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    • 5. 发明授权
    • Multiple slot load lock chamber and method of operation
    • 多槽加载锁定室和操作方法
    • US07665951B2
    • 2010-02-23
    • US11421793
    • 2006-06-02
    • Shinichi KuritaSuhail AnwarJae-Chull Lee
    • Shinichi KuritaSuhail AnwarJae-Chull Lee
    • B65G49/07
    • H01L21/67201C23C14/566H01L21/67109H01L21/67126H01L21/67167H01L21/67178H01L21/6719H01L21/67742H01L21/67751Y10S414/139
    • Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.
    • 本发明的实施例包括负载锁定室,具有负载锁定室的处理系统和用于在大气和真空环境之间传送衬底的方法。 在一个实施例中,该方法包括将经处理的基板保持在形成在室主体中的传送空腔内用于两个排气循环。 在另一个实施例中,该方法包括将基底从传递腔转移到形成在腔体中的加热腔,以及加热加热腔中的基底。 在另一个实施例中,负载锁定室包括具有设置在传送腔中的衬底支撑件的室主体。 衬底支撑件可在第一高度和第二高度之间移动。 多个槽形成在传送腔的天花板或地板中的至少一个中,并且被配置为当位于第二高度时容纳衬底支撑件的至少一部分。
    • 7. 发明申请
    • MULTIPLE SLOT LOAD LOCK CHAMBER AND METHOD OF OPERATION
    • 多槽式装载机和操作方法
    • US20070280816A1
    • 2007-12-06
    • US11421793
    • 2006-06-02
    • Shinichi KuritaSuhail AnwarJae-Chull Lee
    • Shinichi KuritaSuhail AnwarJae-Chull Lee
    • B65H1/00
    • H01L21/67201C23C14/566H01L21/67109H01L21/67126H01L21/67167H01L21/67178H01L21/6719H01L21/67742H01L21/67751Y10S414/139
    • Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.
    • 本发明的实施例包括负载锁定室,具有负载锁定室的处理系统和用于在大气和真空环境之间传送衬底的方法。 在一个实施例中,该方法包括将经处理的基板保持在形成在室主体中的传送空腔内用于两个排气循环。 在另一个实施例中,该方法包括将基底从传递腔转移到形成在腔体中的加热腔,以及加热加热腔中的基底。 在另一个实施例中,负载锁定室包括具有设置在传送腔中的衬底支撑件的室主体。 衬底支撑件可在第一高度和第二高度之间移动。 多个槽形成在传送腔的天花板或地板中的至少一个中,并且被配置为当位于第二高度时容纳衬底支撑件的至少一部分。
    • 9. 发明申请
    • Multiple Slot Load Lock Chamber and Method of Operation
    • 多槽负载锁定室和操作方法
    • US20100139889A1
    • 2010-06-10
    • US12709713
    • 2010-02-22
    • Shinichi KuritaSuhail AnwarJae-Chull Lee
    • Shinichi KuritaSuhail AnwarJae-Chull Lee
    • H01L21/677F28F13/00
    • H01L21/67201C23C14/566H01L21/67109H01L21/67126H01L21/67167H01L21/67178H01L21/6719H01L21/67742H01L21/67751Y10S414/139
    • Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.
    • 本发明的实施例包括负载锁定室,具有负载锁定室的处理系统和用于在大气和真空环境之间传送衬底的方法。 在一个实施例中,该方法包括将经处理的基板保持在形成在室主体中的传送空腔内用于两个排气循环。 在另一个实施例中,该方法包括将基底从传递腔转移到形成在腔体中的加热腔,以及加热加热腔中的基底。 在另一个实施例中,负载锁定室包括具有设置在传送腔中的衬底支撑件的室主体。 衬底支撑件可在第一高度和第二高度之间移动。 多个槽形成在传送腔的天花板或地板中的至少一个中,并且被配置为当位于第二高度时容纳衬底支撑件的至少一部分。
    • 10. 发明申请
    • LOAD LOCK CHAMBER WITH HEATER IN TUBE
    • 带加热器的管路箱
    • US20080118236A1
    • 2008-05-22
    • US11782290
    • 2007-07-24
    • Suhail AnwarJae-Chull LeeShinichi Kurita
    • Suhail AnwarJae-Chull LeeShinichi Kurita
    • H01L21/00H05B3/14H05B31/08
    • H01L21/67115C23C16/54H01L21/67201
    • Embodiments of the invention include a heated load lock chamber. In one embodiment, a heated load lock chamber includes a chamber body having a plurality of lamp assembles disposed at least partially therein. Each lamp assembly includes a transmissive tube housing a lamp. The transmissive tube extends into the chamber body and provides a pressure barrier isolating the lamp from the interior volume of the load lock chamber. In another embodiment, an open end of the transmissive tube extends through a sidewall of the chamber body. A closed end of the transmissive tube is surrounded by the interior volume of the chamber body and is supported below a top of the chamber body in a spaced apart relation. The open end of the tube is sealed to the sidewall of the chamber body such that the interior of the tube is open to atmosphere.
    • 本发明的实施例包括加热的负载锁定室。 在一个实施例中,加热的负载锁定室包括具有至少部分地设置在其中的多个灯组件的室主体。 每个灯组件包括容纳灯的透射管。 透射管延伸到室主体中并提供将灯隔离到负载锁定室的内部空间的压力屏障。 在另一个实施例中,透射管的开口端延伸穿过腔体的侧壁。 透射管的封闭端被室主体的内部空间包围,并以间隔的关系支撑在腔室主体的顶部下方。 管的开口端被密封到腔体的侧壁,使得管的内部对大气敞开。