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1. 发明申请

US20120176804A1 LED-BASED LIGHT BULB 审中-公开
标题翻译： LED基灯泡
公开(公告)号：US20120176804A1
公开(公告)日：2012-07-12
申请号：US13424785
申请日：2012-03-20
申请人： Christopher L. Bohler , Boris Kolodin , Emil Radkov , Srinath K. Aanegola , Stanton E. Weaver, JR. , James T. Petroski , Zena Brown
发明人： Christopher L. Bohler , Boris Kolodin , Emil Radkov , Srinath K. Aanegola , Stanton E. Weaver, JR. , James T. Petroski , Zena Brown
IPC分类号： F21V29/00
CPC分类号： B82Y10/00 , F21K9/23 , F21K9/232 , F21K9/61 , F21K9/64 , F21V3/00 , F21V3/02 , F21V29/58 , F21V29/63 , F21V29/67 , F21V29/70 , F21V29/773 , F21Y2105/00 , F21Y2105/18 , F21Y2115/10
摘要： A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light. The enclosure (22) has a shape of a standard incandescent lamp.
摘要翻译：光源（10）包括光引擎（16），基座（24），电源转换电路（30）和外壳（22）。光引擎（16）包括设置在平台（14）上的至少一个LED（12）。平台（14）适于与基座（24）直接配合，该基座（24）是标准的白炽灯泡灯座。荧光体（44）接收由至少一个LED（12）产生的光并将其转换成可见光。外壳（22）具有标准白炽灯的形状。

2. 发明授权

US07367217B2 Sensor device for detection of dissolved hydrocarbon gases in oil filled high-voltage electrical equipment 失效
标题翻译：用于检测充油高压电气设备中溶解的烃类气体的传感器装置
公开(公告)号：US07367217B2
公开(公告)日：2008-05-06
申请号：US11683739
申请日：2007-03-08
申请人： Edward B. Stokes , Peter M. Sandvik , Vinayak Tilak , Jeffrey B. Fedison , Elena Babes-Dornea , Renyan Qin , James W. Rose , Stanton E. Weaver
发明人： Edward B. Stokes , Peter M. Sandvik , Vinayak Tilak , Jeffrey B. Fedison , Elena Babes-Dornea , Renyan Qin , James W. Rose , Stanton E. Weaver
IPC分类号： G01N7/00 , G01N9/00
CPC分类号： G01N33/2841 , G01N27/4141
摘要： A multi-gas sensor device for the detection of dissolved hydrocarbon gases in oil-filled electrical equipment. The device comprising a semiconductor substrate, one or more catalytic metal gate-electrodes deposited on the surface of the semiconductor substrate operable for sensing various gases, and an ohmic contact deposited on the surface of the semiconductor substrate. The semiconductor substrate comprises one of GaN, SiC, AlN, InN, AlGaN, InGaN and AlInGaN. A method for sensing gas in an oil-filled reservoir of electrical equipment, comprising providing a sensor device, immersing the sensor device in the oil-filled reservoir, allowing the gases emitted from the oil to interact with the one or more catalytic metal gate-electrodes, altering the gas as it contacts the catalytic metal gate-electrodes and altering the sensitivity of the sensor.
摘要翻译：一种用于检测充油电气设备中溶解的烃类气体的多气体传感器装置。所述器件包括半导体衬底，沉积在可操作以感测各种气体的半导体衬底的表面上的一个或多个催化金属栅电极和沉积在半导体衬底的表面上的欧姆接触。半导体衬底包括GaN，SiC，AlN，InN，AlGaN，InGaN和AlInGaN中的一种。一种用于感测电气设备的充满油的储存器中的气体的方法，包括提供传感器装置，将传感器装置浸入充满油的储存器中，允许从油中排出的气体与一个或多个催化金属栅极 - 电极，当气体接触催化金属栅电极时改变气体并改变传感器的灵敏度。

3. 发明授权

US07254986B2 Sensor device for detection of dissolved hydrocarbon gases in oil filled high-voltage electrical equipment 失效
标题翻译：用于检测充油高压电气设备中溶解的烃类气体的传感器装置
公开(公告)号：US07254986B2
公开(公告)日：2007-08-14
申请号：US10319359
申请日：2002-12-13
申请人： Edward B. Stokes , Peter M. Sandvik , Vinayak Tilak , Jeffrey B. Fedison , Elena Babes-Dornea , Renyan Qin , James W. Rose , Stanton E. Weaver
发明人： Edward B. Stokes , Peter M. Sandvik , Vinayak Tilak , Jeffrey B. Fedison , Elena Babes-Dornea , Renyan Qin , James W. Rose , Stanton E. Weaver
IPC分类号： G01N7/00 , G01N9/00
CPC分类号： G01N33/2841 , G01N27/4141
摘要： A multi-gas sensor device for the detection of dissolved hydrocarbon gases in oil-filled electrical equipment. The device comprising a semiconductor substrate, one or more catalytic metal gate-electrodes deposited on the surface of the semiconductor substrate operable for sensing various gases, and an ohmic contact deposited on the surface of the semiconductor substrate. The semiconductor substrate comprises one of GaN, SiC, AlN, lnN, AlGaN, InGaN and AlInGaN. A method for sensing gas in an oil-filled reservoir of electrical equipment, comprising providing a sensor device, immersing the sensor device in the oil-filled reservoir, allowing the gases emitted from the oil to interact with the one or more catalytic metal gate-electrodes, altering the gas as it contacts the catalytic metal gate-electrodes and altering the sensitivity of the sensor.
摘要翻译：一种用于检测充油电气设备中溶解的烃类气体的多气体传感器装置。所述器件包括半导体衬底，沉积在可操作以感测各种气体的半导体衬底的表面上的一个或多个催化金属栅电极和沉积在半导体衬底的表面上的欧姆接触。半导体衬底包括GaN，SiC，AlN，InN，AlGaN，InGaN和AlInGaN中的一种。一种用于感测电气设备的充满油的储存器中的气体的方法，包括提供传感器装置，将传感器装置浸入充满油的储存器中，允许从油中排出的气体与一个或多个催化金属栅极 - 电极，当气体接触催化金属栅电极时改变气体并改变传感器的灵敏度。

4. 发明授权

US07224000B2 Light emitting diode component 有权
标题翻译：发光二极管组件
公开(公告)号：US07224000B2
公开(公告)日：2007-05-29
申请号：US10831862
申请日：2004-04-26
申请人： Srinath K. Aanegola , James T. Petroski , Emil Radkov , Stanton E. Weaver, Jr.
发明人： Srinath K. Aanegola , James T. Petroski , Emil Radkov , Stanton E. Weaver, Jr.
IPC分类号： H01L29/22 , H01L29/227 , H01L27/15 , H01L29/267 , H01L29/24
CPC分类号： H01L33/52 , H01L25/0753 , H01L33/507 , H01L33/58 , H01L2224/48091 , H01L2924/00
摘要： A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.
摘要翻译：发光封装（8,8'，8“，208,408）包括支撑至少一个发光管芯（12,12”，“10”）的印刷电路板（10,10'，10“，210,410），14,16,212,412）。透光罩（60,60'，60“，260,460）设置在所述至少一个发光管芯上。盖具有限定与印刷电路板连接的盖周长（62,62'，62“，262,462）的开口端。与印刷电路板一起，盖的内表面限定包含至少一个发光管芯的内部容积（70,70“，270,470）。密封剂（76,76“，276,278,476）设置在内部体积中并且至少覆盖发光管芯。

5. 发明授权

US07179670B2 Flip-chip light emitting diode device without sub-mount 有权
标题翻译：倒装芯片发光二极管器件无需安装
公开(公告)号：US07179670B2
公开(公告)日：2007-02-20
申请号：US10794935
申请日：2004-03-05
申请人： Bryan S. Shelton , Sebastien Libon , Hari S. Venugopalan , Ivan Eliashevich , Stanton E. Weaver, Jr. , Chen-Lun Hsing Chen , Thomas F. Soules , Steven LeBoeuf , Stephen Arthur
发明人： Bryan S. Shelton , Sebastien Libon , Hari S. Venugopalan , Ivan Eliashevich , Stanton E. Weaver, Jr. , Chen-Lun Hsing Chen , Thomas F. Soules , Steven LeBoeuf , Stephen Arthur
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L24/81 , H01L33/38 , H01L2224/0345 , H01L2224/03462 , H01L2224/0401 , H01L2224/04026 , H01L2224/05005 , H01L2224/05023 , H01L2224/05027 , H01L2224/0508 , H01L2224/05139 , H01L2224/05144 , H01L2224/05155 , H01L2224/05564 , H01L2224/05568 , H01L2224/05611 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1357 , H01L2224/13639 , H01L2224/13644 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/3003 , H01L2224/73103 , H01L2224/73203 , H01L2224/83193 , H01L2224/83203 , H01L2224/83205 , H01L2224/8321 , H01L2224/8323 , H01L2224/83815 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552 , H01L2924/00 , H01L2924/00012
摘要： A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation (delectrodes). A bonding pad layer (50) includes at least one n-type bonding pad (64) and at least one p-type bonding pad (62) defining a minimum bonding pads separation (dpads) that is larger than the minimum electrodes separation (delectrodes). At least one fanning layer (30) interposed between the front-side of the light emitting diode (10) and the bonding pad layer (50) includes a plurality of electrically conductive paths passing through vias (34, 54) of a dielectric layer (32, 52) to provide electrical communication between the at least one n-type electrode (14) and the at least one n-type bonding pad (64) and between the at least one p-type electrode (12) and the at least one p-type bonding pad (62).
摘要翻译：发光二极管（10）具有背面和前侧，具有至少一个n型电极（14）和设置在其上的至少一个p型电极（12），其限定最小电极间隔（d < ）。接合焊盘层（50）包括至少一个n型接合焊盘（64）和至少一个限定最小接合焊盘间隔（p>焊盘）的p型接合焊盘（62）大于最小电极分离（d _{电极）。插入在发光二极管（10）的前侧和接合焊盘层（50）之间的至少一个扇形层（30）包括穿过电介质层的通孔（34,54）的多个导电路径以在所述至少一个n型电极（14）和所述至少一个n型焊盘（64）之间以及所述至少一个p型电极（12）和所述至少一个p型电极（12）之间提供电连通一个p型接合焊盘（62）。}

6. 发明授权

US06883774B2 Microelectromechanical high pressure gas microvalve 有权
标题翻译：微机电高压气体微阀
公开(公告)号：US06883774B2
公开(公告)日：2005-04-26
申请号：US10277028
申请日：2002-10-21
申请人： Matthew C. Nielsen , Laura J. Meyer , Todd G. Wetzel , Stanton E. Weaver , Jeffrey B. Fortin , Renato Guida
发明人： Matthew C. Nielsen , Laura J. Meyer , Todd G. Wetzel , Stanton E. Weaver , Jeffrey B. Fortin , Renato Guida
IPC分类号： F15C5/00 , F16K99/00 , F16K7/12
CPC分类号： F16K99/0001 , F15C5/00 , F16K99/0007 , F16K99/0015 , F16K99/0048 , F16K99/0057 , F16K2099/0074
摘要： A microvalve and a method of forming a microvalve. The microvalve comprises first and second layers, a diaphragm member and a switching means. The first and second layers are secured together to form a valve body that forms an inlet opening for receiving fluid, an outlet opening for conducting fluid from the valve body, and a flow channel for conducting fluid from the inlet to the outlet. The diaphragm is disposed between the layers, and is movable between open and closed positions. In these position, the diaphragm, respectively, allows and blocks the flow of fluid from the inlet to the flow channel. The diaphragm is biased to the closed position, and moves from the closed position to the open position when the pressure of fluid in the inlet reaches a preset value. The switching means is connected to the valve body for moving the diaphragm to the closed position against the pressure of fluid in the inlet. Preferably, the microvalve is constructed out of SiC and stainless steel materials, allowing the microvalve to be used in a harsh environment.
摘要翻译：一种微型阀和形成微型阀的方法。微型阀包括第一和第二层，隔膜构件和开关装置。第一层和第二层被固定在一起以形成阀体，其形成用于接收流体的入口开口，用于从阀体传导流体的出口，以及用于将流体从入口传导到出口的流动通道。隔膜设置在层之间，并且可在打开位置和关闭位置之间移动。在这些位置上，隔膜分别允许和阻止流体从入口到流动通道的流动。隔膜被偏压到关闭位置，并且当入口中的流体的压力达到预设值时，隔膜从关闭位置移动到打开位置。切换装置连接到阀体，用于抵抗入口中的流体的压力将隔膜移动到关闭位置。优选地，微型阀由SiC和不锈钢材料制成，允许微型阀在恶劣的环境中使用。

7. 发明授权

US5366906A Wafer level integration and testing 失效
标题翻译：晶圆级集成和测试
公开(公告)号：US5366906A
公开(公告)日：1994-11-22
申请号：US962000
申请日：1992-10-16
申请人： Robert J. Wojnarowski , Constantine A. Neugebauer , Wolfgang Daum , Bernard Gorowitz , Eric J. Wildi , Michael Gdula , Stanton E. Weaver, Jr. , Anthony A. Immorlica, Jr.
发明人： Robert J. Wojnarowski , Constantine A. Neugebauer , Wolfgang Daum , Bernard Gorowitz , Eric J. Wildi , Michael Gdula , Stanton E. Weaver, Jr. , Anthony A. Immorlica, Jr.
IPC分类号： G01R31/3185 , H01L21/301 , H01L21/66 , H01L23/538 , H01L23/58 , G01R31/26
CPC分类号： H01L22/22 , H01L22/32 , H01L23/5389 , H01L24/24 , H01L24/82 , G01R31/318505 , G01R31/318533 , H01L2224/2402 , H01L2224/24137 , H01L2224/24227 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/351
摘要： In fabricating wafer scale integrated interconnects, a temporary or permanent dielectric layer and a pattern of electrical conductors are used to provide wafer scale integration or testing and burn-in. A resist can be used to cover the areas of IC pads on the wafer while the remainder of the pattern of electrical conductors is removed to provide for repair of the wafer scale integration structure. The pattern of electrical conductors may be configured so that the conductor lengths between at least some sub-circuits on a plurality of wafers are substantially electrically equal for signal propagation purposes; an additional wafer may be laminated to the wafer using an adhesive; controlled curfs may be cut into the wafer; and the wafer may be interconnected to an interface ring.
摘要翻译：在制造晶片级集成互连件时，使用临时或永久的电介质层和电导体图案来提供晶片级整合或测试和老化。可以使用抗蚀剂来覆盖晶片上的IC焊盘的区域，而去除电导体图案的其余部分以提供晶片级整合结构的修复。电导体的图案可以被配置为使得在多个晶片上的至少一些子电路之间的导体长度对于信号传播目的而基本上是电相等的; 可以使用粘合剂将另外的晶片层压到晶片上; 受控的曲折可以被切入晶片; 并且晶片可以互连到接口环。

8. 发明授权

US09534743B2 Directional lamp with beam forming optical system including a lens and collecting reflector 有权
标题翻译：具有光束成形光学系统的定向灯，包括透镜和收集反射器
公开(公告)号：US09534743B2
公开(公告)日：2017-01-03
申请号：US14083597
申请日：2013-11-19
申请人： Gary R. Allen , Stanton E. Weaver, Jr. , R. Stephen Mulder , David C. Dudik , Mark E. Kaminski
发明人： Gary R. Allen , Stanton E. Weaver, Jr. , R. Stephen Mulder , David C. Dudik , Mark E. Kaminski
IPC分类号： F21K99/00 , F21V13/12 , F21V3/00 , F21V5/04 , F21V7/00 , F21Y101/02 , F21Y105/00
CPC分类号： F21K9/233 , F21K9/60 , F21V3/00 , F21V5/04 , F21V7/00 , F21V13/12 , F21Y2101/00 , F21Y2105/10 , F21Y2105/12 , F21Y2115/10
摘要： A directional lamp comprises a light source, a beam forming optical system configured to form light from the light source into a light beam, and a light mixing diffuser arranged to diffuse the light beam. The light source, beam forming optical system, and light mixing diffuser are secured together as a unitary lamp. The beam forming optical system includes: a collecting reflector having an entrance aperture receiving light from the light source and an exit aperture that is larger than the entrance aperture, and a lens disposed at the exit aperture of the collecting reflector, the light source being positioned along an optical axis of the beam forming optical system at a distance from the lens that is within plus or minus ten percent of a focal length of the lens.
摘要翻译：定向灯包括光源，被配置为将光从光源形成光束的光束形成光学系统，以及布置成漫射光束的光混合漫射器。光源，光束形成光学系统和光混合漫射器作为整体灯固定在一起。光束形成光学系统包括：收集反射器，其具有接收来自光源的光的入射孔和大于入射孔的出射孔，以及设置在收集反射体的出射孔处的透镜，光源被定位沿着与透镜相距一定距离的光束形成光学系统的光轴，该距离在透镜的焦距的±10％以内。

9. 发明授权

US08613530B2 Compact light-mixing LED light engine and white LED lamp with narrow beam and high CRI using same 有权
标题翻译：紧凑型光混合LED光引擎和白光LED灯，窄光束和高CRI使用相同
公开(公告)号：US08613530B2
公开(公告)日：2013-12-24
申请号：US12685287
申请日：2010-01-11
申请人： Gary R. Allen , Stanton E. Weaver, Jr. , R. Stephen Mulder , David C. Dudik , Mark E. Kaminski
发明人： Gary R. Allen , Stanton E. Weaver, Jr. , R. Stephen Mulder , David C. Dudik , Mark E. Kaminski
IPC分类号： F21V7/00
CPC分类号： F21K9/233 , F21K9/60 , F21V3/00 , F21V5/04 , F21V7/00 , F21V13/12 , F21Y2101/00 , F21Y2105/10 , F21Y2105/12 , F21Y2115/10
摘要： A directional lamp comprises a light source, a beam forming optical system configured to form light from the light source into a light beam, and a light mixing diffuser arranged to diffuse the light beam. The light source, beam forming optical system, and light mixing diffuser are secured together as a unitary lamp. The beam forming optical system includes: a collecting reflector having an entrance aperture receiving light from the light source and an exit aperture that is larger than the entrance aperture, and a lens disposed at the exit aperture of the collecting reflector, the light source being positioned along an optical axis of the beam forming optical system at a distance from the lens that is within plus or minus ten percent of a focal length of the lens.
摘要翻译：定向灯包括光源，被配置为将光从光源形成光束的光束形成光学系统，以及布置成漫射光束的光混合漫射器。光源，光束形成光学系统和光混合漫射器作为整体灯固定在一起。光束形成光学系统包括：收集反射器，其具有接收来自光源的光的入射孔和大于入射孔的出射孔，以及设置在收集反射体的出射孔处的透镜，光源被定位沿着与透镜相距一定距离的光束形成光学系统的光轴，该距离在透镜的焦距的±10％以内。

10. 发明申请

US20120176770A1 LED-BASED LIGHT BULB 审中-公开
公开(公告)号：US20120176770A1
公开(公告)日：2012-07-12
申请号：US13424805
申请日：2012-03-20
申请人： Christopher L. Bohler , Boris Kolodin , Emil Radkov , Srinath K. Aanegola , Stanton E. Weaver, JR. , James T. Petroski , Zena Brown
发明人： Christopher L. Bohler , Boris Kolodin , Emil Radkov , Srinath K. Aanegola , Stanton E. Weaver, JR. , James T. Petroski , Zena Brown
IPC分类号： F21V9/16 , F21V29/00 , F21V21/00
CPC分类号： B82Y10/00 , F21K9/23 , F21K9/232 , F21K9/61 , F21K9/64 , F21V3/00 , F21V3/02 , F21V29/58 , F21V29/63 , F21V29/67 , F21V29/70 , F21V29/773 , F21Y2105/00 , F21Y2105/18 , F21Y2115/10
摘要： A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light. The enclosure (22) has a shape of a standard incandescent lamp.

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