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1. 发明授权

US5353498A Method for fabricating an integrated circuit module 失效
标题翻译：集成电路模块的制造方法
公开(公告)号：US5353498A
公开(公告)日：1994-10-11
申请号：US87434
申请日：1993-07-09
申请人： Raymond A. Fillion , Robert J. Wojnarowski , Michael Gdula , Herbert S. Cole , Eric J. Wildi , Wolfgang Daum
发明人： Raymond A. Fillion , Robert J. Wojnarowski , Michael Gdula , Herbert S. Cole , Eric J. Wildi , Wolfgang Daum
IPC分类号： H01L23/52 , H01L21/56 , H01L21/58 , H01L21/68 , H01L23/29 , H01L23/433 , H01L23/538 , H01L25/04 , H01L25/065 , H01L25/18 , H05K3/34
CPC分类号： H01L21/568 , H01L21/6835 , H01L23/293 , H01L23/295 , H01L23/4334 , H01L23/538 , H01L23/5389 , H01L24/24 , H01L24/29 , H01L24/82 , H01L24/83 , H01L24/96 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/04105 , H01L2224/2402 , H01L2224/24137 , H01L2224/24195 , H01L2224/2518 , H01L2224/2919 , H01L2224/82039 , H01L2224/83192 , H01L2224/8385 , H01L2225/06517 , H01L2225/0652 , H01L2225/06524 , H01L2225/06541 , H01L2225/06551 , H01L2225/06589 , H01L2225/1035 , H01L2225/1058 , H01L2225/1064 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/49144
摘要： Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate molding material is added within the mold form, and the substrate molding material is then hardened. A dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and the faces of the chips. A thermal plug may be affixed to the backside of a chip before substrate molding material is added. A connector frame may be placed on the adhesive layer before substrate molding material is added. A dielectric layer may be placed over the backsides of the chips before the substrate molding material is added to enhance repairability. A portion of the chips and substrate molding material may be removed after the substrate molding material is hardened.
摘要翻译：基板材料直接模制到半导体芯片和其他用于集成电路模块制造的电气部件。具有接触垫的芯片面朝下放置在由基底支撑的粘合剂层上。模具周围位于芯片周围。在模具形式中加入基材成型材料，然后将基材成型材料硬化。具有与预定接触焊盘对准的通孔并具有延伸通过通孔的电导体的通孔的电介质层位于硬化的基底成型材料和芯片的表面上。在添加基板模制材料之前，可以将热塞固定到芯片的背面。在添加基材模塑材料之前，连接器框架可以放置在粘合剂层上。在添加基底成型材料之前，可以将电介质层放置在芯片的背面上以增强可修复性。芯片和基材成型材料的一部分可以在基材模塑材料硬化之后被去除。

2. 发明授权

US5849623A Method of forming thin film resistors on organic surfaces 失效
标题翻译：在有机表面上形成薄膜电阻的方法
公开(公告)号：US5849623A
公开(公告)日：1998-12-15
申请号：US862672
申请日：1997-05-23
申请人： Robert John Wojnarowski , James Wilson Rose , Kyung Wook Paik , Michael Gdula
发明人： Robert John Wojnarowski , James Wilson Rose , Kyung Wook Paik , Michael Gdula
IPC分类号： H01C1/032 , H01C7/00 , H01C17/075 , H01L23/538 , H05K1/02 , H05K1/16 , H05K3/38 , H01L21/20
CPC分类号： H05K1/167 , H01C1/032 , H01C17/075 , H01C7/006 , H01L2224/73204 , H01L2224/82039 , H01L23/5389 , H01L2924/01077 , H05K1/0268 , H05K2201/0317 , H05K2203/0361 , H05K2203/171 , H05K3/388 , Y10S148/136 , Y10T29/49101
摘要： A method for fabricating a thin film resistor comprises applying a tantalum nitride layer over a dielectric layer, applying a metallization layer over the tantalum nitride layer, and patterning the metallization layer with a first portion of the metallization layer situated apart from a second portion of the metallization layer and both the first and second portions being at least partially situated on the tantalum nitride layer. In one embodiment, after patterning the metallization layer, the resistance value between the first and second portions of the metallization layer is determined and compared to a predetermined resistance value, and at least one of the first and second portions is trimmed to obtain a modified resistance value between the first and second portions that is closer to the predetermined resistance value than the determined resistance value.
摘要翻译：一种用于制造薄膜电阻器的方法包括在介电层上施加氮化钽层，在氮化钽层上施加金属化层，以及使金属化层的第一部分与金属化层的第二部分分开，金属化层，并且第一和第二部分至少部分地位于氮化钽层上。在一个实施例中，在图案化金属化层之后，确定金属化层的第一和第二部分之间的电阻值并将其与预定电阻值进行比较，并且修剪第一和第二部分中的至少一个以获得改良电阻第一和第二部分之间的值比所确定的电阻值更接近于预定电阻值。

3. 发明授权

US5381445A Munitions cartridge transmitter 失效
标题翻译：弹药筒式变送器
公开(公告)号：US5381445A
公开(公告)日：1995-01-10
申请号：US55473
申请日：1993-05-03
申请人： John E. Hershey , Menahem Lowy , Lionel M. Levinson , Amer A. Hassan , Richard L. Frey , Kenneth B. Welles, II , Michael Gdula , Robert J. Wojnarowski
发明人： John E. Hershey , Menahem Lowy , Lionel M. Levinson , Amer A. Hassan , Richard L. Frey , Kenneth B. Welles, II , Michael Gdula , Robert J. Wojnarowski
IPC分类号： F42B12/36 , G01S5/00 , G01S5/06 , H04L27/30
CPC分类号： G01S5/0009 , F42B12/36 , F42B12/365 , G01S5/06
摘要： A munitions cartridge transmitter capable of emitting an electromagnetic signal after discharge from a cartridge propelling device comprises a signal generator, an electromagnetic signal transmitter coupled to the generator, an antenna coupled to the transmitter, and a hollow cartridge for housing the generator, the transmitter, and the antenna. The transmitter is energized after discharge of the cartridge propelling device by a power source contained in the cartridge.
摘要翻译：一种能够在从暗盒推进装置排放之后发出电磁信号的弹药盒式发射器包括信号发生器，耦合到发生器的电磁信号发射器，耦合到发射器的天线以及用于容纳发生器的中空滤芯，和天线。在通过盒中包含的电源将墨盒驱动装置排出之后，变送器通电。

4. 发明授权

US4845608A Digital speed controller using a single-chip microcontroller 失效
标题翻译：使用单片微控制器的数字调速控制器
公开(公告)号：US4845608A
公开(公告)日：1989-07-04
申请号：US135961
申请日：1987-12-21
申请人： Michael Gdula
发明人： Michael Gdula
IPC分类号： H02P23/00
CPC分类号： H02P23/22 , Y10S388/912 , Y10S388/933
摘要： A speed regulator digital speed controller for rotating machinery is comprised of a single-chip microcontroller operating in conjunction with a multiple counter/time peripheral, and is programmed in a high level language. Pulses are generated by a digital speed sensor at a rate too low to give the required speed resolution; these pulses are counted and a preset number toggles a binary gate signal. Two clock counters both having an input connected to a high reference frequency oscillator are gated alternately and accumulate a count depending on the length of the gated on interval. These speed related counts are read during alternating gated off intervals into the microcontroller where the speed error is calculated in real time to a high degree of accuracy and resolution. The speed of an electric motor and a steam turbine, for instance, are regulated.
摘要翻译：用于旋转机械的速度调节器数字速度控制器包括与多个计数器/时间外设结合使用的单片微控制器，并以高级语言编程。脉冲由数字速度传感器以太低的速率产生，无法提供所需的速度分辨率; 这些脉冲被计数，并且预设的数字切换二进制门信号。具有连接到高参考频率振荡器的输入的两个时钟计数器交替地选通，并且根据门控的间隔的长度累积计数。这些速度相关计数在交替的选通间隔期间被读取到微控制器中，其中速度误差被实时计算到高精度和分辨率。例如，电动机和蒸汽轮机的速度被调节。

5. 发明授权

US6040226A Method for fabricating a thin film inductor 有权
标题翻译：薄膜电感器的制造方法
公开(公告)号：US6040226A
公开(公告)日：2000-03-21
申请号：US177908
申请日：1998-10-23
申请人： Robert John Wojnarowski , James Wilson Rose , Ernest Wayne Balch , Leonard Richard Douglas , Evan Taylor Downey , Michael Gdula
发明人： Robert John Wojnarowski , James Wilson Rose , Ernest Wayne Balch , Leonard Richard Douglas , Evan Taylor Downey , Michael Gdula
IPC分类号： H01L21/20
CPC分类号： H01L21/20
摘要： A method is provided for the manufacture of precision electronic components such as resistors, inductors, and capacitors on a polymer or ceramic surface. The electronic components can be deposited and trimmed to precise or matched values without having precise depositions of all of the pre-patterned materials. Thin film electronic components are deposited on a surface, parameter values are measured or estimated, a correction offset file is generated, and the components are trimmed using adaptive lithography to a very close tolerance. A computer program can be used to enable the adjustment of electronic components by techniques such as changing the physical length of an inductor coil or resistor lead, or by changing a capacitor plate area.
摘要翻译：提供了一种用于在聚合物或陶瓷表面上制造诸如电阻器，电感器和电容器的精密电子部件的方法。电子部件可以沉积和修整成精确或匹配的值，而不会精确沉积所有预图案化材料。薄膜电子部件沉积在表面上，测量或估计参数值，产生校正偏移文件，并且使用适应光刻将组件修剪到非常接近的公差。可以使用计算机程序来实现电子部件的调整，例如改变电感线圈或电阻器引线的物理长度，或者改变电容器板面积。

6. 发明授权

US5872040A Method for fabricating a thin film capacitor 失效
标题翻译：薄膜电容器的制造方法
公开(公告)号：US5872040A
公开(公告)日：1999-02-16
申请号：US862994
申请日：1997-05-27
申请人： Robert John Wojnarowski , James Wilson Rose , Ernest Wayne Balch , Leonard Richard Douglas , Evan Taylor Downey , Michael Gdula
发明人： Robert John Wojnarowski , James Wilson Rose , Ernest Wayne Balch , Leonard Richard Douglas , Evan Taylor Downey , Michael Gdula
IPC分类号： H01C17/12 , H01C17/24 , H01G4/06 , H01G4/08 , H05K1/16 , H01L21/20
CPC分类号： H01C17/24 , H01C17/12 , H01C17/2416 , H01G4/06 , H01G4/08 , H05K1/167 , Y10S148/136
摘要： A method is provided for the manufacture of precision electronic components such as resistors, inductors, and capacitors on a polymer or ceramic surface. The electronic components can be deposited and trimmed to precise or matched values without having precise depositions of all of the pre-patterned materials. Thin film electronic components are deposited on a surface, parameter values are measured or estimated, a correction offset file is generated, and the components are trimmed using adaptive lithography to a very close tolerance. A computer program can be used to enable the adjustment of electronic components by techniques such as changing the physical length of an inductor coil or resistor lead, or by changing a capacitor plate area.
摘要翻译：提供了一种用于在聚合物或陶瓷表面上制造诸如电阻器，电感器和电容器的精密电子部件的方法。电子部件可以沉积和修整成精确或匹配的值，而不会精确沉积所有预图案化材料。薄膜电子部件沉积在表面上，测量或估计参数值，产生校正偏移文件，并且使用适应光刻将组件修剪到非常接近的公差。可以使用计算机程序来实现电子部件的调整，例如改变电感线圈或电阻器引线的物理长度，或者改变电容器板面积。

7. 发明授权

US5683928A Method for fabricating a thin film resistor 失效
标题翻译：制造薄膜电阻的方法
公开(公告)号：US5683928A
公开(公告)日：1997-11-04
申请号：US349278
申请日：1994-12-05
申请人： Robert John Wojnarowski , James Wilson Rose , Ernest Wayne Balch , Leonard Richard Douglas , Evan Taylor Downey , Michael Gdula
发明人： Robert John Wojnarowski , James Wilson Rose , Ernest Wayne Balch , Leonard Richard Douglas , Evan Taylor Downey , Michael Gdula
IPC分类号： H01C17/12 , H01C17/24 , H01G4/06 , H01G4/08 , H05K1/16 , H01L21/70
CPC分类号： H01C17/24 , H01C17/12 , H01C17/2416 , H01G4/06 , H01G4/08 , H05K1/167 , Y10S148/136
摘要： A method is provided for the manufacture of precision electronic components such as resistors, inductors, and capacitors on a polymer or ceramic surface. The electronic components can be deposited and trimmed to precise or matched values without having precise depositions of all of the pre-patterned materials. Thin film electronic components are deposited on a surface, parameter values are measured or estimated, a correction offset file is generated, and the components are trimmed using adaptive lithography to a very close tolerance. A computer program can be used to enable the adjustment of electronic components by techniques such as changing the physical length of an inductor coil or resistor lead, or by changing a capacitor plate area.
摘要翻译：提供了一种用于在聚合物或陶瓷表面上制造诸如电阻器，电感器和电容器的精密电子部件的方法。电子部件可以沉积和修整成精确或匹配的值，而不会精确沉积所有预图案化材料。薄膜电子部件沉积在表面上，测量或估计参数值，产生校正偏移文件，并且使用适应光刻将组件修剪到非常接近的公差。可以使用计算机程序来实现电子部件的调整，例如改变电感线圈或电阻器引线的物理长度，或者改变电容器板面积。

8. 发明授权

US5366906A Wafer level integration and testing 失效
标题翻译：晶圆级集成和测试
公开(公告)号：US5366906A
公开(公告)日：1994-11-22
申请号：US962000
申请日：1992-10-16
申请人： Robert J. Wojnarowski , Constantine A. Neugebauer , Wolfgang Daum , Bernard Gorowitz , Eric J. Wildi , Michael Gdula , Stanton E. Weaver, Jr. , Anthony A. Immorlica, Jr.
发明人： Robert J. Wojnarowski , Constantine A. Neugebauer , Wolfgang Daum , Bernard Gorowitz , Eric J. Wildi , Michael Gdula , Stanton E. Weaver, Jr. , Anthony A. Immorlica, Jr.
IPC分类号： G01R31/3185 , H01L21/301 , H01L21/66 , H01L23/538 , H01L23/58 , G01R31/26
CPC分类号： H01L22/22 , H01L22/32 , H01L23/5389 , H01L24/24 , H01L24/82 , G01R31/318505 , G01R31/318533 , H01L2224/2402 , H01L2224/24137 , H01L2224/24227 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/351
摘要： In fabricating wafer scale integrated interconnects, a temporary or permanent dielectric layer and a pattern of electrical conductors are used to provide wafer scale integration or testing and burn-in. A resist can be used to cover the areas of IC pads on the wafer while the remainder of the pattern of electrical conductors is removed to provide for repair of the wafer scale integration structure. The pattern of electrical conductors may be configured so that the conductor lengths between at least some sub-circuits on a plurality of wafers are substantially electrically equal for signal propagation purposes; an additional wafer may be laminated to the wafer using an adhesive; controlled curfs may be cut into the wafer; and the wafer may be interconnected to an interface ring.
摘要翻译：在制造晶片级集成互连件时，使用临时或永久的电介质层和电导体图案来提供晶片级整合或测试和老化。可以使用抗蚀剂来覆盖晶片上的IC焊盘的区域，而去除电导体图案的其余部分以提供晶片级整合结构的修复。电导体的图案可以被配置为使得在多个晶片上的至少一些子电路之间的导体长度对于信号传播目的而基本上是电相等的; 可以使用粘合剂将另外的晶片层压到晶片上; 受控的曲折可以被切入晶片; 并且晶片可以互连到接口环。

9. 发明授权

US4649511A Dynamic memory controller for single-chip microprocessor 失效
标题翻译：用于单片微处理器的动态存储控制器
公开(公告)号：US4649511A
公开(公告)日：1987-03-10
申请号：US516620
申请日：1983-07-25
申请人： Michael Gdula
发明人： Michael Gdula
IPC分类号： G06F9/48 , G11C11/406 , G06F12/00
CPC分类号： G06F9/4825 , G11C11/406
摘要： A controller for interfacing a single-chip microcomputer with external dynamic random-access memory, includes a subcircuit for generating a column-address strobe at a time after a row-address strobe is generated, and also includes a multiplexing subcircuit for providing the proper 8-bit portion of a 16-bit address output from the microprocessor to the 8-bit dynamic memory inputs, prior to receipt of the associated row-address or column-address strobe. The microprocessor utilizes the strobe-generation and multiplexing subcircuits to burst-refresh the dynamic memory, in one presently preferred embodiment. In another presently preferred embodiment, lines from an additional microprocessor output port are utilized with a resettable binary counter and a multiplicity of buffers, to count through the range of row addresses in cyclic fashion, with each address being incremented after the previously-addressed row of memory cells has been refreshed.
摘要翻译：用于将单片微机与外部动态随机存取存储器连接的控制器包括用于在产生行地址选通之后的时间产生列地址选通的子电路，并且还包括用于提供正确的8 在接收相关联的行地址或列地址选通之前，从微处理器输出到8位动态存储器输入的16位地址的位部分。在一个当前优选的实施例中，微处理器利用选通产生和多路复用子电路来突发刷新动态存储器。在另一个当前优选的实施例中，来自附加微处理器输出端口的线路与可复位的二进制计数器和多个缓冲器一起使用，以循环方式对行地址的范围进行计数，每个地址在先前寻址的行内存单元已刷新。

10. 发明授权

US5675310A Thin film resistors on organic surfaces 失效
标题翻译：有机表面上的薄膜电阻
公开(公告)号：US5675310A
公开(公告)日：1997-10-07
申请号：US349228
申请日：1994-12-05
申请人： Robert John Wojnarowski , James Wilson Rose , Kyung Wook Paik , Michael Gdula
发明人： Robert John Wojnarowski , James Wilson Rose , Kyung Wook Paik , Michael Gdula
IPC分类号： H01C1/032 , H01C7/00 , H01C17/075 , H01L23/538 , H05K1/02 , H05K1/16 , H05K3/38 , H01C1/012 , H01L27/00
CPC分类号： H05K1/167 , H01C1/032 , H01C17/075 , H01C7/006 , H01L2224/73204 , H01L2224/82039 , H01L23/5389 , H01L2924/01077 , H05K1/0268 , H05K2201/0317 , H05K2203/0361 , H05K2203/171 , H05K3/388 , Y10S148/136 , Y10T29/49101
摘要： A method for fabricating a thin film resistor comprises applying a tantalum nitride layer over a dielectric layer, applying a metallization layer over the tantalum nitride layer, and patterning the metallization layer with a first portion of the metallization layer situated apart from a second portion of the metallization layer and both the first and second portions being at least partially situated on the tantalum nitride layer. In one embodiment, after patterning the metallization layer, the resistance value between the first and second portions of the metallization layer is determined and compared to a predetermined resistance value, and at least one of the first and second portions is trimmed to obtain a modified resistance value between the first and second portions that is closer to the predetermined resistance value than the determined resistance value.
摘要翻译：一种用于制造薄膜电阻器的方法包括在介电层上施加氮化钽层，在氮化钽层上施加金属化层，以及使金属化层的第一部分与金属化层的第二部分分开，金属化层，并且第一和第二部分至少部分地位于氮化钽层上。在一个实施例中，在图案化金属化层之后，确定金属化层的第一和第二部分之间的电阻值并将其与预定电阻值进行比较，并且修剪第一和第二部分中的至少一个以获得改良电阻第一和第二部分之间的值比所确定的电阻值更接近于预定电阻值。

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