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    • 1. 发明授权
    • Plasma processing apparatus
    • 等离子体处理装置
    • US09583314B2
    • 2017-02-28
    • US14846739
    • 2015-09-05
    • Hitachi High-Technologies Corporation
    • Hitoshi Tamura
    • H01J7/24H01J37/32H01J37/02H01P5/103
    • H01J37/32229H01J37/02H01J37/32256H01J37/32293H01J37/32311H01P5/103
    • Provided is a plasma processing apparatus including: a circular waveguide connected with a vacuum vessel, and through which a circularly polarized wave of an electric field for plasma formation propagates; a processing chamber which is arranged below the circular waveguide, and in which plasma is formed; a circularly polarized wave generator, which is arranged in the waveguide; a circularly polarized wave adjuster which is connected with the circular waveguide below the circularly polarized wave generator; a circularly polarized wave detector which is below the circularly polarized wave adjuster; and a controller which adjusts an operation of the circularly polarized wave adjuster according to an output from the circularly polarized wave detector, in which the circularly polarized wave adjuster adjusts a length of a protrusion of a dielectric stub into the circular waveguide based on a signal from the controller.
    • 提供一种等离子体处理装置,包括:与真空容器连接的圆形波导,用于等离子体生成的电场的圆极化波通过该波导传播; 处理室,其设置在所述圆形波导的下方,形成有等离子体; 圆偏振波发生器,布置在波导中; 圆偏振波调节器,与圆偏振波发生器下方的圆形波导连接; 在圆偏振波调节器下面的圆偏振波检测器; 以及根据圆偏振波检测器的输出调节圆偏振波调节器的操作的控制器,其中圆偏振波调节器基于来自圆偏振波检测器的信号将电介质短截线的突起的长度调节到圆形波导中 控制器。
    • 5. 发明授权
    • Process and apparatus for plasma CVD coating or plasma treating
substrates
    • 等离子体CVD涂层或等离子体处理基板的工艺和装置
    • US5250328A
    • 1993-10-05
    • US875763
    • 1992-04-29
    • Jurgen Otto
    • Jurgen Otto
    • C23C16/50C23C4/00C23C16/511H01J37/32H01L21/31B05D3/06B05D3/02
    • H01J37/32229C23C16/511H01J37/32192H01J37/32293
    • To provide large-surface substrates economically and in a short time, with coatings which are to be more impenetrable and more homogeneous than conventionally produced coatings, a plasma CVD process is employed in which a reaction gas capable of depositing a coating material therefrom flows over the surface to be coated and the reaction gas is excited into a band-shaped plasma by microwaves fed from two microwave feeds, in a device comprising end walls (2, 3) and a waveguide (1) with a square cross-section in which two standing waves polarized perpendicular to one another are excited and are shifted relative to one another by one-quarter wavelength, the coupling of the microwaves to the plasma being performed by a lengthwise slit (6) made in one of the edges of waveguide (1), with two crossed microwave polarizers (4, 5) being positioned in waveguide (1), such that each polarizer can be penetrated by the microwaves from the feed (7, 8) adjacent thereto and cannot be penetrated by the microwaves from the feed (7, 8) not proximate thereto, with the distance between an end wall (2, 3 ) and the polarizer (4, 5) proximate thereto being selected so as to form standing waves.
    • 为了在经济上和短时间内提供大表面基材,使用比常规制备的涂层更难以穿透和更均匀的涂层,采用等离子体CVD方法,其中能够沉积涂层材料的反应气体流过 待包被的表面,并且通过从两个微波进料馈送的微波将反应气体激发到带状等离子体中,在包括端壁(2,3)和具有正方形横截面的波导(1)的装置中,其中两个 被相互垂直偏振的驻波被激发并且相对于彼此相移四分之一波长,微波与等离子体的耦合由在波导(1)的一个边缘中制成的纵向狭缝(6)进行, ,两个交叉的微波偏振器(4,5)位于波导(1)中,使得每个偏振器可以被来自与其相邻的进给(7,8)的微波穿透,并且不能被mi 来自不靠近其的进料(7,8)的开口,其中选择端壁(2,3)和邻近其的偏振器(4,5)之间的距离以形成驻波。
    • 6. 发明授权
    • Method and apparatus for coupling a microwave source in an electron
cyclotron resonance system
    • 用于在电子回旋共振系统中耦合微波源的方法和装置
    • US5111111A
    • 1992-05-05
    • US589078
    • 1990-09-27
    • James E. StevensJoseph L. CecchiPatrick L. Colestock
    • James E. StevensJoseph L. CecchiPatrick L. Colestock
    • H01J37/32H05H7/02
    • H01J37/32238H01J37/32192H01J37/32284H01J37/32293H01J37/32678H05H7/02
    • A microwave source is coupled to an electron cyclotron resonance (ECR) system by circularly polarizing the microwave energy from the source in an angular direction with cooperates with the ECR system's magnetic field to produce electron cyclotron resonance, and coupling the circularly polarized microwave energy to the plasma using a quarter wave vacuum window transformer having a dielectric constant which matches the impedance of the circularly polarized microwave energy to the impedance of the plasma. The impedance matching transformer is preferably a vacuum window of the ECR chamber having quarter wave thickness and the appropriate dielectric constant. For high density plasmas in a standard ECR system of 6 cm radius an alumina window 0.98 cm thick procides optimum coupling. The reflected power from the plasma is thereby minimized to provide a dense plasma for the ECR tool while reducing or eliminating the need for manual external tuners for the microwave source.
    • 微波源耦合到电子回旋共振(ECR)系统,通过与ECR系统的磁场配合来使来自源的微波能量在角度方向上圆偏振以产生电子回旋共振,并将圆偏振的微波能量耦合到 使用具有与圆偏振微波能量的阻抗匹配等离子体的阻抗的介电常数的四分之一波真空窗变压器的等离子体。 阻抗匹配变压器优选地是具有四分之一波长厚度和适当介电常数的ECR室的真空窗。 对于6厘米半径的标准ECR系统中的高密度等离子体,氧化铝窗口0.98厘米厚可以实现最佳耦合。 因此,来自等离子体的反射功率被最小化以为ECR工具提供致密的等离子体,同时减少或消除对用于微波源的手动外部调谐器的需要。
    • 7. 发明授权
    • Semiconductor wafer treating apparatus utilizing a plasma
    • 利用等离子体的半导体晶片处理装置
    • US4877509A
    • 1989-10-31
    • US269688
    • 1988-11-10
    • Toshiaki OgawaNobuo FujiwaraKenji KawaiTeruo ShibanoHiroshi MoritaKyusaku Nishioka
    • Toshiaki OgawaNobuo FujiwaraKenji KawaiTeruo ShibanoHiroshi MoritaKyusaku Nishioka
    • H01L21/302C23C16/511H01J37/32H01L21/205H01L21/3065H01L21/31
    • H01J37/32293C23C16/511H01J37/32192H01J37/32678
    • An apparatus for treating semiconductor wafers utilizing a plasma generated by electron cyclotron resonance (ECR) is disclosed in which a microwave is supplied to a plasma generating chamber via a rectangular waveguide, a rectangular-to-circular microwave converter, and a circular polarization converter. The polarization converter may comprise a phase shift plate of a dielectric material or an electrically conductive material disposed in a circular waveguide in the form of a metallic cylinder. The polarization converter transforms a circular TE.sub.11 mode microwave supplied from the rectangular-to-circular microwave converter to a circularly polarized one by rotating the direction of the electric field of the microwave in the TE.sub.11 mode one complete turn in one period of the microwave. Thus, the electric field strength of the microwave supplied to the plasma generating chamber is averaged over the time along the circumferential direction in the plasma generating chamber to make the density of plasma generation therein spatially uniform. The spatially uniformly distributed plasma generated in the plasma generating chamber is conveyed to the wafer in the wafer treating chamber to effect a treatment of the wafer.
    • 公开了一种利用电子回旋共振(ECR)产生的等离子体处理半导体晶片的装置,其中通过矩形波导,矩形到圆形微波转换器和圆偏振转换器将微波提供给等离子体发生室。 偏振转换器可以包括介电材料的相移板或设置在金属圆筒形状的圆形波导中的导电材料。 在微波的一个周期内,通过在TE11模式一周内旋转微波的电场方向,将由矩形到圆形的微波转换器提供的循环TE11模式的微波变换成圆偏振的微波。 因此,供给到等离子体发生室的微波的电场强度在等离子体发生室中沿着圆周方向的时间平均化,使得其中等离子体产生的密度在空间上均匀。 在等离子体发生室中产生的空间均匀分布的等离子体被输送到晶片处理室中的晶片,以对晶片进行处理。