会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • 半导体集成电路器件的制造方法
    • US20090035945A1
    • 2009-02-05
    • US12180514
    • 2008-07-25
    • Kazuyuki FUJIIMinoru HanazakiGen KawaharadaMasakazu TakiMutsumi Tsuda
    • Kazuyuki FUJIIMinoru HanazakiGen KawaharadaMasakazu TakiMutsumi Tsuda
    • H01L21/30C25F5/00
    • H01L21/67069C23C16/4405C23C16/52H01J37/32357H01J37/32862H01J37/32963
    • In remote plasma cleaning, it is difficult to locally excite a plasma because the condition is not suitable for plasma excitation different from that at the time of film formation and a method using light has a problem of fogginess of a detection window that cannot be avoided in a CVD process and is not suitable for a mass production process. In order to solve these problems, the outline of the present invention is a manufacturing method of a semiconductor integrated circuit device in which a step of depositing a desired film by exciting a reaction gas using a plasma in a reaction chamber and a step of introducing a cleaning gas excited in a remote plasma excitation chamber into the reaction chamber and performing remote plasma cleaning of the reaction chamber in an atmosphere without plasma excitation are repeated, wherein a local plasma is generated in the reaction chamber or a vacuum system for evacuating the reaction chamber by a plasma excitation system of capacitively coupled type and the end point of the remote plasma cleaning is detected by monitoring the electrical characteristic of the plasma.
    • 在远程等离子体清洗中,由于条件不适合与成膜时不同的等离子体激发,因此难以局部激发等离子体,使用光的方法存在无法避免的检测窗的雾化问题 CVD工艺,不适合大批量生产。 为了解决这些问题,本发明的概述是一种半导体集成电路器件的制造方法,其中通过在反应室中使用等离子体激发反应气体来沉积所需的膜的步骤,以及引入 在远程等离子体激发室中被激发到反应室中并且在没有等离子体激发的气氛中进行反应室的远程等离子体清洗的清洁气体被重复,其中在反应室中产生局部等离子体或用于抽空反应室的真空系统 通过电容耦合型等离子体激发系统,通过监测等离子体的电气特性来检测远程等离子体清洗的终点。
    • 6. 发明授权
    • Apparatus for forming thin film and method of manufacturing semiconductor film
    • 用于形成薄膜的装置和制造半导体膜的方法
    • US08053254B2
    • 2011-11-08
    • US12994343
    • 2009-05-14
    • Mutsumi TsudaMasakazu Taki
    • Mutsumi TsudaMasakazu Taki
    • H01L21/00
    • H01L21/0262C23C16/24C23C16/45523C23C16/515H01L21/02532H01L31/202Y02E10/50Y02P70/521
    • An apparatus including a vacuum chamber having a substrate holding unit that holds a substrate and a plasma electrode facing the substrate, a first gas supply unit that supplies a H2 gas to the vacuum chamber at a constant flow rate, a second gas supply unit that opens or closes a valve to turn on or off the supply of a SiH4 gas, a high-frequency power source that applies a high frequency voltage to the plasma electrode, a shield box that is connected to a ground so as to surround the plasma electrode outside the vacuum chamber, and a control unit that controls the valve such that the SiH4 gas is periodically supplied to the vacuum chamber and modulates the amplitude of high frequency power in synchronization with the opening or closing of the valve, and the valve is provided in the shield box.
    • 一种包括具有保持基板的基板保持单元和面向基板的等离子体电极的真空室的设备,以恒定流量向真空室供给H2气体的第一气体供给单元,打开的第二气体供给单元 或关闭阀门以接通或关闭向等离子体电极施加高频电压的高频电源的SiH 4气体的供给,连接到地面以围绕等离子体电极外部的屏蔽盒 真空室和控制单元,其控制阀,使得SiH4气体周期性地供给到真空室,并且与阀的打开或关闭同步地调制高频功率的振幅,并且阀设置在 屏蔽盒。
    • 8. 发明授权
    • Apparatus for forming thin film and method of manufacturing semiconductor film
    • 用于形成薄膜的装置和制造半导体膜的方法
    • US08474403B2
    • 2013-07-02
    • US13237001
    • 2011-09-20
    • Mutsumi TsudaMasakazu Taki
    • Mutsumi TsudaMasakazu Taki
    • C23C16/00
    • H01L21/0262C23C16/24C23C16/45523C23C16/515H01L21/02532H01L31/202Y02E10/50Y02P70/521
    • An apparatus including a vacuum chamber having a substrate holding unit that holds a substrate and a plasma electrode facing the substrate, a first gas supply unit that supplies a H2 gas to the vacuum chamber at a constant flow rate, a second gas supply unit that opens or closes a valve to turn on or off the supply of a SiH4 gas, a high-frequency power source that applies a high frequency voltage to the plasma electrode, a shield box that is connected to a ground so as to surround the plasma electrode outside the vacuum chamber, and a control unit that controls the valve such that the SiH4 gas is periodically supplied to the vacuum chamber and modulates the amplitude of high frequency power in synchronization with the opening or closing of the valve, and the valve is provided in the shield box.
    • 一种包括具有保持基板的基板保持单元和面向基板的等离子体电极的真空室的设备,以恒定流量向真空室供给H2气体的第一气体供给单元,打开的第二气体供给单元 或关闭阀门以接通或关闭向等离子体电极施加高频电压的高频电源的SiH 4气体的供给,连接到地面以围绕等离子体电极外部的屏蔽盒 真空室和控制单元,其控制阀,使得SiH4气体周期性地供给到真空室,并且与阀的打开或关闭同步地调制高频功率的振幅,并且阀设置在 屏蔽盒。
    • 10. 发明授权
    • Manufacturing method of semiconductor integrated circuit device
    • 半导体集成电路器件的制造方法
    • US07790478B2
    • 2010-09-07
    • US12180514
    • 2008-07-25
    • Kazuyuki FujiiMinoru HanazakiGen KawaharadaMasakazu TakiMutsumi Tsuda
    • Kazuyuki FujiiMinoru HanazakiGen KawaharadaMasakazu TakiMutsumi Tsuda
    • H01L21/66
    • H01L21/67069C23C16/4405C23C16/52H01J37/32357H01J37/32862H01J37/32963
    • In remote plasma cleaning, it is difficult to locally excite a plasma because the condition is not suitable for plasma excitation different from that at the time of film formation and a method using light has a problem of fogginess of a detection window that cannot be avoided in a CVD process and is not suitable for a mass production process. In order to solve these problems, the outline of the present invention is a manufacturing method of a semiconductor integrated circuit device in which a step of depositing a desired film by exciting a reaction gas using a plasma in a reaction chamber and a step of introducing a cleaning gas excited in a remote plasma excitation chamber into the reaction chamber and performing remote plasma cleaning of the reaction chamber in an atmosphere without plasma excitation are repeated, wherein a local plasma is generated in the reaction chamber or a vacuum system for evacuating the reaction chamber by a plasma excitation system of capacitively coupled type and the end point of the remote plasma cleaning is detected by monitoring the electrical characteristic of the plasma.
    • 在远程等离子体清洗中,由于条件不适合与成膜时不同的等离子体激发,因此难以局部激发等离子体,使用光的方法存在无法避免的检测窗的雾化问题 CVD工艺,不适合大批量生产。 为了解决这些问题,本发明的概述是一种半导体集成电路器件的制造方法,其中通过在反应室中使用等离子体激发反应气体来沉积所需的膜的步骤,以及引入 在远程等离子体激发室中被激发到反应室中并且在没有等离子体激发的气氛中进行反应室的远程等离子体清洗的清洁气体被重复,其中在反应室中产生局部等离子体或用于抽空反应室的真空系统 通过电容耦合型等离子体激发系统,通过监测等离子体的电气特性来检测远程等离子体清洗的终点。