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1. 发明授权

US07832098B2 Method of manufacturing a multilayered printed circuit board 有权
标题翻译：制造多层印刷电路板的方法
公开(公告)号：US07832098B2
公开(公告)日：2010-11-16
申请号：US12098582
申请日：2008-04-07
申请人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
发明人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
IPC分类号： H01K3/10
CPC分类号： H05K3/4652 , B23K26/389 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K1/0201 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/0055 , H05K3/0094 , H05K3/108 , H05K3/28 , H05K3/381 , H05K3/383 , H05K3/384 , H05K3/427 , H05K3/4602 , H05K3/4623 , H05K3/4661 , H05K2201/0195 , H05K2201/0352 , H05K2201/0358 , H05K2201/062 , H05K2201/09536 , H05K2201/0959 , H05K2201/09827 , H05K2201/09863 , H05K2201/09881 , H05K2203/0307 , H05K2203/0353 , H05K2203/0554 , H05K2203/0773 , H05K2203/107 , H05K2203/121 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.
摘要翻译：通过激光束在树脂20中形成开口，从而形成通孔。此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。因此，可以提高通孔连接的可靠性。

2. 再颁专利

USRE40947E1 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole 失效
公开(公告)号：USRE40947E1
公开(公告)日：2009-10-27
申请号：US10829479
申请日：1990-10-12
申请人： Motoo Asai , Kenichi Shimada , Kouta Noda , Takashi Kariya , Hiroshi Segawa
发明人： Motoo Asai , Kenichi Shimada , Kouta Noda , Takashi Kariya , Hiroshi Segawa
IPC分类号： B32B3/00
CPC分类号： B32B3/00 , H05K3/0094 , H05K3/383 , H05K3/384 , H05K3/385 , H05K3/4069 , H05K3/4602 , H05K2201/0209 , H05K2201/0212 , H05K2201/0215 , H05K2201/0257 , H05K2201/0347 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , Y10S428/901 , Y10T428/24917
摘要： A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being filled with a filler, an exposed part of the filler in the through-holes being covered with a through-hole-covering conductor layer, and a viahole formed just thereabove being connected to the through-hole-covering conductor layer. Without peeling between the through-holes and the filler, this wiring board has a satisfactory connection reliability between the through-holes and the internal layer circuit and provides a high density wiring.

3. 发明授权

US07230188B1 Printed wiring board and its manufacturing method 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US07230188B1
公开(公告)日：2007-06-12
申请号：US09787139
申请日：1999-09-14
申请人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
发明人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
IPC分类号： H01R12/04 , H05K1/09 , H05K1/11
CPC分类号： H05K3/4644 , C23C18/1607 , C23C18/1653 , C23C18/22 , C23C18/30 , C23C18/34 , C23C18/405 , C23C28/00 , C23C28/023 , C23C28/42 , C25D3/38 , C25D5/022 , C25D5/18 , C25D5/34 , C25D7/123 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/241 , H05K3/381 , H05K3/382 , H05K3/384 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K3/4661 , H05K2201/0215 , H05K2201/0344 , H05K2201/0347 , H05K2201/09509 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0353 , H05K2203/0723 , H05K2203/1476 , H05K2203/1492 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.
摘要翻译：本发明的目的是提供一种制造多层印刷电路板的方法，其能够同时通孔填充和形成导体电路，并且可以在基板和高密度布线上构造具有良好结晶度和均匀沉积的通孔并且可以实现高可靠性的导体连接而不退火。本发明涉及一种多层印刷电路板的制造方法，其特征在于，在形成有导体电路的基板上设置层间树脂绝缘层，在所述层间树脂绝缘层上形成用于形成通孔的开口，形成无电镀金属层，在其上设置抗蚀剂，进行电镀，剥离抗蚀剂并蚀刻无电镀金属层以提供导体电路和通孔，其中使用所述无电镀金属层作为阴极间歇地进行电镀以及在所述阳极和所述阴极之间的恒定电压下的电镀金属作为阳极。

4. 发明申请

US20070013049A1 Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same 有权
标题翻译：用于印刷线路板的层间绝缘层，印刷线路板及其制造方法
公开(公告)号：US20070013049A1
公开(公告)日：2007-01-18
申请号：US10557206
申请日：2004-09-29
申请人： Motoo Asai , Kouta Noda , Yasushi Inagaki
发明人： Motoo Asai , Kouta Noda , Yasushi Inagaki
IPC分类号： H01L23/24
CPC分类号： H01L23/145 , H01L23/49822 , H01L23/49827 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/12044 , H01L2924/15311 , H01L2924/3011 , H05K3/005 , H05K3/045 , H05K3/107 , H05K3/381 , H05K3/4602 , H05K3/465 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2201/0245 , H05K2201/09036 , H05K2203/0108 , H05K2203/1152 , H05K2203/1189 , Y10T428/25 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A printed wiring board is provided which includes an interlayer dielectric layer formed on a substrate from a curable resin having flaky particles dispersed therein. The printed wiring board is excellent in cooling/heating cycle resistance and packaging reliability while maintaining a satisfactory heat resistance, electrical insulation, heat liberation, connection reliability and chemical stability. Also a method of producing a printed wiring board is proposed in which an imprint method using a mold having formed thereon convexities corresponding to wiring patterns and viaholes to be formed being buried in an interlayer dielectric layer is used to form the wiring patterns and viaholes by transcribing the concavities of the mold to the interlayer dielectric layer. The imprint method permits to form the wiring patterns and viaholes but assures an easy and accurate transcription without any optical transcription or complicated etching. Thus, a multilayer printed wiring board excellent in insulation reliability and interlayer connection and having fine wiring patterns formed therein can be mass-produced extremely easily and inexpensively.
摘要翻译：提供一种印刷电路板，其包括由分散在其中的片状颗粒的可固化树脂形成在基板上的层间电介质层。印刷电路板在保持耐热性，电绝缘性，热释放性，连接可靠性和化学稳定性方面保持良好的冷/热循环阻力和包装可靠性。还提出了一种制造印刷电路板的方法，其中使用在其中形成有对应于要形成的布线图案和通孔的凸起的模具被埋在层间电介质层中的模具的压印方法用于通过转录形成布线图案和通孔模具与层间电介质层的凹部。压印方法允许形成布线图案和通孔，但确保容易且准确的转录，无需任何光学转录或复杂蚀刻。因此，绝缘可靠性和层间连接性优异，并且在其中形成的精细布线图案的多层印刷线路板可以极其容易且廉价地批量生产。

5. 发明授权

US06261671B1 Adhesive for electroless plating, feedstock composition for preparing adhesive for electroless plating, and printed wiring board 有权
标题翻译：用于化学镀的粘合剂，用于制备用于化学镀的粘合剂的原料组合物和印刷线路板
公开(公告)号：US06261671B1
公开(公告)日：2001-07-17
申请号：US09402475
申请日：1999-10-12
申请人： Motoo Asai , Yoshitaka Ono , Masato Kawade , Kouta Noda , Youko Nishiwaki
发明人： Motoo Asai , Yoshitaka Ono , Masato Kawade , Kouta Noda , Youko Nishiwaki
IPC分类号： B32B300
CPC分类号： H05K3/4676 , C23C18/1608 , C23C18/1651 , C23C18/1653 , C23C18/1844 , C23C18/24 , C23C18/405 , C23C18/50 , C23C18/54 , H05K3/4673 , H05K2201/0212 , H05K2201/0269 , H05K2203/0773 , Y10S428/901 , Y10T428/24893 , Y10T428/24917
摘要： The adhesive for electroless plating which is advantageous to ensure insulation reliabilities between lines and between layers while maintaining a practical peel strength, and the printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 1.5 &mgr;m.
摘要翻译：公开了用于化学镀的粘合剂，其有利于确保线间和层之间的绝缘可靠性同时保持实用的剥离强度，并且使用粘合剂的印刷电路板。粘合剂通过将可溶于酸或氧化剂的固化的耐热树脂颗粒通过固化处理分解为难溶于酸或氧化剂的未固化的耐热树脂基体而形成，其中耐热树脂颗粒的平均粒径为不超过1.5个妈妈。

6. 发明授权

US08148643B2 Multilayered printed circuit board and manufacturing method thereof 有权
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US08148643B2
公开(公告)日：2012-04-03
申请号：US11875486
申请日：2007-10-19
申请人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
发明人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
IPC分类号： H05K1/03
CPC分类号： H05K3/4652 , B23K26/389 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K1/0201 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/0055 , H05K3/0094 , H05K3/108 , H05K3/28 , H05K3/381 , H05K3/383 , H05K3/384 , H05K3/427 , H05K3/4602 , H05K3/4623 , H05K3/4661 , H05K2201/0195 , H05K2201/0352 , H05K2201/0358 , H05K2201/062 , H05K2201/09536 , H05K2201/0959 , H05K2201/09827 , H05K2201/09863 , H05K2201/09881 , H05K2203/0307 , H05K2203/0353 , H05K2203/0554 , H05K2203/0773 , H05K2203/107 , H05K2203/121 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.
摘要翻译：通过激光束在树脂20中形成开口，从而形成通孔。此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。因此，可以提高通孔连接的可靠性。

7. 发明授权

US08065794B2 Printed wiring board and its manufacturing method 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US08065794B2
公开(公告)日：2011-11-29
申请号：US12239306
申请日：2008-09-26
申请人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
发明人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
IPC分类号： H05K3/02 , H01K3/22
CPC分类号： H05K3/4644 , C23C18/1607 , C23C18/1653 , C23C18/22 , C23C18/30 , C23C18/34 , C23C18/405 , C23C28/00 , C23C28/023 , C23C28/42 , C25D3/38 , C25D5/022 , C25D5/18 , C25D5/34 , C25D7/123 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/241 , H05K3/381 , H05K3/382 , H05K3/384 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K3/4661 , H05K2201/0215 , H05K2201/0344 , H05K2201/0347 , H05K2201/09509 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0353 , H05K2203/0723 , H05K2203/1476 , H05K2203/1492 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing. The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.
摘要翻译：本发明的目的是提供一种制造多层印刷电路板的方法，其能够同时通孔填充和形成导体电路，并且可以在基板和高密度布线上构造具有良好结晶度和均匀沉积的通孔并且可以实现高可靠性的导体连接而不退火。本发明涉及一种多层印刷电路板的制造方法，其特征在于，在形成有导体电路的基板上设置层间树脂绝缘层，在所述层间树脂绝缘层上形成用于形成通孔的开口，形成无电镀金属层，在其上设置抗蚀剂，进行电镀，剥离抗蚀剂并蚀刻无电镀金属层以提供导体电路和通孔，其中使用所述无电镀金属层作为阴极间歇地进行电镀以及在所述阳极和所述阴极之间的恒定电压下的电镀金属作为阳极。

8. 发明申请

US20090145652A1 PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20090145652A1
公开(公告)日：2009-06-11
申请号：US12239306
申请日：2008-09-26
申请人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
发明人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
IPC分类号： C23C18/31 , C25D5/00 , H01B13/00 , B05D5/12 , C09D5/10
CPC分类号： H05K3/4644 , C23C18/1607 , C23C18/1653 , C23C18/22 , C23C18/30 , C23C18/34 , C23C18/405 , C23C28/00 , C23C28/023 , C23C28/42 , C25D3/38 , C25D5/022 , C25D5/18 , C25D5/34 , C25D7/123 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/241 , H05K3/381 , H05K3/382 , H05K3/384 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K3/4661 , H05K2201/0215 , H05K2201/0344 , H05K2201/0347 , H05K2201/09509 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0353 , H05K2203/0723 , H05K2203/1476 , H05K2203/1492 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.
摘要翻译：本发明的目的是提供一种制造多层印刷电路板的方法，其能够同时通孔填充和形成导体电路，并且可以在基板和高密度布线上构造具有良好结晶度和均匀沉积的通孔并且可以实现高可靠性的导体连接而不退火。本发明涉及一种多层印刷电路板的制造方法，其特征在于，在形成有导体电路的基板上设置层间树脂绝缘层，在所述层间树脂绝缘层上形成用于形成通孔的开口，形成无电镀金属层，在其上设置抗蚀剂，进行电镀，剥离抗蚀剂并蚀刻无电镀金属层以提供导体电路和通孔，其中使用所述无电镀金属层作为阴极间歇地进行电镀以及在所述阳极和所述阴极之间的恒定电压下的电镀金属作为阳极。

9. 发明申请

US20080023815A1 INTERLAYER DIELECTRIC LAYER FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHOD OF PRODUCING THE SAME 审中-公开
标题翻译：印刷电路板用印刷电介质层，印刷线路板及其制造方法
公开(公告)号：US20080023815A1
公开(公告)日：2008-01-31
申请号：US11858942
申请日：2007-09-21
申请人： Motoo ASAI , Kouta Noda , Yasushi Inagaki
发明人： Motoo ASAI , Kouta Noda , Yasushi Inagaki
IPC分类号： H01L23/24
CPC分类号： H01L23/145 , H01L23/49822 , H01L23/49827 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H01L2924/12044 , H01L2924/15311 , H01L2924/3011 , H05K3/005 , H05K3/045 , H05K3/107 , H05K3/381 , H05K3/4602 , H05K3/465 , H05K3/4661 , H05K2201/0209 , H05K2201/0212 , H05K2201/0245 , H05K2201/09036 , H05K2203/0108 , H05K2203/1152 , H05K2203/1189 , Y10T428/25 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A printed wiring board including a substrate, conductor circuits and interlayer dielectric layers stacked alternately on the substrate, each of the interlayer dielectric layers including a curable resin having flaky particles dispersed therein, and viaholes formed in the interlayer dielectric layers and electrically connecting the conductor circuits at different levels.
摘要翻译：一种印刷电路板，包括基板，导体电路和层间电介质层，层叠电介质层交替地堆叠在基板上，每个层间介电层包括其中分散有片状颗粒的固化树脂，以及形成在层间电介质层中的通孔，并将导体电路在不同层次上

10. 发明授权

US06762921B1 Multilayer printed-circuit board and method of manufacture 有权
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US06762921B1
公开(公告)日：2004-07-13
申请号：US09926476
申请日：2001-11-09
申请人： Motoo Asai , Kouta Noda , Takashi Kariya
发明人： Motoo Asai , Kouta Noda , Takashi Kariya
IPC分类号： H02H322
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/381 , H05K3/383 , H05K3/384 , H05K3/385 , H05K3/421 , H05K2201/0195 , H05K2201/09509 , Y10T428/24273
摘要： This invention is to propose a technique of producing a printed wiring board having an excellent adhesion property between an electroless plated film and an electrolytic plated film constituting a conductor circuit through a semi-additive process without causing the peeling of a plating resist and is a printed wiring board comprising conductor circuits formed on a roughened surface of an insulating layer, in which the conductor circuit is constituted with an electroless plated film at the side of the insulating layer and an electrolytic plated film at the opposite side and the electroless plated film located at the side of the insulating layer is formed so as to follow to the roughened surface of the insulating layer. This printed wiring board is produced by a semi-additive method wherein the electroless plated film is formed on the roughened surface of the insulating layer so as to follow to the roughened surface of the insulating layer.
摘要翻译：本发明提出一种制造印刷电路板的技术，该印刷电路板在不引起电镀抗蚀剂剥离的情况下，通过半添加工艺，在化学镀膜和构成导体电路的电解电镀膜之间具有优异的粘合性，并且是印刷布线板包括形成在绝缘层的粗糙表面上的导体电路，其中导体电路由绝缘层侧面的无电解电镀膜和位于绝缘层侧面的电镀电镀膜和位于绝缘层的一侧形成为与绝缘层的粗糙化表面相邻。该印刷电路板是通过半附加法制造的，其中无电镀膜形成在绝缘层的粗糙化表面上，以便遵循绝缘层的粗糙化表面。

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