征的子分辨率PSM完成。