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1. 发明授权

US5353498A Method for fabricating an integrated circuit module 失效
标题翻译：集成电路模块的制造方法
公开(公告)号：US5353498A
公开(公告)日：1994-10-11
申请号：US87434
申请日：1993-07-09
申请人： Raymond A. Fillion , Robert J. Wojnarowski , Michael Gdula , Herbert S. Cole , Eric J. Wildi , Wolfgang Daum
发明人： Raymond A. Fillion , Robert J. Wojnarowski , Michael Gdula , Herbert S. Cole , Eric J. Wildi , Wolfgang Daum
IPC分类号： H01L23/52 , H01L21/56 , H01L21/58 , H01L21/68 , H01L23/29 , H01L23/433 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/18 , H05K3/34
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/293 , H01L23/295 , H01L23/4334 , H01L23/538 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/82 , H01L24/83 , H01L24/96 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/04105 , H01L2224/2402 , H01L2224/24137 , H01L2224/24195 , H01L2224/2518 , H01L2224/2919 , H01L2224/82039 , H01L2224/83192 , H01L2224/8385 , H01L2225/06517 , H01L2225/0652 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2225/06589 , H01L2225/1035 , H01L2225/1058 , H01L2225/1064 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/49144
摘要： Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate molding material is added within the mold form, and the substrate molding material is then hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and the faces of the chips. A thermal plug may be affixed to the backside of a chip before substrate molding material is added. A connector frame may be placed on the adhesive layer before substrate molding material is added. A dielectric layer may be placed over the backsides of the chips before the substrate molding material is added to enhance repairability. A portion of the chips and substrate molding material may be removed after the substrate molding material is hardened.
摘要翻译：基板材料直接模制到半导体芯片和其他用于集成电路模块制造的电气部件。具有接触垫的芯片面朝下放置在由基底支撑的粘合剂层上。模具周围位于芯片周围。在模具形式中加入基材成型材料，然后将基材成型材料硬化。具有与预定接触焊盘对准的通孔并具有延伸通过通孔的电导体的通孔的电介质层位于硬化的基底成型材料和芯片的表面上。在添加基板模制材料之前，可以将热塞固定到芯片的背面。在添加基材模塑材料之前，连接器框架可以放置在粘合剂层上。在添加基底成型材料之前，可以将电介质层放置在芯片的背面上以增强可修复性。芯片和基材成型材料的一部分可以在基材模塑材料硬化之后被去除。

2. 发明授权

US5849623A Method of forming thin film resistors on organic surfaces 失效
标题翻译：在有机表面上形成薄膜电阻的方法
公开(公告)号：US5849623A
公开(公告)日：1998-12-15
申请号：US862672
申请日：1997-05-23
申请人： Robert John Wojnarowski , James Wilson Rose , Kyung Wook Paik , Michael Gdula
发明人： Robert John Wojnarowski , James Wilson Rose , Kyung Wook Paik , Michael Gdula
IPC分类号： H01C1/032 , H01C7/00 , H01C17/075 , H01L23/538 , H05K1/02 , H05K1/16 , H05K3/38 , H01L21/20
CPC分类号： H05K1/167 , H01C1/032 , H01C17/075 , H01C7/006 , H01L2224/73204 , H01L2224/82039 , H01L23/5389 , H01L2924/01077 , H05K1/0268 , H05K2201/0317 , H05K2203/0361 , H05K2203/171 , H05K3/388 , Y10S148/136 , Y10T29/49101
摘要： A method for fabricating a thin film resistor comprises applying a tantalum nitride layer over a dielectric layer, applying a metallization layer over the tantalum nitride layer, and patterning the metallization layer with a first portion of the metallization layer situated apart from a second portion of the metallization layer and both the first and second portions being at least partially situated on the tantalum nitride layer. In one embodiment, after patterning the metallization layer, the resistance value between the first and second portions of the metallization layer is determined and compared to a predetermined resistance value, and at least one of the first and second portions is trimmed to obtain a modified resistance value between the first and second portions that is closer to the predetermined resistance value than the determined resistance value.
摘要翻译：一种用于制造薄膜电阻器的方法包括在介电层上施加氮化钽层，在氮化钽层上施加金属化层，以及使金属化层的第一部分与金属化层的第二部分分开，金属化层，并且第一和第二部分至少部分地位于氮化钽层上。在一个实施例中，在图案化金属化层之后，确定金属化层的第一和第二部分之间的电阻值并将其与预定电阻值进行比较，并且修剪第一和第二部分中的至少一个以获得改良电阻第一和第二部分之间的值比所确定的电阻值更接近于预定电阻值。

3. 发明授权

US5381445A Munitions cartridge transmitter 失效
标题翻译：弹药筒式变送器
公开(公告)号：US5381445A
公开(公告)日：1995-01-10
申请号：US55473
申请日：1993-05-03
申请人： John E. Hershey , Menahem Lowy , Lionel M. Levinson , Amer A. Hassan , Richard L. Frey , Kenneth B. Welles, II , Michael Gdula , Robert J. Wojnarowski
发明人： John E. Hershey , Menahem Lowy , Lionel M. Levinson , Amer A. Hassan , Richard L. Frey , Kenneth B. Welles, II , Michael Gdula , Robert J. Wojnarowski
IPC分类号： F42B12/36 , G01S5/00 , G01S5/06 , H04L27/30
CPC分类号： G01S5/0009 , F42B12/36 , F42B12/365 , G01S5/06
摘要： A munitions cartridge transmitter capable of emitting an electromagnetic signal after discharge from a cartridge propelling device comprises a signal generator, an electromagnetic signal transmitter coupled to the generator, an antenna coupled to the transmitter, and a hollow cartridge for housing the generator, the transmitter, and the antenna. The transmitter is energized after discharge of the cartridge propelling device by a power source contained in the cartridge.
摘要翻译：一种能够在从暗盒推进装置排放之后发出电磁信号的弹药盒式发射器包括信号发生器，耦合到发生器的电磁信号发射器，耦合到发射器的天线以及用于容纳发生器的中空滤芯，和天线。在通过盒中包含的电源将墨盒驱动装置排出之后，变送器通电。

4. 发明授权

US4845608A Digital speed controller using a single-chip microcontroller 失效
标题翻译：使用单片微控制器的数字调速控制器
公开(公告)号：US4845608A
公开(公告)日：1989-07-04
申请号：US135961
申请日：1987-12-21
申请人： Michael Gdula
发明人： Michael Gdula
IPC分类号： H02P23/00
CPC分类号： H02P23/22 , Y10S388/912 , Y10S388/933
摘要： A speed regulator digital speed controller for rotating machinery is comprised of a single-chip microcontroller operating in conjunction with a multiple counter/time peripheral, and is programmed in a high level language. Pulses are generated by a digital speed sensor at a rate too low to give the required speed resolution; these pulses are counted and a preset number toggles a binary gate signal. Two clock counters both having an input connected to a high reference frequency oscillator are gated alternately and accumulate a count depending on the length of the gated on interval. These speed related counts are read during alternating gated off intervals into the microcontroller where the speed error is calculated in real time to a high degree of accuracy and resolution. The speed of an electric motor and a steam turbine, for instance, are regulated.
摘要翻译：用于旋转机械的速度调节器数字速度控制器包括与多个计数器/时间外设结合使用的单片微控制器，并以高级语言编程。脉冲由数字速度传感器以太低的速率产生，无法提供所需的速度分辨率; 这些脉冲被计数，并且预设的数字切换二进制门信号。具有连接到高参考频率振荡器的输入的两个时钟计数器交替地选通，并且根据门控的间隔的长度累积计数。这些速度相关计数在交替的选通间隔期间被读取到微控制器中，其中速度误差被实时计算到高精度和分辨率。例如，电动机和蒸汽轮机的速度被调节。

5. 发明授权

US5675310A Thin film resistors on organic surfaces 失效
标题翻译：有机表面上的薄膜电阻
公开(公告)号：US5675310A
公开(公告)日：1997-10-07
申请号：US349228
申请日：1994-12-05
申请人： Robert John Wojnarowski , James Wilson Rose , Kyung Wook Paik , Michael Gdula
发明人： Robert John Wojnarowski , James Wilson Rose , Kyung Wook Paik , Michael Gdula
IPC分类号： H01C1/032 , H01C7/00 , H01C17/075 , H01L23/538 , H05K1/02 , H05K1/16 , H05K3/38 , H01C1/012 , H01L27/00
CPC分类号： H05K1/167 , H01C1/032 , H01C17/075 , H01C7/006 , H01L2224/73204 , H01L2224/82039 , H01L23/5389 , H01L2924/01077 , H05K1/0268 , H05K2201/0317 , H05K2203/0361 , H05K2203/171 , H05K3/388 , Y10S148/136 , Y10T29/49101
摘要： A method for fabricating a thin film resistor comprises applying a tantalum nitride layer over a dielectric layer, applying a metallization layer over the tantalum nitride layer, and patterning the metallization layer with a first portion of the metallization layer situated apart from a second portion of the metallization layer and both the first and second portions being at least partially situated on the tantalum nitride layer. In one embodiment, after patterning the metallization layer, the resistance value between the first and second portions of the metallization layer is determined and compared to a predetermined resistance value, and at least one of the first and second portions is trimmed to obtain a modified resistance value between the first and second portions that is closer to the predetermined resistance value than the determined resistance value.
摘要翻译：一种用于制造薄膜电阻器的方法包括在介电层上施加氮化钽层，在氮化钽层上施加金属化层，以及使金属化层的第一部分与金属化层的第二部分分开，金属化层，并且第一和第二部分至少部分地位于氮化钽层上。在一个实施例中，在图案化金属化层之后，确定金属化层的第一和第二部分之间的电阻值并将其与预定电阻值进行比较，并且修剪第一和第二部分中的至少一个以获得改良电阻第一和第二部分之间的值比所确定的电阻值更接近于预定电阻值。

6. 发明授权

US5497033A Embedded substrate for integrated circuit modules 失效
标题翻译：集成电路模块用嵌入式基板
公开(公告)号：US5497033A
公开(公告)日：1996-03-05
申请号：US262181
申请日：1994-06-20
申请人： Raymond A. Fillion , Robert J. Woinarowski , Michael Gdula , Herbert S. Cole , Eric J. Wildi , Wolfgang Daum
发明人： Raymond A. Fillion , Robert J. Woinarowski , Michael Gdula , Herbert S. Cole , Eric J. Wildi , Wolfgang Daum
IPC分类号： H01L23/52 , H01L21/56 , H01L21/58 , H01L21/68 , H01L23/29 , H01L23/433 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/18 , H01L23/14 , H05K7/10
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/293 , H01L23/295 , H01L23/4334 , H01L23/538 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/82 , H01L24/83 , H01L24/96 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/04105 , H01L2224/2402 , H01L2224/24137 , H01L2224/24195 , H01L2224/2518 , H01L2224/2919 , H01L2224/82039 , H01L2224/83192 , H01L2224/8385 , H01L2225/06517 , H01L2225/0652 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2225/06589 , H01L2225/1035 , H01L2225/1058 , H01L2225/1064 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/49144
摘要： Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate molding material is added within the mold form, and the substrate molding material is then hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and the faces of the chips. A thermal plug may be affixed to the backside of a chip before substrate molding material is added. A connector frame may be placed on the adhesive layer before substrate molding material is added. A dielectric layer may be placed over the backsides of the chips before the substrate molding material is added to enhance repairability. A portion of the chips and substrate molding material may be removed after the substrate molding material is hardened.
摘要翻译：基板材料直接模制到半导体芯片和其他用于集成电路模块制造的电气部件。具有接触垫的芯片面朝下放置在由基底支撑的粘合剂层上。模具周围位于芯片周围。在模具形式中加入基材成型材料，然后将基材成型材料硬化。具有与预定接触焊盘对准的通孔并具有延伸通过通孔的电导体的通孔的电介质层位于硬化的基底成型材料和芯片的表面上。在添加基板模制材料之前，可以将热塞固定到芯片的背面。在添加基材模塑材料之前，连接器框架可以放置在粘合剂层上。在添加基底成型材料之前，可以将电介质层放置在芯片的背面上以增强可修复性。芯片和基材成型材料的一部分可以在基材模塑材料硬化之后被去除。

7. 发明授权

US4327420A Polyphase reference generator 失效
标题翻译：多相参考发生器
公开(公告)号：US4327420A
公开(公告)日：1982-04-27
申请号：US164259
申请日：1980-06-30
申请人： Michael Gdula , Raymond J. Hodsoll , Edwin C. Underkoffler
发明人： Michael Gdula , Raymond J. Hodsoll , Edwin C. Underkoffler
IPC分类号： G06F1/03 , H02M1/084 , H03B27/00 , G06F15/31 , H03B19/00
CPC分类号： H02M1/0845 , G06F1/0342
摘要： A reference generator, providing a plurality of precisely-phased output signals, utilizes a microprocessor having a table of values for the output waveforms stored in a read-only memory thereof. The table entries include a multiplicity of values for providing a stepwise representation of each of the desired waveforms, which may have constant angular increments therebetween. The incremental tabular values are consecutively read responsive to the count in a timer, integral in the microcomputer, which is sequentially advanced by the pulse output of a voltage-to-frequency converter receiving a rate signal. The tabular values are converted to analog polyphase reference signals by a like number, equal to the number of phases, of digital-to-analog converters and associated low-pass filters. The output waveform peak amplitude is established by a dual-polarity reference voltage generator, responsive to a variable level signal. Essentially instantaneous reversal of the polyphase waveforms is provided by "angle complement" control of the present point utilized within the tables. The timer circuit provides steps of increasing size through the lookup-table to provide a gradual degradation in the number of steps in the output waveform when the rate signal exceeds the microcomputer execution speed upper limit.
摘要翻译：提供多个精确定相输出信号的参考发生器利用存储在其只读存储器中的输出波形具有值表的微处理器。表条目包括用于提供每个期望波形的逐步表示的多个值，其可以在它们之间具有恒定的角增量。响应于微计算机中积分的定时器中的计数连续读取增量表格值，该计数器通过接收速率信号的电压 - 频率转换器的脉冲输出而顺序地提前。表格值通过等于数模转换器和相关联的低通滤波器的相位数的相同数字转换为模拟多相参考信号。输出波形峰值振幅由双极性参考电压发生器建立，响应于可变电平信号。多相波形的基本瞬时反转由表内所使用的当前点的“角度补偿”控制提供。定时器电路提供通过查找表增加尺寸的步骤，以便当速率信号超过微型计算机执行速度上限时提供输出波形中的步数的逐渐劣化。

8. 发明授权

US4268779A Circuit for controlling current flow from an A.C. source to a load 失效
标题翻译：用于控制从交流电源到负载的电流的电路
公开(公告)号：US4268779A
公开(公告)日：1981-05-19
申请号：US66286
申请日：1979-08-13
申请人： Charles W. Eichelberger , Rudolph A. Dehn , Michael Gdula , Robert J. Wojnarowski
发明人： Charles W. Eichelberger , Rudolph A. Dehn , Michael Gdula , Robert J. Wojnarowski
IPC分类号： H05B6/68 , H05B39/00 , H05B41/14
CPC分类号： H05B6/681
摘要： A circuit for controlling power consumption of a load, by controlling the flow of current thereto, utilizes at least one parallel combination of non-linear resistance elements, such as a varistor and the like, and a gateable semiconductor switching device, such as a triac and the like, to substantially reduce or prevent current flow when the semiconductor switching device is gated to an "off" condition and to enable normal current flow to a load when the semiconductor switching device is gated to an "on" condition. Embodiments of the power circuits for control of magnetron power, in a microwave oven, are illustrated.
摘要翻译：用于通过控制电流的流量来控制负载的功耗的电路利用非线性电阻元件（例如变阻器等）的至少一个并联组合，以及可选择的半导体开关器件，例如三端双向可控硅开关元件当半导体开关器件选通到“关闭”状态并且当半导体开关器件选通到“导通”状态时能够使负载正常流动，从而大大减少或防止电流流动。示出了在微波炉中控制磁控管功率的电源电路的实施例。

9. 发明授权

US6040226A Method for fabricating a thin film inductor 有权
标题翻译：薄膜电感器的制造方法
公开(公告)号：US6040226A
公开(公告)日：2000-03-21
申请号：US177908
申请日：1998-10-23
申请人： Robert John Wojnarowski , James Wilson Rose , Ernest Wayne Balch , Leonard Richard Douglas , Evan Taylor Downey , Michael Gdula
发明人： Robert John Wojnarowski , James Wilson Rose , Ernest Wayne Balch , Leonard Richard Douglas , Evan Taylor Downey , Michael Gdula
IPC分类号： H01L21/20
CPC分类号： H01L21/20
摘要： A method is provided for the manufacture of precision electronic components such as resistors, inductors, and capacitors on a polymer or ceramic surface. The electronic components can be deposited and trimmed to precise or matched values without having precise depositions of all of the pre-patterned materials. Thin film electronic components are deposited on a surface, parameter values are measured or estimated, a correction offset file is generated, and the components are trimmed using adaptive lithography to a very close tolerance. A computer program can be used to enable the adjustment of electronic components by techniques such as changing the physical length of an inductor coil or resistor lead, or by changing a capacitor plate area.
摘要翻译：提供了一种用于在聚合物或陶瓷表面上制造诸如电阻器，电感器和电容器的精密电子部件的方法。电子部件可以沉积和修整成精确或匹配的值，而不会精确沉积所有预图案化材料。薄膜电子部件沉积在表面上，测量或估计参数值，产生校正偏移文件，并且使用适应光刻将组件修剪到非常接近的公差。可以使用计算机程序来实现电子部件的调整，例如改变电感线圈或电阻器引线的物理长度，或者改变电容器板面积。

10. 发明授权

US5872040A Method for fabricating a thin film capacitor 失效
标题翻译：薄膜电容器的制造方法
公开(公告)号：US5872040A
公开(公告)日：1999-02-16
申请号：US862994
申请日：1997-05-27
申请人： Robert John Wojnarowski , James Wilson Rose , Ernest Wayne Balch , Leonard Richard Douglas , Evan Taylor Downey , Michael Gdula
发明人： Robert John Wojnarowski , James Wilson Rose , Ernest Wayne Balch , Leonard Richard Douglas , Evan Taylor Downey , Michael Gdula
IPC分类号： H01C17/12 , H01C17/24 , H01G4/06 , H01G4/08 , H05K1/16 , H01L21/20
CPC分类号： H01C17/24 , H01C17/12 , H01C17/2416 , H01G4/06 , H01G4/08 , H05K1/167 , Y10S148/136
摘要： A method is provided for the manufacture of precision electronic components such as resistors, inductors, and capacitors on a polymer or ceramic surface. The electronic components can be deposited and trimmed to precise or matched values without having precise depositions of all of the pre-patterned materials. Thin film electronic components are deposited on a surface, parameter values are measured or estimated, a correction offset file is generated, and the components are trimmed using adaptive lithography to a very close tolerance. A computer program can be used to enable the adjustment of electronic components by techniques such as changing the physical length of an inductor coil or resistor lead, or by changing a capacitor plate area.
摘要翻译：提供了一种用于在聚合物或陶瓷表面上制造诸如电阻器，电感器和电容器的精密电子部件的方法。电子部件可以沉积和修整成精确或匹配的值，而不会精确沉积所有预图案化材料。薄膜电子部件沉积在表面上，测量或估计参数值，产生校正偏移文件，并且使用适应光刻将组件修剪到非常接近的公差。可以使用计算机程序来实现电子部件的调整，例如改变电感线圈或电阻器引线的物理长度，或者改变电容器板面积。

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