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1. 发明授权

US08880210B2 Methods and apparatus for processing substrates using model-based control 有权
标题翻译：使用基于模型的控制处理基板的方法和装置
公开(公告)号：US08880210B2
公开(公告)日：2014-11-04
申请号：US13183520
申请日：2011-07-15
申请人： Keith Brian Porthouse , John W. Lane , Mariusch Gregor , Nir Merry , Michael R. Rice , Alex Minkovich , Hongbin Li , Dmitry A. Dzilno
发明人： Keith Brian Porthouse , John W. Lane , Mariusch Gregor , Nir Merry , Michael R. Rice , Alex Minkovich , Hongbin Li , Dmitry A. Dzilno
IPC分类号： G06F19/00 , G05B17/02 , H01L21/67 , G05D16/20
CPC分类号： G05D16/2046 , G05B17/02 , H01L21/67017 , H01L21/67253
摘要： Methods and apparatus are disclosed herein. In some embodiments, methods of controlling process chambers may include predetermining a relationship between pressure in a processing volume and a position of an exhaust valve as a function of a process parameter; setting the process chamber to a first state having a first pressure in the processing volume and a first value of the process parameter, wherein the exhaust valve is set to a first position based on the predetermined relationship to produce the first pressure at the first value; determining a pressure control profile to control the pressure as the process chamber is changed to a second state having a second pressure and a second process parameter value from the first state; and applying the pressure control profile to control the pressure by varying the position of the exhaust valve while changing the process chamber to the second state.
摘要翻译：本文公开了方法和装置。在一些实施例中，控制处理室的方法可以包括根据处理参数预先确定处理容积中的压力与排气门的位置之间的关系; 将所述处理室设定为处理容积中具有第一压力的第一状态和所述处理参数的第一值，其中所述排气阀基于所述预定关系设定在第一位置以产生所述第一值的所述第一压力; 当所述处理室改变为具有来自所述第一状态的第二压力和第二过程参数值的第二状态时，确定压力控制曲线以控制所述压力; 以及通过在将处理室改变到第二状态的同时改变排气门的位置来施加压力控制曲线来控制压力。

2. 发明申请

US20130043632A1 RAPID THERMAL PROCESSING CHAMBER WITH MICRO-POSITIONING SYSTEM 有权
公开(公告)号：US20130043632A1
公开(公告)日：2013-02-21
申请号：US13656150
申请日：2012-10-19
申请人： Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunter , Blake R. Koelmel , Alexander N. Lemer , Nir Merry
发明人： Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunter , Blake R. Koelmel , Alexander N. Lemer , Nir Merry
IPC分类号： B23Q1/25
CPC分类号： H01L21/67259 , C23C16/46 , H01L21/324 , H01L21/67115 , H01L21/68 , H01L21/681 , H01L21/6835 , H01L21/68742
摘要： Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.

3. 发明申请

US20130043235A1 RAPID THERMAL PROCESSING CHAMBER WITH MICRO-POSITIONING SYSTEM 有权
标题翻译：具有微定位系统的快速热处理室
公开(公告)号：US20130043235A1
公开(公告)日：2013-02-21
申请号：US13656158
申请日：2012-10-19
申请人： Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunter , Blake R. Koelmel , Alexander N. Lerner , Nir Merry
发明人： Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunter , Blake R. Koelmel , Alexander N. Lerner , Nir Merry
IPC分类号： F27D11/00
CPC分类号： H01L21/67259 , C23C16/46 , H01L21/324 , H01L21/67115 , H01L21/68 , H01L21/681 , H01L21/6835 , H01L21/68742
摘要： Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.
摘要翻译：描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。

4. 发明申请

US20120322240A1 DAMAGE ISOLATION BY SHAPED BEAM DELIVERY IN LASER SCRIBING PROCESS 有权
标题翻译：通过激光扫描过程中的形状光束传递损坏隔离
公开(公告)号：US20120322240A1
公开(公告)日：2012-12-20
申请号：US13161424
申请日：2011-06-15
申请人： James M. HOLDEN , Nir Merry , Todd Egan
发明人： James M. HOLDEN , Nir Merry , Todd Egan
IPC分类号： H01L21/82 , C23F1/08 , H01L21/3065
CPC分类号： B23K26/0635 , B23K26/0624 , B23K26/364 , B23K26/40 , B23K2103/172 , B23K2103/42 , B23K2103/50 , H01J37/32889 , H01J2237/332 , H01J2237/334 , H01L21/30655 , H01L21/67069 , H01L21/67196 , H01L21/67207 , H01L21/78
摘要： Methods and apparatuses for dicing substrates by both laser scribing and plasma etching. A method includes laser ablating material layers, the ablating by a laser beam with a centrally peaked spatial power profile to form an ablated trench in the substrate below thin film device layers which is positively sloped. In an embodiment, a femtosecond laser forms a positively sloped ablation profile which facilitates vertically-oriented propagation of microcracks in the substrate at the ablated trench bottom. With minimal lateral runout of microcracks, a subsequent anisotropic plasma etch removes the microcracks for a cleanly singulated chip with good reliability.
摘要翻译：通过激光划线和等离子体蚀刻对基板进行切割的方法和装置。一种方法包括激光烧蚀材料层，用具有中心峰值空间功率分布的激光束进行烧蚀，以在正向倾斜的薄膜器件层下面的衬底中形成消融沟槽。在一个实施例中，飞秒激光形成正倾斜的消融轮廓，其有利于在烧蚀的沟槽底部处的衬底中的微裂纹的垂直取向传播。随着微裂纹的侧向跳动最小，随后的各向异性等离子体蚀刻可以清除具有良好可靠性的干净分割芯片的微裂纹。

5. 发明申请

US20100224130A1 ROTATING SUBSTRATE SUPPORT AND METHODS OF USE 审中-公开
标题翻译：旋转基板支持和使用方法
公开(公告)号：US20100224130A1
公开(公告)日：2010-09-09
申请号：US12779904
申请日：2010-05-13
申请人： Jacob Smith , Alexander Tam , R. Suryanarayanan Iyer , Sean Seutter , Binh Tran , Nir Merry , Adam Brailove , Robert Shydo, JR. , Robert Andrews , Frank Roberts , Theodore Smick , Geoffrey Ryding
发明人： Jacob Smith , Alexander Tam , R. Suryanarayanan Iyer , Sean Seutter , Binh Tran , Nir Merry , Adam Brailove , Robert Shydo, JR. , Robert Andrews , Frank Roberts , Theodore Smick , Geoffrey Ryding
IPC分类号： H01L21/46
CPC分类号： H01L21/68792 , C23C16/4584 , H01L21/67126 , H01L21/68742
摘要： A method and apparatus for processing a substrate utilizing a rotating substrate support are disclosed herein. In one embodiment, an apparatus for processing a substrate includes a chamber having a substrate support assembly disposed within the chamber. The substrate support assembly includes a substrate support having a support surface and a heater disposed beneath the support surface. A shaft is coupled to the substrate support and a motor is coupled to the shaft through a rotor to provide rotary movement to the substrate support. A seal block is disposed around the rotor and forms a seal therewith. The seal block has at least one seal and at least one channel disposed along the interface between the seal block and the shaft. A port is coupled to each channel for connecting to a pump. A lift mechanism is coupled to the shaft for raising and lowering the substrate support.
摘要翻译：本文公开了一种利用旋转衬底支撑件来处理衬底的方法和装置。在一个实施例中，用于处理衬底的装置包括具有设置在腔室内的衬底支撑组件的室。衬底支撑组件包括具有支撑表面的衬底支撑件和设置在支撑表面下方的加热器。轴联接到基板支撑件，并且电机通过转子联接到轴，以向基板支撑件提供旋转运动。密封块设置在转子周围并与其形成密封。密封块具有至少一个密封件和沿密封块和轴之间的界面设置的至少一个通道。端口连接到每个通道以连接到泵。升降机构联接到轴上以升高和降低基板支撑。

6. 发明申请

US20100047049A1 VERTICAL WAFER BUFFERING SYSTEM 有权
标题翻译：垂直波浪缓冲系统
公开(公告)号：US20100047049A1
公开(公告)日：2010-02-25
申请号：US12196982
申请日：2008-08-22
申请人： NIR MERRY , Jacob Newman
发明人： NIR MERRY , Jacob Newman
IPC分类号： B65H1/00
CPC分类号： H01L21/67769 , Y10S414/14
摘要： A wafer buffering system is provided herein. In some embodiments, a wafer buffering system may include a frame having a vertical shaft disposed therethrough; two storage platforms, coupled to the frame on either side thereof, each to receive a wafer carrier thereon; and a transfer mechanism coupled to the vertical shaft and capable of vertical movement therealong and lateral movement along an x-axis extending in either direction from the frame at least sufficient to move over the two storage platforms. The transfer mechanism may further include a telescoping fork arm capable of laterally extending in a first direction and in a second direction corresponding to lateral positions of the two storage platforms on either side of the frame.
摘要翻译：本文提供了晶片缓冲系统。在一些实施例中，晶片缓冲系统可以包括具有穿过其设置的垂直轴的框架; 两个存储平台，耦合到其两侧的框架，每个用于在其上接收晶片载体; 以及耦合到所述竖直轴并且能够沿着所述竖直轴的垂直移动的转移机构，以及沿着从所述框架沿任一方向延伸的x轴的横向移动至少足以在所述两个存储平台上移动。传送机构还可以包括能够在第一方向和第二方向上横向延伸的伸缩叉臂，对应于框架两侧的两个存储平台的横向位置。

7. 发明申请

US20080025368A1 TEMPERATURE UNIFORMITY MEASUREMENTS DURING RAPID THERMAL PROCESSING 有权
标题翻译：在快速热处理期间的温度均匀度测量
公开(公告)号：US20080025368A1
公开(公告)日：2008-01-31
申请号：US11830845
申请日：2007-07-30
申请人： WOLFGANG ADERHOLD , Andreas Hegedus , Nir Merry
发明人： WOLFGANG ADERHOLD , Andreas Hegedus , Nir Merry
IPC分类号： G01J5/00
CPC分类号： G01J5/0022 , G01J2005/0081
摘要： Methods and apparatus for measuring substrate uniformity is provided. The invention includes placing a substrate in a thermal processing chamber, rotating the substrate while the substrate is heated, measuring a temperature of the substrate at a plurality of radial locations as the substrate rotates, correlating each temperature measurement with a location on the substrate, and generating a temperature contour map for the substrate based on the correlated temperature measurements. Numerous other aspects are provided.
摘要翻译：提供了测量基板均匀性的方法和装置。本发明包括将衬底放置在热处理室中，在衬底被加热的同时旋转衬底，在衬底旋转时在多个径向位置测量衬底的温度，使每个温度测量与衬底上的位置相关，以及基于相关的温度测量产生用于衬底的温度轮廓图。提供了许多其他方面。

8. 发明授权

US5706190A Fault-tolerant HVAC system 失效
标题翻译：容错HVAC系统
公开(公告)号：US5706190A
公开(公告)日：1998-01-06
申请号：US623047
申请日：1996-03-28
申请人： Robert M. Russ , Larry A. Lincoln , Nir Merry
发明人： Robert M. Russ , Larry A. Lincoln , Nir Merry
IPC分类号： G01D4/00 , G05D23/19 , G06F19/00
CPC分类号： G01D4/006 , G01D4/004 , G05D23/1917 , Y02B70/3275 , Y02B90/242 , Y02B90/243 , Y04S20/244 , Y04S20/322 , Y04S20/325
摘要： A fault-tolerant HVAC system for use in a single or multi-zoned system, capable of continued operation in the event of a thermostat, or other sensing device malfunction. An HVAC controller controls the operation of an HVAC unit in accordance with a temperature signal output from the thermostat and indicative of air temperature of a conditioned space proximate the thermostat. The HVAC controller detects a thermostat malfunction and, in response thereto, instead controls the operation of the HVAC unit in accordance with a temperature sensor outputting a signal indicative of return air temperature from the conditioned space.
摘要翻译：用于单区域或多区域系统的容错HVAC系统，能够在恒温器的情况下继续运行或其他感测设备故障。 HVAC控制器根据从恒温器输出的温度信号控制HVAC单元的操作，并指示靠近恒温器的调节空间的空气温度。 HVAC控制器检测恒温器故障，并且响应于此，根据温度传感器控制HVAC单元的操作，温度传感器从调节空间输出指示返回空气温度的信号。

9. 发明授权

US4946460A Apparatus for cryosurgery 失效
标题翻译：冷冻手术器械
公开(公告)号：US4946460A
公开(公告)日：1990-08-07
申请号：US343950
申请日：1989-04-26
申请人： Nir Merry , Michael Smidebush
发明人： Nir Merry , Michael Smidebush
IPC分类号： A61B17/00 , A61B18/00 , A61B18/02
CPC分类号： A61B18/02 , A61B2017/00084 , A61B2017/00092 , A61B2017/00464 , A61B2018/00041 , A61B2018/00095 , A61B2018/0281
摘要： An apparatus for cryosurgery having the ability to precisely control the rate and degree of freezing of diseased tissue by means of a cryoprobe having a plurality of removable cryotips, and a compensating temperature control system operably associated with the cryoprobe.

10. 发明申请

US20150217401A1 DAMAGE ISOLATION BY SHAPED BEAM DELIVERY IN LASER SCRIBING PROCESS 审中-公开
标题翻译：通过激光扫描过程中的形状光束传递损坏隔离
公开(公告)号：US20150217401A1
公开(公告)日：2015-08-06
申请号：US14684290
申请日：2015-04-10
申请人： James M. HOLDEN , Nir MERRY , Todd EGAN
发明人： James M. HOLDEN , Nir MERRY , Todd EGAN
IPC分类号： B23K26/06 , B23K26/40 , B23K26/36 , H01L21/67 , H01J37/32
CPC分类号： H01L21/67196 , B23K26/0624 , B23K26/364 , B23K26/40 , B23K2103/172 , B23K2103/42 , B23K2103/50 , H01J37/32889 , H01J2237/332 , H01J2237/334 , H01L21/30655 , H01L21/67069 , H01L21/67207 , H01L21/78
摘要： Methods and apparatuses for dicing substrates by both laser scribing and plasma etching. A method includes laser ablating material layers, the ablating by a laser beam with a centrally peaked spatial power profile to form an ablated trench in the substrate below thin film device layers which is positively sloped. In an embodiment, a femtosecond laser forms a positively sloped ablation profile which facilitates vertically-oriented propagation of microcracks in the substrate at the ablated trench bottom. With minimal lateral runout of microcracks, a subsequent anisotropic plasma etch removes the microcracks for a cleanly singulated chip with good reliability.
摘要翻译：通过激光划线和等离子体蚀刻对基板进行切割的方法和装置。一种方法包括激光烧蚀材料层，用具有中心峰值空间功率分布的激光束进行烧蚀，以在正向倾斜的薄膜器件层下面的衬底中形成消融沟槽。在一个实施例中，飞秒激光形成正倾斜的消融轮廓，其有助于在烧蚀的沟槽底部处的衬底中的微裂纹的垂直定向传播。随着微裂纹的侧向跳动最小，随后的各向异性等离子体蚀刻可以清除具有良好可靠性的干净分割芯片的微裂纹。

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