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    • 2. 发明授权
    • Single channel four transistor SRAM
    • 单通道四晶体管SRAM
    • US06442061B1
    • 2002-08-27
    • US09783653
    • 2001-02-14
    • Weiran KongGary K. GiustRamnath VenkatramanYauh-Ching LiuFranklin DuanRuggero CastagnettiSteven M. PetersonMyron J. BuerMinh Tien Nguyen
    • Weiran KongGary K. GiustRamnath VenkatramanYauh-Ching LiuFranklin DuanRuggero CastagnettiSteven M. PetersonMyron J. BuerMinh Tien Nguyen
    • G11C1100
    • G11C11/412H01L27/11
    • A method of forming a memory cell according to the present invention. A first pass gate transistor is formed of a first transistor type. The first pass gate transistor has a gate oxide with a first thickness. The source of the first pass gate transistor is electrically connected to a first bit line, and the drain of the first pass gate transistor is electrically connected to a first state node. The gate of the first pass gate transistor is electrically connected to a memory cell enable line. A second pass gate transistor is also formed of the first transistor type. The second pass gate transistor also has a gate oxide with the first thickness. The source of the second pass gate transistor is electrically connected to a second bit line, and the drain of the second pass gate transistor is electrically connected to a second state node. The gate of the second pass gate transistor is electrically connected to the memory cell enable line. A first state node transistor is also formed of the first transistor type. The first state node transistor has a gate oxide with a second thickness. The source of the first state node transistor is electrically connected to the first state node, and the drain of the first state node transistor is electrically connected to a ground line. The gate of the first state node is electrically connected to the second state node. A second state node transistor is also formed of the first transistor type. The second state node transistor also has a gate oxide with the second thickness. The source of the second state node transistor is electrically connected to the second state node, and the drain of the second state node transistor is electrically connected to the ground line. The gate of the second state node is electrically connected to the first state node.
    • 根据本发明的形成存储单元的方法。 第一栅极晶体管由第一晶体管形成。 第一栅极晶体管具有第一厚度的栅极氧化物。 第一栅极晶体管的源极电连接到第一位线,并且第一栅极晶体管的漏极电连接到第一状态节点。 第一栅极晶体管的栅极电连接到存储器单元使能线。 第二栅极晶体管也由第一晶体管形成。 第二栅极晶体管还具有第一厚度的栅极氧化物。 第二栅极晶体管的源极电连接到第二位线,并且第二栅极晶体管的漏极电连接到第二状态节点。 第二通栅晶体管的栅极电连接到存储单元使能线。 第一状态节点晶体管也由第一晶体管类型形成。 第一状态节点晶体管具有第二厚度的栅极氧化物。 第一状态节点晶体管的源极电连接到第一状态节点,并且第一状态节点晶体管的漏极电连接到接地线。 第一状态节点的门电连接到第二状态节点。 第二状态节点晶体管也由第一晶体管类型形成。 第二状态节点晶体管也具有第二厚度的栅极氧化物。 第二状态节点晶体管的源极电连接到第二状态节点,并且第二状态节点晶体管的漏极电连接到接地线。 第二状态节点的门电连接到第一状态节点。