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    • 1. 发明授权
    • Method for fabricating semiconductor device
    • 制造半导体器件的方法
    • US08609544B2
    • 2013-12-17
    • US13336238
    • 2011-12-23
    • Sung Koo Lee
    • Sung Koo Lee
    • H01L21/311
    • H01L21/0273H01L21/0338H01L21/31144H01L21/32139H01L28/92
    • A method for fabricating a semiconductor device, comprising forming a first photoresist pattern having a hole on a first layer, forming a surface curing layer in the hole and curing the first photoresist pattern on an inner sidewall of the hole to form a first curing pattern, removing the surface curing layer, forming a second photoresist pattern in the hole and curing the second photoresist pattern that contacts with the first curing pattern to form a second curing pattern, removing the first and second photoresist patterns, and etching the first layer using the first and second curing patterns as an etch barrier.
    • 一种制造半导体器件的方法,包括在第一层上形成具有孔的第一光致抗蚀剂图案,在孔中形成表面固化层,并使孔的内侧壁上的第一光致抗蚀剂图案固化以形成第一固化图案, 去除所述表面固化层,在所述孔中形成第二光致抗蚀剂图案并固化与所述第一固化图案接触的所述第二光致抗蚀剂图案以形成第二固化图案,除去所述第一和第二光致抗蚀剂图案,以及使用所述第一固化层蚀刻所述第一层 和第二固化图案作为蚀刻屏障。
    • 8. 发明申请
    • METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20120244713A1
    • 2012-09-27
    • US13336238
    • 2011-12-23
    • Sung Koo LEE
    • Sung Koo LEE
    • H01L21/311
    • H01L21/0273H01L21/0338H01L21/31144H01L21/32139H01L28/92
    • A method for fabricating a semiconductor device, comprising forming a first photoresist pattern having a hole on a first layer, forming a surface curing layer in the hole and curing the first photoresist pattern on an inner sidewall of the hole to form a first curing pattern, removing the surface curing layer, forming a second photoresist pattern in the hole and curing the second photoresist pattern that contacts with the first curing pattern to form a second curing pattern, removing the first and second photoresist patterns, and etching the first layer using the first and second curing patterns as an etch barrier.
    • 一种制造半导体器件的方法,包括在第一层上形成具有孔的第一光致抗蚀剂图案,在孔中形成表面固化层,并使孔的内侧壁上的第一光致抗蚀剂图案固化以形成第一固化图案, 去除所述表面固化层,在所述孔中形成第二光致抗蚀剂图案并固化与所述第一固化图案接触的所述第二光致抗蚀剂图案以形成第二固化图案,除去所述第一和第二光致抗蚀剂图案,以及使用所述第一固化层蚀刻所述第一层 和第二固化图案作为蚀刻屏障。
    • 9. 发明申请
    • Method for Manufacturing a Semiconductor Device
    • 半导体器件的制造方法
    • US20100173249A1
    • 2010-07-08
    • US12728979
    • 2010-03-22
    • Jae Chang JungSung Koo Lee
    • Jae Chang JungSung Koo Lee
    • G03F7/20
    • G03F7/2041G03F7/38
    • Disclosed herein is a composition for removing an immersion lithography solution. The composition includes an organic solvent and an acid compound. Also disclosed is a method for manufacturing a semiconductor device including an immersion lithography process. When a photoresist pattern is formed by the immersion lithography process, an exposure process is performed on a photoresist film formed over an underlying layer with an immersion lithography exposer. Then, the composition is dripped over the wafer to remove residual immersion lithography solution on the photoresist film, thereby improving a water mark defect phenomenon.
    • 本文公开了一种用于去除浸没式光刻溶液的组合物。 该组合物包括有机溶剂和酸化合物。 还公开了一种制造包括浸没式光刻工艺的半导体器件的方法。 当通过浸没光刻工艺形成光致抗蚀剂图案时,利用浸没式光刻曝光器对形成在下层上的光致抗蚀剂膜进行曝光处理。 然后,将组合物滴在晶片上以除去光致抗蚀剂膜上的残留浸没光刻溶液,从而改善水痕缺陷现象。